DE3260514D1 - Planar field-effect transistor having elektrodes comprising metallised holes, and process for manufacturing the transistor - Google Patents

Planar field-effect transistor having elektrodes comprising metallised holes, and process for manufacturing the transistor

Info

Publication number
DE3260514D1
DE3260514D1 DE8282400387T DE3260514T DE3260514D1 DE 3260514 D1 DE3260514 D1 DE 3260514D1 DE 8282400387 T DE8282400387 T DE 8282400387T DE 3260514 T DE3260514 T DE 3260514T DE 3260514 D1 DE3260514 D1 DE 3260514D1
Authority
DE
Germany
Prior art keywords
transistor
elektrodes
manufacturing
planar field
effect transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282400387T
Other languages
English (en)
Inventor
Paul Robert Jay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3260514D1 publication Critical patent/DE3260514D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66848—Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856—Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • H01L29/66863—Lateral single gate transistors
    • H01L29/66886—Lateral transistors with two or more independent gates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743—Making of internal connections, substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725—Source or drain electrodes for field effect devices
    • H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/812—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate
    • H01L29/8124—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a Schottky gate with multiple gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
DE8282400387T 1981-03-10 1982-03-05 Planar field-effect transistor having elektrodes comprising metallised holes, and process for manufacturing the transistor Expired DE3260514D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8104719A FR2501913A1 (fr) 1981-03-10 1981-03-10 Transistor a effet de champ de type planar comportant des electrodes a puits metallises et procede de fabrication de ce transistor

Publications (1)

Publication Number Publication Date
DE3260514D1 true DE3260514D1 (en) 1984-09-13

Family

ID=9256034

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282400387T Expired DE3260514D1 (en) 1981-03-10 1982-03-05 Planar field-effect transistor having elektrodes comprising metallised holes, and process for manufacturing the transistor

Country Status (5)

Country Link
US (1) US4482907A (de)
EP (1) EP0061376B1 (de)
JP (1) JPS57160172A (de)
DE (1) DE3260514D1 (de)
FR (1) FR2501913A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4583107A (en) * 1983-08-15 1986-04-15 Westinghouse Electric Corp. Castellated gate field effect transistor
FR2554639B1 (fr) * 1983-11-08 1986-02-21 Thomson Csf Transistor a effet de champ a tension de seuil reglable, et circuit integre comportant ce type de transistors
US4589190A (en) * 1984-03-23 1986-05-20 General Electric Company Fabrication of drilled and diffused junction field-effect transistors
US4635084A (en) * 1984-06-08 1987-01-06 Eaton Corporation Split row power JFET
EP0268426A3 (de) * 1986-11-17 1989-03-15 Linear Technology Corporation Hochgeschwindigkeits-Feldeffekttransistor mit pn-Übergang zur Verwendung in bipolaren integrierten Schaltungen
USRE34821E (en) * 1986-11-17 1995-01-03 Linear Technology Corporation High speed junction field effect transistor for use in bipolar integrated circuits
US4984037A (en) * 1986-12-11 1991-01-08 Gte Laboratories Incorporated Semiconductor device with conductive rectifying rods
EP0271346B1 (de) * 1986-12-11 1995-05-03 Gte Laboratories Incorporated Transistor mit Zusammensetzung aus Halbleitermaterial und aus leitendem Material
US4724223A (en) * 1986-12-11 1988-02-09 Gte Laboratories Incorporated Method of making electrical contacts
US4829173A (en) * 1987-03-02 1989-05-09 Gte Laboratories Incorporated Radiation detecting apparatus
JPH01175267A (ja) * 1987-12-28 1989-07-11 Sony Corp 半導体装置
JPH02296372A (ja) * 1989-05-10 1990-12-06 Mitsubishi Electric Corp 透過ベーストランジスタ
US5111254A (en) * 1990-08-17 1992-05-05 Gte Laboratories Incorporated Floating gate array transistors
US5098862A (en) * 1990-11-07 1992-03-24 Gte Laboratories Incorporated Method of making ohmic electrical contact to a matrix of semiconductor material
KR920022546A (ko) * 1991-05-31 1992-12-19 김광호 모오스 트랜지스터의 구조 및 그 제조방법
JPH0575139A (ja) * 1991-09-12 1993-03-26 Mitsubishi Electric Corp 半導体装置及びその製造方法
US5359214A (en) * 1993-06-02 1994-10-25 Kulite Semiconductor Products Field effect devices formed from porous semiconductor materials
US5981988A (en) * 1996-04-26 1999-11-09 The Regents Of The University Of California Three-dimensional charge coupled device
EP0981166A3 (de) * 1998-08-17 2000-04-19 ELMOS Semiconductor AG JFET Transistor
DE10325150A1 (de) * 2003-05-31 2004-12-30 Hahn-Meitner-Institut Berlin Gmbh Parametrierte Halbleiterverbundstruktur mit integrierten Dotierungskanälen, Verfahren zur Herstellung und Anwendung davon
FR2880193A1 (fr) * 2004-12-23 2006-06-30 St Microelectronics Sa Diode schottky a barriere verticale
DE102005012217B4 (de) * 2005-03-15 2007-02-22 Infineon Technologies Austria Ag Lateraler MISFET und Verfahren zur Herstellung desselben
US8035927B2 (en) 2008-01-28 2011-10-11 Hitachi Global Storage Technologies Netherlands B.V. EMR magnetic sensor having its active quantum well layer extending beyond an over-lying semiconductor layer end with tab and lead structure for improved electrical contact
US7939865B2 (en) * 2009-01-22 2011-05-10 Honeywell International Inc. Metal semiconductor field effect transistor (MESFET) silicon-on-insulator structure having partial trench spacers

