JPS5646529A - Wafer chuck - Google Patents

Wafer chuck

Info

Publication number
JPS5646529A
JPS5646529A JP12176079A JP12176079A JPS5646529A JP S5646529 A JPS5646529 A JP S5646529A JP 12176079 A JP12176079 A JP 12176079A JP 12176079 A JP12176079 A JP 12176079A JP S5646529 A JPS5646529 A JP S5646529A
Authority
JP
Japan
Prior art keywords
wafer
sucking
hole
switching valve
sucked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12176079A
Other languages
Japanese (ja)
Inventor
Hideo Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP12176079A priority Critical patent/JPS5646529A/en
Publication of JPS5646529A publication Critical patent/JPS5646529A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE:To make it possible to suck the peripheral portions of the wafers having various sizes even though the wafer sizes are changed, by making it possible to change the range of suctions by selectively connecting the sucking holes and the intake holes. CONSTITUTION:A wafer chuck is provided with common sucking holes 1b' having a groove portion on the side of a wafer sucking plane 1a' and a large wafer sucking hole 1c' having a groove portion for increasing the sucking force for the peripheral portion of the large wafer. In the case a small wafer 4 is sucked, a wafer- chuck coupling portion 2a of a switching valve 2 prevents the sucking hole 1c' from becoming a leaking state. In the case a large wafer 5 is sucked, the sucking hole 1c' is also connected to a sucking hose hole 1f via a hole 2b of said switching valve 2. Therefore, a peripheral portion 5a of said wafer 5 is sucked. By rotating the switching valve 2 by using the rotating groove in the switching valve 2, the wafer size can be readily changed in a short time.
JP12176079A 1979-09-21 1979-09-21 Wafer chuck Pending JPS5646529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12176079A JPS5646529A (en) 1979-09-21 1979-09-21 Wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12176079A JPS5646529A (en) 1979-09-21 1979-09-21 Wafer chuck

Publications (1)

Publication Number Publication Date
JPS5646529A true JPS5646529A (en) 1981-04-27

Family

ID=14819199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12176079A Pending JPS5646529A (en) 1979-09-21 1979-09-21 Wafer chuck

Country Status (1)

Country Link
JP (1) JPS5646529A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214937A (en) * 1985-03-15 1986-09-24 Canon Inc Attractive holder
US4683822A (en) * 1985-09-17 1987-08-04 The Ward Machinery Company Die mounting apparatus
JPS62147439U (en) * 1986-03-12 1987-09-17
JPS62201608U (en) * 1986-06-13 1987-12-22
JPS6362347A (en) * 1986-09-03 1988-03-18 Rohm Co Ltd Chuck table
JPH01201936A (en) * 1988-02-08 1989-08-14 Canon Inc Plate chuck
JPH01206644A (en) * 1988-02-13 1989-08-18 Shinkawa Ltd Substrate sucking structure
JPH01264806A (en) * 1981-11-10 1989-10-23 Silicon Technol Corp Method and device for manufacturing wafer
US4878407A (en) * 1986-05-01 1989-11-07 The Ward Machinery Company Vacuum die mount
JPH0484243U (en) * 1990-11-28 1992-07-22
JPH04100465U (en) * 1991-02-04 1992-08-31
US5704673A (en) * 1994-05-25 1998-01-06 Avery Dennison Corporation Large area support label carrier
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
CN106695409A (en) * 2017-02-15 2017-05-24 珠海格力智能装备有限公司 Sucking disc anchor clamps and display screen frame processing equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS485360U (en) * 1971-06-04 1973-01-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS485360U (en) * 1971-06-04 1973-01-22

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01264806A (en) * 1981-11-10 1989-10-23 Silicon Technol Corp Method and device for manufacturing wafer
JPS61214937A (en) * 1985-03-15 1986-09-24 Canon Inc Attractive holder
JPH0232092B2 (en) * 1985-03-15 1990-07-18 Canon Kk
US4683822A (en) * 1985-09-17 1987-08-04 The Ward Machinery Company Die mounting apparatus
JPS62147439U (en) * 1986-03-12 1987-09-17
US4878407A (en) * 1986-05-01 1989-11-07 The Ward Machinery Company Vacuum die mount
JPS62201608U (en) * 1986-06-13 1987-12-22
JPS6362347A (en) * 1986-09-03 1988-03-18 Rohm Co Ltd Chuck table
JPH01201936A (en) * 1988-02-08 1989-08-14 Canon Inc Plate chuck
JPH01206644A (en) * 1988-02-13 1989-08-18 Shinkawa Ltd Substrate sucking structure
JPH0484243U (en) * 1990-11-28 1992-07-22
JPH04100465U (en) * 1991-02-04 1992-08-31
US5704673A (en) * 1994-05-25 1998-01-06 Avery Dennison Corporation Large area support label carrier
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
US6505395B1 (en) 1998-08-26 2003-01-14 Micron Technology, Inc. Apparatus and method for removing carrier tape from a singulated die
US6658718B2 (en) 1998-08-26 2003-12-09 Micron Technology, Inc. Method for removing carrier film from a singulated die
US6751853B2 (en) 1998-08-26 2004-06-22 Micron Technology, Inc. Apparatus and system for removing carrier film from a singulated die
CN106695409A (en) * 2017-02-15 2017-05-24 珠海格力智能装备有限公司 Sucking disc anchor clamps and display screen frame processing equipment

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