DE3380241D1 - Semiconductor device having radiator - Google Patents

Semiconductor device having radiator

Info

Publication number
DE3380241D1
DE3380241D1 DE8383301736T DE3380241T DE3380241D1 DE 3380241 D1 DE3380241 D1 DE 3380241D1 DE 8383301736 T DE8383301736 T DE 8383301736T DE 3380241 T DE3380241 T DE 3380241T DE 3380241 D1 DE3380241 D1 DE 3380241D1
Authority
DE
Germany
Prior art keywords
radiator
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383301736T
Other languages
German (de)
English (en)
Inventor
Tetshushi Wakabayashi
Masahiro Sugimoto
Kiyoshi Muratake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3380241D1 publication Critical patent/DE3380241D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
DE8383301736T 1982-03-29 1983-03-28 Semiconductor device having radiator Expired DE3380241D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57050733A JPS58169943A (ja) 1982-03-29 1982-03-29 半導体装置

Publications (1)

Publication Number Publication Date
DE3380241D1 true DE3380241D1 (en) 1989-08-24

Family

ID=12867044

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383301736T Expired DE3380241D1 (en) 1982-03-29 1983-03-28 Semiconductor device having radiator

Country Status (5)

Country Link
US (1) US4688077A (https=)
EP (1) EP0090633B1 (https=)
JP (1) JPS58169943A (https=)
DE (1) DE3380241D1 (https=)
IE (1) IE54726B1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
US4887147A (en) * 1987-07-01 1989-12-12 Digital Equipment Corporation Thermal package for electronic components
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
EP0463758A1 (en) * 1990-06-22 1992-01-02 Digital Equipment Corporation Hollow chip package and method of manufacture
JPH06196587A (ja) * 1992-12-24 1994-07-15 Toshiba Corp 半導体装置
JPH076230U (ja) * 1993-06-29 1995-01-27 鶴夫 浅野 寝間着
US5646826A (en) * 1995-01-26 1997-07-08 Northern Telecom Limited Printed circuit board and heat sink arrangement
US5764484A (en) * 1996-11-15 1998-06-09 Olin Corporation Ground ring for a metal electronic package
WO1997019470A1 (en) * 1995-11-20 1997-05-29 Olin Corporation Ground ring for metal electronic package
US6326687B1 (en) * 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6633484B1 (en) 2000-11-20 2003-10-14 Intel Corporation Heat-dissipating devices, systems, and methods with small footprint
AU2002236552A1 (en) * 2000-11-20 2002-05-27 Intel Corporation High performance heat sink configurations for use in high density packaging applications
US6549411B1 (en) * 2000-12-20 2003-04-15 Edward Herbert Flexible heat sinks and method of attaching flexible heat sinks
US6479895B1 (en) * 2001-05-18 2002-11-12 Intel Corporation High performance air cooled heat sinks used in high density packaging applications
US6671172B2 (en) * 2001-09-10 2003-12-30 Intel Corporation Electronic assemblies with high capacity curved fin heat sinks
US6705144B2 (en) 2001-09-10 2004-03-16 Intel Corporation Manufacturing process for a radial fin heat sink
US6657862B2 (en) 2001-09-10 2003-12-02 Intel Corporation Radial folded fin heat sinks and methods of making and using same
US6622786B1 (en) 2002-04-17 2003-09-23 International Business Machines Corporation Heat sink structure with pyramidic and base-plate cut-outs
CN2676128Y (zh) * 2003-12-11 2005-02-02 东莞莫仕连接器有限公司 导热装置
DE102007056269A1 (de) * 2007-10-22 2009-04-23 Rohde & Schwarz Gmbh & Co. Kg Gekühltes Multichipmodul
US7845393B2 (en) * 2007-11-06 2010-12-07 Jiing Tung Tec. Metal Co., Ltd. Thermal module
TWI389272B (zh) * 2009-04-22 2013-03-11 台達電子工業股份有限公司 電子元件之散熱模組及其組裝方法
CN102612175A (zh) * 2012-03-30 2012-07-25 苏州苏海亚电气有限公司 温控加热器
CN102611016A (zh) * 2012-03-31 2012-07-25 苏州苏海亚电气有限公司 新型加热器
DE102013223461A1 (de) * 2013-11-18 2015-05-21 Rohde & Schwarz Gmbh & Co. Kg Kühlkörper zum Abtransport von Wärme
GB2598343B (en) * 2020-08-27 2022-11-30 Continental Automotive Romania Srl Circular heatsink

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2994017A (en) * 1956-09-07 1961-07-25 Int Rectifier Corp Air-cooled rectifier assembly
IT602174A (https=) * 1957-07-31
US3457988A (en) * 1967-05-15 1969-07-29 Westinghouse Electric Corp Integral heat sink for semiconductor devices
JPS53126276A (en) * 1977-04-11 1978-11-04 Nippon Telegr & Teleph Corp <Ntt> Heat dissipation construction of multichip mounting substrate
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
JPS5724021Y2 (https=) * 1978-07-14 1982-05-25
JPS5561049A (en) * 1978-10-31 1980-05-08 Furukawa Electric Co Ltd:The Radiator for semiconductor
US4292647A (en) * 1979-04-06 1981-09-29 Amdahl Corporation Semiconductor package and electronic array having improved heat dissipation
JPS56122149A (en) * 1980-02-29 1981-09-25 Fujitsu Ltd Heat dissipating structure for semiconductor device
EP0054597A1 (fr) * 1980-12-18 1982-06-30 International Business Machines Corporation Dispositif pour le refroidissement des broches de modules
EP0079238B1 (en) * 1981-11-10 1988-04-06 Fujitsu Limited Semiconductor devices provided with heat-dissipating means

Also Published As

Publication number Publication date
IE54726B1 (en) 1990-01-17
EP0090633A2 (en) 1983-10-05
EP0090633B1 (en) 1989-07-19
JPS6339106B2 (https=) 1988-08-03
US4688077A (en) 1987-08-18
EP0090633A3 (en) 1985-08-28
JPS58169943A (ja) 1983-10-06
IE830706L (en) 1983-09-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee