JPS59155733U - Mound removal device - Google Patents
Mound removal deviceInfo
- Publication number
- JPS59155733U JPS59155733U JP4976283U JP4976283U JPS59155733U JP S59155733 U JPS59155733 U JP S59155733U JP 4976283 U JP4976283 U JP 4976283U JP 4976283 U JP4976283 U JP 4976283U JP S59155733 U JPS59155733 U JP S59155733U
- Authority
- JP
- Japan
- Prior art keywords
- mound
- removal device
- flat plate
- holder
- hard flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のマウンド除去装置および被処理半導体ウ
ェーハの側面図、第2図a、 b、 cは本考案の
一実施例のマウンド除去装置における、半導体ウェーハ
を硬質平板に押し付ける前、押し付けている時、離した
ときのそれぞれの状態を示す断面図である。
1.11・・・硬質平板、1a・・・貫通孔、2.12
・・・硬質平板ホルダ、2a、13・・・真空吸着溝、
26・・・窒素ガス流通路、3・・・半導体ウェーハ、
4・・・ウェーハ載置台、5・・・シリンダ、6・・・
N2・・・ガス、7・・・シリンダ上昇方向、8・・・
シリンダ下降方向。Figure 1 is a side view of a conventional mound removal apparatus and a semiconductor wafer to be processed, and Figures 2a, b, and c are views of a mound removal apparatus according to an embodiment of the present invention, before pressing the semiconductor wafer against a hard flat plate. FIG. 4 is a cross-sectional view showing the states when the device is in place and when it is released. 1.11...Hard flat plate, 1a...Through hole, 2.12
...Hard flat plate holder, 2a, 13...Vacuum suction groove,
26... Nitrogen gas flow path, 3... Semiconductor wafer,
4... Wafer mounting table, 5... Cylinder, 6...
N2...Gas, 7...Cylinder upward direction, 8...
Cylinder descending direction.
Claims (1)
シャル成長面をホルダに保持させた硬質平板に押しつけ
、前記成長面に成長したマウンドを押しつぶし除去する
マウンド除去装置において、前記硬質平板のほぼ中央附
近には、前記ホルダ内の流通路を通して送られるN2ガ
スの流出する貫通孔が設けられていることを特徴とする
マウンド除去装置。In a mound removal device that presses the epitaxial growth surface of a semiconductor wafer after epitaxial growth against a hard flat plate held in a holder, and crushes and removes the mound grown on the growth surface, a mound in the holder is placed near the center of the hard flat plate. A mound removal device characterized by being provided with a through hole through which N2 gas sent through a flow path flows out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4976283U JPS59155733U (en) | 1983-04-04 | 1983-04-04 | Mound removal device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4976283U JPS59155733U (en) | 1983-04-04 | 1983-04-04 | Mound removal device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59155733U true JPS59155733U (en) | 1984-10-19 |
Family
ID=30180252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4976283U Pending JPS59155733U (en) | 1983-04-04 | 1983-04-04 | Mound removal device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59155733U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54116881A (en) * | 1978-03-02 | 1979-09-11 | Nec Corp | Surface processor for semiconductor wafer |
-
1983
- 1983-04-04 JP JP4976283U patent/JPS59155733U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54116881A (en) * | 1978-03-02 | 1979-09-11 | Nec Corp | Surface processor for semiconductor wafer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59155733U (en) | Mound removal device | |
JPH03128943U (en) | ||
JPS5919257U (en) | Double-sided processing equipment | |
JPS60927U (en) | Semiconductor wafer pasting equipment | |
JPS59169044U (en) | Semiconductor chip adsorption nozzle | |
JPS59169042U (en) | Liquid processing equipment | |
JPH044742U (en) | ||
JPS5858340U (en) | Semiconductor wafer scriber | |
JPS59158331U (en) | Semiconductor substrate adsorption stand | |
JPS58168139U (en) | Semiconductor wafer suction holding device | |
JPS5939160U (en) | polishing jig | |
JPS5948042U (en) | polishing equipment | |
JPS6013739U (en) | Wafer holding device | |
JPS6118860U (en) | Laser marking equipment for semiconductor wafers | |
JPS60100748U (en) | Photoresist coating equipment | |
JPS59104536U (en) | Wafer suction mechanism | |
JPS6054330U (en) | semiconductor equipment | |
JPS5961531U (en) | Liquid phase epitaxial growth equipment | |
JPS6094834U (en) | semiconductor equipment | |
JPS59187133U (en) | Vapor deposition equipment | |
JPS60114813U (en) | slicing device | |
JPS5950634U (en) | positioning device | |
JPS5984843U (en) | Carrier hanger for semiconductor manufacturing | |
JPS592138U (en) | Semiconductor wafer suction jig | |
JPS5844848U (en) | Semiconductor wafer fixing jig |