DE3276982D1 - Module for supporting electrical components - Google Patents

Module for supporting electrical components

Info

Publication number
DE3276982D1
DE3276982D1 DE8282110207T DE3276982T DE3276982D1 DE 3276982 D1 DE3276982 D1 DE 3276982D1 DE 8282110207 T DE8282110207 T DE 8282110207T DE 3276982 T DE3276982 T DE 3276982T DE 3276982 D1 DE3276982 D1 DE 3276982D1
Authority
DE
Germany
Prior art keywords
module
electrical components
supporting electrical
supporting
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282110207T
Other languages
German (de)
English (en)
Inventor
Dudley Augustus Chance
Alan Platt
Chung Wen Ho
Sudipta Kumar Ray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3276982D1 publication Critical patent/DE3276982D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H10W70/641—
    • H10W70/685—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H10W70/63—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Credit Cards Or The Like (AREA)
DE8282110207T 1981-12-31 1982-11-05 Module for supporting electrical components Expired DE3276982D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/337,057 US4489364A (en) 1981-12-31 1981-12-31 Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface

Publications (1)

Publication Number Publication Date
DE3276982D1 true DE3276982D1 (en) 1987-09-17

Family

ID=23318934

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282110207T Expired DE3276982D1 (en) 1981-12-31 1982-11-05 Module for supporting electrical components

Country Status (4)

Country Link
US (1) US4489364A (cg-RX-API-DMAC10.html)
EP (1) EP0083406B1 (cg-RX-API-DMAC10.html)
JP (1) JPS58127357A (cg-RX-API-DMAC10.html)
DE (1) DE3276982D1 (cg-RX-API-DMAC10.html)

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US5306872A (en) * 1991-03-06 1994-04-26 International Business Machines Corporation Structures for electrically conductive decals filled with organic insulator material
US5184284A (en) * 1991-09-03 1993-02-02 International Business Machines Corporation Method and apparatus for implementing engineering changes for integrated circuit module
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US6101710A (en) * 1994-12-14 2000-08-15 International Business Machines Corporation Method for facilitating engineering changes in a multiple level circuit package
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US5770884A (en) * 1995-06-30 1998-06-23 International Business Machines Corporation Very dense integrated circuit package
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US5774340A (en) * 1996-08-28 1998-06-30 International Business Machines Corporation Planar redistribution structure and printed wiring device
US5754410A (en) * 1996-09-11 1998-05-19 International Business Machines Corporation Multi-chip module with accessible test pads
US6541709B1 (en) 1996-11-01 2003-04-01 International Business Machines Corporation Inherently robust repair process for thin film circuitry using uv laser
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US5998868A (en) * 1998-02-04 1999-12-07 International Business Machines Corporation Very dense chip package
US6026221A (en) * 1998-02-18 2000-02-15 International Business Machines Corporation Prototyping multichip module
US6104082A (en) * 1998-04-24 2000-08-15 International Business Machines Corporation Metallization structure for altering connections
US6025638A (en) * 1998-06-01 2000-02-15 International Business Machines Corporation Structure for precision multichip assembly
US6066513A (en) * 1998-10-02 2000-05-23 International Business Machines Corporation Process for precise multichip integration and product thereof
US6235544B1 (en) 1999-04-20 2001-05-22 International Business Machines Corporation Seed metal delete process for thin film repair solutions using direct UV laser
US6333553B1 (en) 1999-05-21 2001-12-25 International Business Machines Corporation Wafer thickness compensation for interchip planarity
KR20010049422A (ko) * 1999-05-26 2001-06-15 마찌다 가쯔히꼬 고주파 모듈
US6392159B1 (en) 1999-07-27 2002-05-21 International Business Machines Corporation Embedded structure for engineering change and repair of circuit boards
DE10024875B4 (de) * 2000-05-16 2004-07-01 Infineon Technologies Ag Bauteilhaltersystem zur Verwendung mit Testvorrichtungen zum Testen elektronischer Bauteile
US7335995B2 (en) 2001-10-09 2008-02-26 Tessera, Inc. Microelectronic assembly having array including passive elements and interconnects
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US7294928B2 (en) * 2002-09-06 2007-11-13 Tessera, Inc. Components, methods and assemblies for stacked packages
US7071547B2 (en) 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7061121B2 (en) 2003-11-12 2006-06-13 Tessera, Inc. Stacked microelectronic assemblies with central contacts
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US20070187808A1 (en) * 2006-02-16 2007-08-16 Easic Corporation Customizable power and ground pins
US7490189B2 (en) * 2006-06-14 2009-02-10 Sun Microsystems, Inc. Multi-chip switch based on proximity communication
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US20090045839A1 (en) * 2007-08-15 2009-02-19 International Business Machines Corporation Asic logic library of flexible logic blocks and method to enable engineering change
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CN102254839B (zh) * 2010-05-21 2015-09-02 刘圣平 一种集成电路芯外简易集成方法及框架
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TWI647581B (zh) * 2017-11-22 2019-01-11 緯創資通股份有限公司 電路板以及佈局結構
CN113632182B (zh) * 2019-03-29 2022-12-30 株式会社自动网络技术研究所 布线模块
KR102899638B1 (ko) * 2020-02-11 2025-12-15 삼성전자주식회사 인쇄회로기판 조립체 및 이를 포함하는 전자 장치
US12040315B2 (en) * 2020-10-20 2024-07-16 Innolux Corporation Electronic device
US12504747B2 (en) 2021-03-23 2025-12-23 International Business Machines Corporation Multicomponent module design and fabrication
CN114698257B (zh) * 2022-03-25 2024-12-03 江苏普诺威电子股份有限公司 具有全嵌入式精密线路的封装载板及其加工工艺
CN114698270B (zh) * 2022-03-30 2024-12-03 江苏普诺威电子股份有限公司 基于表层保护的精密线路封装载板及其加工工艺

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Also Published As

Publication number Publication date
US4489364A (en) 1984-12-18
JPS58127357A (ja) 1983-07-29
EP0083406A2 (en) 1983-07-13
EP0083406B1 (en) 1987-08-12
JPS6216023B2 (cg-RX-API-DMAC10.html) 1987-04-10
EP0083406A3 (en) 1985-05-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee