DE3381336D1 - Verfahren zur herstellung einer passivierungsschicht auf einer photoelektrischen umwandlungsanordnung. - Google Patents

Verfahren zur herstellung einer passivierungsschicht auf einer photoelektrischen umwandlungsanordnung.

Info

Publication number
DE3381336D1
DE3381336D1 DE8383113268T DE3381336T DE3381336D1 DE 3381336 D1 DE3381336 D1 DE 3381336D1 DE 8383113268 T DE8383113268 T DE 8383113268T DE 3381336 T DE3381336 T DE 3381336T DE 3381336 D1 DE3381336 D1 DE 3381336D1
Authority
DE
Germany
Prior art keywords
producing
photoelectric conversion
passivation layer
conversion arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8383113268T
Other languages
English (en)
Inventor
Ltd Hamano
Ltd Nakamura
Ltd Fuse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Application granted granted Critical
Publication of DE3381336D1 publication Critical patent/DE3381336D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1868—Passivation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/3143—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers
    • H01L21/3145—Inorganic layers composed of alternated layers or of mixtures of nitrides and oxides or of oxinitrides, e.g. formation of oxinitride by oxidation of nitride layers formed by deposition from a gas or vapour
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/095—Devices sensitive to infrared, visible or ultraviolet radiation comprising amorphous semiconductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Formation Of Insulating Films (AREA)
DE8383113268T 1983-02-03 1983-12-31 Verfahren zur herstellung einer passivierungsschicht auf einer photoelektrischen umwandlungsanordnung. Expired - Lifetime DE3381336D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016740A JPS59143362A (ja) 1983-02-03 1983-02-03 パツシベ−シヨン膜

Publications (1)

Publication Number Publication Date
DE3381336D1 true DE3381336D1 (de) 1990-04-19

Family

ID=11924660

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383113268T Expired - Lifetime DE3381336D1 (de) 1983-02-03 1983-12-31 Verfahren zur herstellung einer passivierungsschicht auf einer photoelektrischen umwandlungsanordnung.

Country Status (4)

Country Link
US (1) US4587171A (de)
EP (1) EP0115645B1 (de)
JP (1) JPS59143362A (de)
DE (1) DE3381336D1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752718B2 (ja) * 1984-11-26 1995-06-05 株式会社半導体エネルギー研究所 薄膜形成方法
US6786997B1 (en) 1984-11-26 2004-09-07 Semiconductor Energy Laboratory Co., Ltd. Plasma processing apparatus
JPS61171161A (ja) * 1985-01-25 1986-08-01 Hitachi Ltd 一次元イメ−ジセンサ
US4721631A (en) * 1985-02-14 1988-01-26 Sharp Kabushiki Kaisha Method of manufacturing thin-film electroluminescent display panel
US4659585A (en) * 1985-06-24 1987-04-21 International Business Machines Corporation Planarized ceramic substrates
JPH0715980B2 (ja) * 1985-09-24 1995-02-22 株式会社日立製作所 受光素子
JPH0712078B2 (ja) * 1985-10-23 1995-02-08 株式会社日立製作所 受光素子の製造方法
JPH01186627A (ja) * 1988-01-14 1989-07-26 Rohm Co Ltd 半導体素子のパシベーション膜作成方法
US5318857A (en) * 1989-11-06 1994-06-07 Dow Corning Corporation Low temperature ozonolysis of silicon and ceramic oxide precursor polymers to ceramic coatings
US5215928A (en) * 1990-09-07 1993-06-01 Sony Corporation Method of manufacturing a semiconductor device for optical pick-up
JP2861340B2 (ja) * 1990-09-07 1999-02-24 ソニー株式会社 半導体装置
JP3154772B2 (ja) * 1991-06-20 2001-04-09 株式会社東芝 シリコン薄膜
US5286518A (en) * 1992-04-30 1994-02-15 Vlsi Technology, Inc. Integrated-circuit processing with progressive intermetal-dielectric deposition
US5508091A (en) * 1992-12-04 1996-04-16 Photran Corporation Transparent electrodes for liquid cells and liquid crystal displays
US6652922B1 (en) * 1995-06-15 2003-11-25 Alliedsignal Inc. Electron-beam processed films for microelectronics structures
US6315188B1 (en) * 2000-06-28 2001-11-13 Sandia Corporation Surface preparation for high purity alumina ceramics enabling direct brazing in hydrogen atmospheres
US6587097B1 (en) 2000-11-28 2003-07-01 3M Innovative Properties Co. Display system
US7597964B2 (en) * 2005-08-02 2009-10-06 Guardian Industries Corp. Thermally tempered coated article with transparent conductive oxide (TCO) coating
US20070193624A1 (en) * 2006-02-23 2007-08-23 Guardian Industries Corp. Indium zinc oxide based front contact for photovoltaic device and method of making same
KR20110062598A (ko) * 2009-12-03 2011-06-10 삼성전자주식회사 적층막 제조방법, 이를 이용한 태양전지의 제조방법
US20150097268A1 (en) * 2013-10-07 2015-04-09 Xintec Inc. Inductor structure and manufacturing method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US413488A (en) * 1889-10-22 Frederick w
US3573096A (en) * 1965-06-23 1971-03-30 Sperry Rand Corp Silane method for making silicon nitride
JPS5824951B2 (ja) * 1974-10-09 1983-05-24 ソニー株式会社 コウガクソウチ
DE2557079C2 (de) * 1975-12-18 1984-05-24 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Herstellen einer Maskierungsschicht
JPS52104062A (en) * 1976-02-27 1977-09-01 Hitachi Ltd Production of surface protection film of electronic parts
US4253881A (en) * 1978-10-23 1981-03-03 Rudolf Hezel Solar cells composed of semiconductive materials
JPS5587443A (en) * 1978-12-26 1980-07-02 Fujitsu Ltd Semiconductor device
JPS55132077A (en) * 1979-03-31 1980-10-14 Dainippon Printing Co Ltd Manufacture of color solid image pickup element plate
US4268711A (en) * 1979-04-26 1981-05-19 Optical Coating Laboratory, Inc. Method and apparatus for forming films from vapors using a contained plasma source
JPS5643776A (en) * 1979-09-18 1981-04-22 Seiko Epson Corp Production of solar battery
JPS56157075A (en) * 1980-05-09 1981-12-04 Hitachi Ltd Photoelectric transducing device
US4410558A (en) * 1980-05-19 1983-10-18 Energy Conversion Devices, Inc. Continuous amorphous solar cell production system
JPS5753373A (en) * 1980-09-16 1982-03-30 Ricoh Co Ltd Input/output device
US4344985A (en) * 1981-03-27 1982-08-17 Rca Corporation Method of passivating a semiconductor device with a multi-layer passivant system by thermally growing a layer of oxide on an oxygen doped polycrystalline silicon layer
US4379943A (en) * 1981-12-14 1983-04-12 Energy Conversion Devices, Inc. Current enhanced photovoltaic device

Also Published As

Publication number Publication date
JPS59143362A (ja) 1984-08-16
JPH0582065B2 (de) 1993-11-17
US4587171A (en) 1986-05-06
EP0115645A3 (en) 1986-10-15
EP0115645A2 (de) 1984-08-15
EP0115645B1 (de) 1990-03-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee