DE3228292A1 - Einrichtung zum platieren der oberflaeche eines metallstreifens - Google Patents

Einrichtung zum platieren der oberflaeche eines metallstreifens

Info

Publication number
DE3228292A1
DE3228292A1 DE19823228292 DE3228292A DE3228292A1 DE 3228292 A1 DE3228292 A1 DE 3228292A1 DE 19823228292 DE19823228292 DE 19823228292 DE 3228292 A DE3228292 A DE 3228292A DE 3228292 A1 DE3228292 A1 DE 3228292A1
Authority
DE
Germany
Prior art keywords
metal strip
electrolyte
anode material
consumable anode
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823228292
Other languages
German (de)
English (en)
Other versions
DE3228292C2 (enExample
Inventor
Gerald Glayton 95051 Santa Clara Calif. Laverty
Michael 95065 Santa Cruz Calif. Seyffert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of DE3228292A1 publication Critical patent/DE3228292A1/de
Application granted granted Critical
Publication of DE3228292C2 publication Critical patent/DE3228292C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19823228292 1981-07-30 1982-07-29 Einrichtung zum platieren der oberflaeche eines metallstreifens Granted DE3228292A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/288,590 US4378283A (en) 1981-07-30 1981-07-30 Consumable-anode selective plating apparatus

Publications (2)

Publication Number Publication Date
DE3228292A1 true DE3228292A1 (de) 1983-02-17
DE3228292C2 DE3228292C2 (enExample) 1992-12-24

Family

ID=23107772

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823228292 Granted DE3228292A1 (de) 1981-07-30 1982-07-29 Einrichtung zum platieren der oberflaeche eines metallstreifens

Country Status (3)

Country Link
US (1) US4378283A (enExample)
JP (1) JPS5871388A (enExample)
DE (1) DE3228292A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937926A1 (de) * 1989-11-15 1991-05-16 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255992A (ja) * 1984-06-01 1985-12-17 Shinko Electric Ind Co Ltd 部分メツキ装置
US4582583A (en) * 1984-12-07 1986-04-15 National Semiconductor Corporation Continuous stripe plating apparatus
US5114557A (en) * 1991-02-20 1992-05-19 Tooltek Engineering Corp. Selective plating apparatus with optical alignment sensor
US6099712A (en) * 1997-09-30 2000-08-08 Semitool, Inc. Semiconductor plating bowl and method using anode shield
JP2003526004A (ja) 1997-09-30 2003-09-02 セミトウール・インコーポレーテツド 接点洗浄作業用に主反応チェンバーに外付けした補助電極を持つ電気メッキシステム
US6921468B2 (en) * 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
JP4219562B2 (ja) * 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド ワークピースを電気化学的に処理するためのシステム
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
WO2001090434A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7247223B2 (en) * 2002-05-29 2007-07-24 Semitool, Inc. Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
DE10229001B4 (de) 2002-06-28 2007-02-15 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Steuern der Ionenverteilung während des galvanischen Auftragens eines Metalls auf eine Werkstückoberfläche
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
US4029555A (en) * 1975-05-23 1977-06-14 Electroplating Engineers Of Japan, Limited High-speed continuous plating method and apparatus therefor
US4220506A (en) * 1978-12-11 1980-09-02 Bell Telephone Laboratories, Incorporated Process for plating solder
US4224117A (en) * 1979-04-18 1980-09-23 Western Electric Company, Inc. Methods of and apparatus for selective plating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
US4029555A (en) * 1975-05-23 1977-06-14 Electroplating Engineers Of Japan, Limited High-speed continuous plating method and apparatus therefor
US4220506A (en) * 1978-12-11 1980-09-02 Bell Telephone Laboratories, Incorporated Process for plating solder
US4224117A (en) * 1979-04-18 1980-09-23 Western Electric Company, Inc. Methods of and apparatus for selective plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937926A1 (de) * 1989-11-15 1991-05-16 Schering Ag Vorrichtung zum abblenden von feldlinien in einer galvanikanlage

Also Published As

Publication number Publication date
DE3228292C2 (enExample) 1992-12-24
US4378283A (en) 1983-03-29
JPS5871388A (ja) 1983-04-28

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: RICHTER, J., DIPL.-ING. GERBAULET, H., DIPL.-ING.,

D2 Grant after examination
8364 No opposition during term of opposition