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL96818C (de) * 1952-03-14
US2869054A (en) * 1956-11-09 1959-01-13 Ibm Unipolar transistor
FR1317256A (fr) * 1961-12-16 1963-02-08 Teszner Stanislas Perfectionnements aux dispositifs semi-conducteurs dits tecnetrons multibâtonnets
US3767984A (en) * 1969-09-03 1973-10-23 Nippon Electric Co Schottky barrier type field effect transistor
US3836993A (en) * 1971-12-27 1974-09-17 Licentia Gmbh Magnetic field dependent field effect transistor
JPS5546068B2 (de) * 1973-05-22 1980-11-21
JPS5273681A (en) * 1975-12-16 1977-06-20 Toshiba Corp Field effect transistor
US3999281A (en) * 1976-01-16 1976-12-28 The United States Of America As Represented By The Secretary Of The Air Force Method for fabricating a gridded Schottky barrier field effect transistor
US4035826A (en) * 1976-02-23 1977-07-12 Rca Corporation Reduction of parasitic bipolar effects in integrated circuits employing insulated gate field effect transistors via the use of low resistance substrate contacts extending through source region
JPS5515275A (en) * 1978-07-19 1980-02-02 Semiconductor Res Found Charge transfer device
JPS5676575A (en) * 1979-11-26 1981-06-24 Nippon Telegr & Teleph Corp <Ntt> Manufacture of junction type field effect semiconductor device
JPS55141760A (en) * 1979-04-21 1980-11-05 Nippon Telegr & Teleph Corp <Ntt> Field effect transistor
JPS5676576A (en) * 1979-11-26 1981-06-24 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and manufacture thereof
FR2454703B1 (fr) * 1979-04-21 1985-11-15 Nippon Telegraph & Telephone Transistor a effet de champ et procede de fabrication
JPS566471A (en) * 1979-06-28 1981-01-23 Meidensha Electric Mfg Co Ltd Field effect type thyristor
DE2929939A1 (de) * 1979-07-24 1981-02-19 Licentia Gmbh Halbleiteranordnung und verfahren zu ihrer herstellung
US4338616A (en) * 1980-02-19 1982-07-06 Xerox Corporation Self-aligned Schottky metal semi-conductor field effect transistor with buried source and drain

Also Published As

Publication number Publication date
EP0061376A1 (de) 1982-09-29
EP0061376B1 (de) 1984-08-08
FR2501913B1 (de) 1985-02-01
JPS57160172A (en) 1982-10-02
FR2501913A1 (fr) 1982-09-17
US4482907A (en) 1984-11-13

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee