JPS5447582A - Mask aligner - Google Patents

Mask aligner

Info

Publication number
JPS5447582A
JPS5447582A JP11336377A JP11336377A JPS5447582A JP S5447582 A JPS5447582 A JP S5447582A JP 11336377 A JP11336377 A JP 11336377A JP 11336377 A JP11336377 A JP 11336377A JP S5447582 A JPS5447582 A JP S5447582A
Authority
JP
Japan
Prior art keywords
mask
wafer
chuck
blow
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11336377A
Other languages
Japanese (ja)
Inventor
Kiyoshi Yoshida
Atsushi Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11336377A priority Critical patent/JPS5447582A/en
Publication of JPS5447582A publication Critical patent/JPS5447582A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE: To make dislodging of mask and wafer after exposure instantaneously by providing a backup plate for sucking and holding a mask in the central part of a mask holder and disposing a semiconductor wafer chuck of spherical form having suctio and blow-up functions in opposition thereto.
CONSTITUTION: A flat and thick plate form backup plate 12 made of quartz transmitting ultraviolet rays is beforehand fitted in the central part of a mask holder 13 which sucks and holds a mask 11. The bottom surface of this plate 12 is used as a mask suctin surface 14, and lead holes 16 for vacuuming are looked out upon both end edges thereof. On the other hand, the suction surface 18 of a wafer chuck 19 for sucking and holding a semiconductor wafer is made spherical and is provided with lead holes 20 which provides both suction and blow-up over th entire surface of the suction surface 18. With such constitution, the wafer 17 is sucked by the suction surface 18 of the chuck 19 and is thereby forced down, and air is blow up through the lead hoels 20 to contact the wafer 17 and mask 11. When exposure is complated after this, the lead holes 20 are chaned over to vacuuming to lower the chuck 19, whereby these are separated
COPYRIGHT: (C)1979,JPO&Japio
JP11336377A 1977-09-22 1977-09-22 Mask aligner Pending JPS5447582A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11336377A JPS5447582A (en) 1977-09-22 1977-09-22 Mask aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11336377A JPS5447582A (en) 1977-09-22 1977-09-22 Mask aligner

Publications (1)

Publication Number Publication Date
JPS5447582A true JPS5447582A (en) 1979-04-14

Family

ID=14610374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11336377A Pending JPS5447582A (en) 1977-09-22 1977-09-22 Mask aligner

Country Status (1)

Country Link
JP (1) JPS5447582A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990083568A (en) * 1998-04-28 1999-11-25 다나카 아키히로 Contact exposure method
JP2002367895A (en) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd Method and apparatus for exposing photoresist as well as substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990083568A (en) * 1998-04-28 1999-11-25 다나카 아키히로 Contact exposure method
JP2002367895A (en) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd Method and apparatus for exposing photoresist as well as substrate

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