JPS5840337U - Vacuum suction device for wafer grinding machine - Google Patents

Vacuum suction device for wafer grinding machine

Info

Publication number
JPS5840337U
JPS5840337U JP1981134341U JP13434181U JPS5840337U JP S5840337 U JPS5840337 U JP S5840337U JP 1981134341 U JP1981134341 U JP 1981134341U JP 13434181 U JP13434181 U JP 13434181U JP S5840337 U JPS5840337 U JP S5840337U
Authority
JP
Japan
Prior art keywords
grinding machine
suction device
vacuum suction
wafer grinding
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981134341U
Other languages
Japanese (ja)
Inventor
高志 佐野
淳 加藤
Original Assignee
日立精工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立精工株式会社 filed Critical 日立精工株式会社
Priority to JP1981134341U priority Critical patent/JPS5840337U/en
Publication of JPS5840337U publication Critical patent/JPS5840337U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示すウェハ研削盤の真空吸
着装置の平面図、第２図はその断面正面図、第３図は本
考案の他の一実施例を示す平面図である。 １・・・吸着台、２二締金、３・・・ボルト、４・・・
ベース、５・・・微小穴、６・・・主連通穴、７・・・
補助連通穴、８・・・供給管、９・・・バルブ、１０・
・・ベース、１１・・・空気通路、１２・・・細穴、１
４・・・プランジャー１．１６・・・ビン。FIG. 1 is a plan view of a vacuum suction device for a wafer grinding machine showing one embodiment of the present invention, FIG. 2 is a sectional front view thereof, and FIG. 3 is a plan view showing another embodiment of the present invention. . 1... Suction table, 22 Clamping, 3... Bolt, 4...
Base, 5... Micro hole, 6... Main communication hole, 7...
Auxiliary communication hole, 8... Supply pipe, 9... Valve, 10.
...Base, 11...Air passage, 12...Small hole, 1
4...Plunger 1.16...Bin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に多数の貫通する微小穴を穿設する吸着台を設け、
この吸着台の裏面に上記微小穴と連通ずる半径方向に複
数個の連通穴を設け、この複数個の連通穴と真空源との
間にウェハの大きさに応じ−て真空空気の供給を切換え
る切換機構を設けたことを特徴とするウェハ研削盤にお
ける真空吸着装置。A suction table with many penetrating microholes is installed on the surface.
A plurality of communication holes are provided in the radial direction communicating with the microholes on the back surface of this suction table, and the supply of vacuum air is switched between the plurality of communication holes and the vacuum source depending on the size of the wafer. A vacuum suction device for a wafer grinding machine characterized by being equipped with a switching mechanism.
JP1981134341U 1981-09-11 1981-09-11 Vacuum suction device for wafer grinding machine Pending JPS5840337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981134341U JPS5840337U (en) 1981-09-11 1981-09-11 Vacuum suction device for wafer grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981134341U JPS5840337U (en) 1981-09-11 1981-09-11 Vacuum suction device for wafer grinding machine

Publications (1)

Publication Number Publication Date
JPS5840337U true JPS5840337U (en) 1983-03-16

Family

ID=29927769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981134341U Pending JPS5840337U (en) 1981-09-11 1981-09-11 Vacuum suction device for wafer grinding machine

Country Status (1)

Country Link
JP (1) JPS5840337U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161133U (en) * 1984-09-26 1986-04-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161133U (en) * 1984-09-26 1986-04-24

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