DE3273372D1 - Clutch assembly for removing a severed wafer from an ingot - Google Patents

Clutch assembly for removing a severed wafer from an ingot

Info

Publication number
DE3273372D1
DE3273372D1 DE8282305945T DE3273372T DE3273372D1 DE 3273372 D1 DE3273372 D1 DE 3273372D1 DE 8282305945 T DE8282305945 T DE 8282305945T DE 3273372 T DE3273372 T DE 3273372T DE 3273372 D1 DE3273372 D1 DE 3273372D1
Authority
DE
Germany
Prior art keywords
ingot
clutch assembly
severed
wafer
severed wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282305945T
Other languages
English (en)
Inventor
Robert E Steere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silicon Technology Corp Japan
Silicon Technology Corp
Original Assignee
Silicon Technology Corp Japan
Silicon Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Technology Corp Japan, Silicon Technology Corp filed Critical Silicon Technology Corp Japan
Application granted granted Critical
Publication of DE3273372D1 publication Critical patent/DE3273372D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B23Q7/047—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers the gripper supporting the workpiece during machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8282305945T 1981-11-10 1982-11-09 Clutch assembly for removing a severed wafer from an ingot Expired DE3273372D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06320097 US4420909B2 (en) 1981-11-10 1981-11-10 Wafering system

Publications (1)

Publication Number Publication Date
DE3273372D1 true DE3273372D1 (en) 1986-10-23

Family

ID=23244880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282305945T Expired DE3273372D1 (en) 1981-11-10 1982-11-09 Clutch assembly for removing a severed wafer from an ingot

Country Status (4)

Country Link
US (1) US4420909B2 (de)
EP (1) EP0079744B1 (de)
JP (3) JPS5887830A (de)
DE (1) DE3273372D1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602854A (en) * 1985-02-25 1986-07-29 At&T Technologies, Inc. Polyhedral ring mirrors and their manufacture
JPS6213305A (ja) * 1985-07-12 1987-01-22 株式会社日立製作所 ワ−ク回転式切断法およびその装置
US4667650A (en) * 1985-11-21 1987-05-26 Pq Corporation Mounting beam for preparing wafers
EP0242489B1 (de) * 1986-04-17 1991-07-10 Maschinenfabrik Meyer & Burger AG Verfahren zum Trennen eines Stabes in Teilstücke, Trennschleifmaschine zur Durchführung dieses Verfahrens und Verwendung dieser Trennschleifmaschine
US4903681A (en) * 1987-02-24 1990-02-27 Tokyo Seimitus Co., Ltd. Method and apparatus for cutting a cylindrical material
US4899719A (en) * 1987-07-31 1990-02-13 Mitsubishi Kinsoku Kabushiki Kaisha Apparatus for collecting wafers
JP2623604B2 (ja) * 1987-10-21 1997-06-25 三菱マテリアル株式会社 スライサの切断送り装置
DE3737540C1 (de) * 1987-11-05 1989-06-22 Mueller Georg Nuernberg Verfahren und Maschine zum Herstellen von Ronden mit zumindest einer planen Oberflaeche
US4819387A (en) * 1987-12-16 1989-04-11 Motorola, Inc. Method of slicing semiconductor crystal
US5025593A (en) * 1988-01-18 1991-06-25 Mazda Motor Corporation Slicing machine and control method thereof
US5111622A (en) * 1989-05-18 1992-05-12 Silicon Technology Corporation Slicing and grinding system for a wafer slicing machine
US4974578A (en) * 1989-08-17 1990-12-04 Silicon Technology Corporation Housing for mounting a spindle of an internal diameter saw blade
JPH0695504B2 (ja) * 1989-10-31 1994-11-24 直江津電子工業株式会社 ウエハ枚葉式内周刃２分割切断装置におけるウエハ供給回収装置
US5189843A (en) * 1990-08-30 1993-03-02 Silicon Technology Corporation Wafer slicing and grinding machine and a method of slicing and grinding wafers
US5148797A (en) * 1991-03-14 1992-09-22 Silicon Technology Corporation Mounting for an internal diameter saw blade
US5243960A (en) * 1991-12-31 1993-09-14 Stone Panels, Inc. Apparatus for cutting stone laminate panels
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JP2823493B2 (ja) * 1993-01-18 1998-11-11 トーヨーエイテック株式会社 スライシング装置のブレード撓み検出方法及び装置並びにブレード撓み制御装置
JP2943673B2 (ja) * 1995-10-31 1999-08-30 日本電気株式会社 半導体基板の製造装置及び製造方法
EP0964333A1 (de) 1998-06-10 1999-12-15 Sun Microsystems, Inc. Betriebsmittelverwaltung
EP0964332B1 (de) * 1998-06-10 2005-10-12 Sun Microsystems, Inc. Verfahren und Vorrichtung zum Zeitplanen von Prozessen für Betriebsmittelzuteilung
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
KR100889242B1 (ko) * 2006-05-15 2009-03-17 주식회사 엘지화학 방수기능을 구비한 ｂｍｓ
DE102009047027B3 (de) * 2009-11-23 2011-07-28 J. Schmalz GmbH, 72293 Vorrichtung zum Herstellen von Materialscheiben
CN105374730B (zh) * 2015-10-23 2018-03-27 河北晶龙阳光设备有限公司 一种用于太阳能电池片转篮的机械手及其双机头转运装置
CN105500541B (zh) * 2015-12-31 2017-09-29 天津朗誉科技发展有限公司 一种硅棒晶体翻转系统
JP6938087B2 (ja) * 2017-09-21 2021-09-22 株式会社ディスコ 切削ブレードの装着機構
CN115050680B (zh) * 2022-08-16 2022-10-28 江苏邑文微电子科技有限公司 晶圆盒快速定位装置和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
DE1148480B (de) * 1961-07-13 1963-05-09 Siemens Ag Einrichtung zum Zersaegen von Koerpern aus sproedem Material in Scheiben, insbesondere von stabfoermigen Halbleiterkristallen
US3577861A (en) * 1969-04-07 1971-05-11 Kayex Corp Transfer device for cutting apparatus
GB1319768A (en) * 1969-10-29 1973-06-06 Caplin Eng Co Ltd Machine tool for cutting a workpiece
JPS5029171A (de) * 1973-07-17 1975-03-25
JPS51126033A (en) * 1975-04-25 1976-11-02 Hitachi Ltd Wafer collection device for slicer
JPS5244671A (en) * 1975-10-06 1977-04-07 Mitsubishi Electric Corp Circuit for detecting quantity of electricity
JPS5632507Y2 (de) * 1976-07-30 1981-08-03
JPS53139686U (de) * 1977-04-09 1978-11-04
JPS5646529A (en) * 1979-09-21 1981-04-27 Citizen Watch Co Ltd Wafer chuck

Also Published As

Publication number Publication date
US4420909A (en) 1983-12-20
JPH06143250A (ja) 1994-05-24
JPH01264806A (ja) 1989-10-23
EP0079744A2 (de) 1983-05-25
US4420909B1 (de) 1989-11-14
EP0079744A3 (en) 1984-09-05
EP0079744B1 (de) 1986-09-17
US4420909B2 (en) 1997-06-10
JPH0247324B2 (de) 1990-10-19
JP2601594B2 (ja) 1997-04-16
JPS5887830A (ja) 1983-05-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee
8380 Miscellaneous part iii

Free format text: IN HEFT 46/88, SEITE 10824, SP.3: DIE VEROEFFENTLICHUNG IST ZU STREICHEN

8339 Ceased/non-payment of the annual fee