AU2002236552A1 - High performance heat sink configurations for use in high density packaging applications - Google Patents

High performance heat sink configurations for use in high density packaging applications

Info

Publication number
AU2002236552A1
AU2002236552A1 AU2002236552A AU3655202A AU2002236552A1 AU 2002236552 A1 AU2002236552 A1 AU 2002236552A1 AU 2002236552 A AU2002236552 A AU 2002236552A AU 3655202 A AU3655202 A AU 3655202A AU 2002236552 A1 AU2002236552 A1 AU 2002236552A1
Authority
AU
Australia
Prior art keywords
heat sink
packaging applications
performance heat
density packaging
high density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002236552A
Inventor
Seri Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/716,510 external-priority patent/US6633484B1/en
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2002236552A1 publication Critical patent/AU2002236552A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2002236552A 2000-11-20 2001-10-31 High performance heat sink configurations for use in high density packaging applications Abandoned AU2002236552A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/716,510 2000-11-20
US09/716,510 US6633484B1 (en) 2000-11-20 2000-11-20 Heat-dissipating devices, systems, and methods with small footprint
US09/766,757 US6535385B2 (en) 2000-11-20 2001-01-22 High performance heat sink configurations for use in high density packaging applications
US09/766,757 2001-01-22
PCT/US2001/045678 WO2002041396A2 (en) 2000-11-20 2001-10-31 High performance heat sink configurations for use in high density packaging applications

Publications (1)

Publication Number Publication Date
AU2002236552A1 true AU2002236552A1 (en) 2002-05-27

Family

ID=27109547

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002236552A Abandoned AU2002236552A1 (en) 2000-11-20 2001-10-31 High performance heat sink configurations for use in high density packaging applications

Country Status (5)

Country Link
US (1) US6845010B2 (en)
CN (1) CN1305131C (en)
AU (1) AU2002236552A1 (en)
MX (1) MXPA03004441A (en)
WO (1) WO2002041396A2 (en)

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US7359198B2 (en) * 2005-09-29 2008-04-15 Avago Technologies General Ip (Singapore) Pte. Ltd. System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry
US20090014154A1 (en) * 2005-11-09 2009-01-15 Tir Technology Lp Passive Thermal Management System
US8962306B2 (en) * 2006-09-08 2015-02-24 Thermo Fisher Scientific Oy Instruments and method relating to thermal cycling
TWI325046B (en) * 2006-12-01 2010-05-21 Delta Electronics Inc Heat dissipation module and flat heat column and heat dissipation apparatus thereof
US20080202729A1 (en) * 2007-02-27 2008-08-28 Fujikura Ltd. Heat sink
US7942194B2 (en) * 2007-04-10 2011-05-17 Fujikura Ltd. Heat sink
US10103081B2 (en) * 2014-09-08 2018-10-16 Ashwin Bharadwaj Heat sink
US9581322B2 (en) 2014-09-30 2017-02-28 Aeonovalite Technologies, Inc. Heat-sink for high bay LED device, high bay LED device and methods of use thereof
CN104834167A (en) * 2015-05-12 2015-08-12 苏州佳世达光电有限公司 Projection device
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
US10739832B2 (en) * 2018-10-12 2020-08-11 International Business Machines Corporation Airflow projection for heat transfer device

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Also Published As

Publication number Publication date
MXPA03004441A (en) 2005-01-25
US6845010B2 (en) 2005-01-18
CN1486508A (en) 2004-03-31
CN1305131C (en) 2007-03-14
WO2002041396A2 (en) 2002-05-23
WO2002041396A3 (en) 2002-08-29
US20030189813A1 (en) 2003-10-09

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