DE3214256A1 - Vorrichtung zur handhabung eines substrates - Google Patents

Vorrichtung zur handhabung eines substrates

Info

Publication number
DE3214256A1
DE3214256A1 DE19823214256 DE3214256A DE3214256A1 DE 3214256 A1 DE3214256 A1 DE 3214256A1 DE 19823214256 DE19823214256 DE 19823214256 DE 3214256 A DE3214256 A DE 3214256A DE 3214256 A1 DE3214256 A1 DE 3214256A1
Authority
DE
Germany
Prior art keywords
substrate
substrate holder
base plate
transport carrier
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823214256
Other languages
German (de)
English (en)
Other versions
DE3214256C2 (https=
Inventor
Horst Ing.(grad.) 7904 Erbach Kibbel
Klaus 7900 Ulm Schwesig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daimler Benz AG
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19823214256 priority Critical patent/DE3214256A1/de
Publication of DE3214256A1 publication Critical patent/DE3214256A1/de
Application granted granted Critical
Publication of DE3214256C2 publication Critical patent/DE3214256C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19823214256 1982-04-17 1982-04-17 Vorrichtung zur handhabung eines substrates Granted DE3214256A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823214256 DE3214256A1 (de) 1982-04-17 1982-04-17 Vorrichtung zur handhabung eines substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823214256 DE3214256A1 (de) 1982-04-17 1982-04-17 Vorrichtung zur handhabung eines substrates

Publications (2)

Publication Number Publication Date
DE3214256A1 true DE3214256A1 (de) 1983-10-20
DE3214256C2 DE3214256C2 (https=) 1993-08-05

Family

ID=6161191

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823214256 Granted DE3214256A1 (de) 1982-04-17 1982-04-17 Vorrichtung zur handhabung eines substrates

Country Status (1)

Country Link
DE (1) DE3214256A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202904A3 (en) * 1985-05-20 1988-01-07 Tegal Corporation Plasma reactor with removable insert
EP0555890A3 (en) * 1985-10-24 1993-09-15 Texas Instruments Incorporated Vacuum processing system
EP1748090A1 (de) * 2005-07-28 2007-01-31 Leybold Optics GmbH Vorrichtung zum Behandeln von Substraten
CN103354216A (zh) * 2013-07-02 2013-10-16 中国电子科技集团公司第四十八研究所 一种批传送太阳能电池片的大气机械手终端夹持器
US12009186B2 (en) 2017-06-28 2024-06-11 Meyer Burger (Germany) Gmbh Device for transporting substrate, treatment device with receiving plate adapted to substrate carrier of a device of this kind, and method for processing a substrate using a device of this kind for the transport of a substrate, and treatment facility

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3656454A (en) * 1970-11-23 1972-04-18 Air Reduction Vacuum coating apparatus
DE2854824A1 (de) * 1977-12-20 1979-06-21 Canon Kk Automatische ausrichteinrichtung fuer halbleiterscheiben

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3656454A (en) * 1970-11-23 1972-04-18 Air Reduction Vacuum coating apparatus
DE2854824A1 (de) * 1977-12-20 1979-06-21 Canon Kk Automatische ausrichteinrichtung fuer halbleiterscheiben

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202904A3 (en) * 1985-05-20 1988-01-07 Tegal Corporation Plasma reactor with removable insert
EP0555890A3 (en) * 1985-10-24 1993-09-15 Texas Instruments Incorporated Vacuum processing system
EP1748090A1 (de) * 2005-07-28 2007-01-31 Leybold Optics GmbH Vorrichtung zum Behandeln von Substraten
DE102005035904B4 (de) * 2005-07-28 2012-01-12 Leybold Optics Gmbh Vorrichtung zum Behandeln von Substraten
CN103354216A (zh) * 2013-07-02 2013-10-16 中国电子科技集团公司第四十八研究所 一种批传送太阳能电池片的大气机械手终端夹持器
CN103354216B (zh) * 2013-07-02 2016-05-18 中国电子科技集团公司第四十八研究所 一种批传送太阳能电池片的大气机械手终端夹持器
US12009186B2 (en) 2017-06-28 2024-06-11 Meyer Burger (Germany) Gmbh Device for transporting substrate, treatment device with receiving plate adapted to substrate carrier of a device of this kind, and method for processing a substrate using a device of this kind for the transport of a substrate, and treatment facility

Also Published As

Publication number Publication date
DE3214256C2 (https=) 1993-08-05

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: DAIMLER-BENZ AKTIENGESELLSCHAFT, 7000 STUTTGART, D

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee