DE3206354A1 - Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplatten - Google Patents
Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplattenInfo
- Publication number
- DE3206354A1 DE3206354A1 DE19823206354 DE3206354A DE3206354A1 DE 3206354 A1 DE3206354 A1 DE 3206354A1 DE 19823206354 DE19823206354 DE 19823206354 DE 3206354 A DE3206354 A DE 3206354A DE 3206354 A1 DE3206354 A1 DE 3206354A1
- Authority
- DE
- Germany
- Prior art keywords
- indicator
- conductor track
- conductor
- tool
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 238000003801 milling Methods 0.000 claims abstract description 16
- 238000005553 drilling Methods 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
- B23Q17/2233—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the tool relative to the workpiece
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Drilling And Boring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19823206354 DE3206354A1 (de) | 1982-02-22 | 1982-02-22 | Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplatten |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19823206354 DE3206354A1 (de) | 1982-02-22 | 1982-02-22 | Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3206354A1 true DE3206354A1 (de) | 1983-09-01 |
| DE3206354C2 DE3206354C2 (https=) | 1989-09-28 |
Family
ID=6156401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19823206354 Granted DE3206354A1 (de) | 1982-02-22 | 1982-02-22 | Vorrichtung zum aendern oder reparieren von nicht sichtbaren leiterbahnmustern von mehrlagigen leiterplatten |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3206354A1 (https=) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4650375A (en) * | 1985-12-02 | 1987-03-17 | James W. Millsap | Drill braking system |
| US4681489A (en) * | 1984-11-29 | 1987-07-21 | Hilti Aktiengesellschaft | Process of forming openings |
| US4725172A (en) * | 1985-05-28 | 1988-02-16 | Kabushiki Gaisha Sankoh-Chemical | Edged tool positioning device for use in a machine tool |
| US4807587A (en) * | 1984-11-29 | 1989-02-28 | Hilti Aktiengesellschaft | Process of forming openings |
| EP0235625A3 (en) * | 1986-03-05 | 1989-06-14 | International Business Machines Corporation | Repair of strip conductor on electrical circuit board |
| US5203650A (en) * | 1992-01-09 | 1993-04-20 | Everett D. Hougen | Method and apparatus for drilling holes |
| EP0555575A1 (en) * | 1992-02-11 | 1993-08-18 | Excellon Automation | Method and apparatus for machining printed circuit boards |
| FR2774617A1 (fr) * | 1998-02-06 | 1999-08-13 | St Microelectronics Sa | Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne |
| WO2002038318A1 (de) * | 2000-11-13 | 2002-05-16 | Cimatec Gmbh Produkte Für Leiterplatten | Verfahren zum definierten mechanischen bohren elektrischer leiterplatten oder leiterplattenpakete und bohrunterlage zur verwendung in diesem verfahren |
| WO2004106847A1 (en) * | 2003-06-02 | 2004-12-09 | Novator Ab | Method and apparatus for measuring a depth of holes in composite-material workpieces being machined by an orbiting cutting tool |
| EP1663569A4 (en) * | 2003-09-19 | 2009-04-15 | Viasystems Group Inc | BORE HOUSING SYSTEM WITH CLOSED LOOP |
| ITBS20100131A1 (it) * | 2010-07-26 | 2012-01-27 | Cover Technology S R L | Macchina fresatrice |
| WO2012156087A1 (de) * | 2011-05-17 | 2012-11-22 | Fela Holding Gmbh | Schaltungsträger |
| DE102012203318A1 (de) * | 2011-12-22 | 2013-06-27 | Rohde & Schwarz Gmbh & Co. Kg | Verfahren zum Freilegen einer Schicht einer Leiterplatte und entsprechend freigelegte Leiterplatte |
| US20140093321A1 (en) * | 2012-09-28 | 2014-04-03 | Huawei Technologies Co., Ltd. | Printed circuit board, and method and apparatus for drilling printed circuit board |
| CN106424828A (zh) * | 2016-12-07 | 2017-02-22 | 贵州黎阳航空动力有限公司 | 一种内腔深处斜孔加工防差错方法及装置 |
| EP4133912A4 (en) * | 2020-04-07 | 2024-04-10 | Nextgin Technology B.v. | Methods and systems for back-drilling a multi-layer circuit board |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4340249A1 (de) * | 1993-11-26 | 1995-06-01 | Schmoll Gmbh Maschinen | Vorrichtung zum Tiefenbohren von Leiterplatten o. dgl. |
| DE102018127991A1 (de) * | 2018-11-08 | 2020-05-14 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren zur mechanischen Bearbeitung einer Sandwichstruktur, Werkzeugeinrichtung und Sandwichstruktur |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2622711A1 (de) * | 1976-05-21 | 1977-11-24 | Juergen Dipl Ing Seebach | Verfahren und vorrichtung zur herstellung von leiterplatten |
| DE3045433A1 (de) * | 1980-12-02 | 1982-07-01 | Siemens AG, 1000 Berlin und 8000 München | Mehrlagen-leiterplatte und verfahren zur ermittlung der ist-position innenliegender anschlussflaechen |
-
1982
- 1982-02-22 DE DE19823206354 patent/DE3206354A1/de active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2622711A1 (de) * | 1976-05-21 | 1977-11-24 | Juergen Dipl Ing Seebach | Verfahren und vorrichtung zur herstellung von leiterplatten |
| DE3045433A1 (de) * | 1980-12-02 | 1982-07-01 | Siemens AG, 1000 Berlin und 8000 München | Mehrlagen-leiterplatte und verfahren zur ermittlung der ist-position innenliegender anschlussflaechen |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4681489A (en) * | 1984-11-29 | 1987-07-21 | Hilti Aktiengesellschaft | Process of forming openings |
| US4807587A (en) * | 1984-11-29 | 1989-02-28 | Hilti Aktiengesellschaft | Process of forming openings |
| US4725172A (en) * | 1985-05-28 | 1988-02-16 | Kabushiki Gaisha Sankoh-Chemical | Edged tool positioning device for use in a machine tool |
| US4650375A (en) * | 1985-12-02 | 1987-03-17 | James W. Millsap | Drill braking system |
| EP0235625A3 (en) * | 1986-03-05 | 1989-06-14 | International Business Machines Corporation | Repair of strip conductor on electrical circuit board |
| US5203650A (en) * | 1992-01-09 | 1993-04-20 | Everett D. Hougen | Method and apparatus for drilling holes |
| EP0555575A1 (en) * | 1992-02-11 | 1993-08-18 | Excellon Automation | Method and apparatus for machining printed circuit boards |
| FR2774617A1 (fr) * | 1998-02-06 | 1999-08-13 | St Microelectronics Sa | Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne |
| US6174113B1 (en) | 1998-02-06 | 2001-01-16 | Stmicroelectronics S.A. | Method and apparatus for machining a cavity in a smart card |
| WO2002038318A1 (de) * | 2000-11-13 | 2002-05-16 | Cimatec Gmbh Produkte Für Leiterplatten | Verfahren zum definierten mechanischen bohren elektrischer leiterplatten oder leiterplattenpakete und bohrunterlage zur verwendung in diesem verfahren |
| WO2004106847A1 (en) * | 2003-06-02 | 2004-12-09 | Novator Ab | Method and apparatus for measuring a depth of holes in composite-material workpieces being machined by an orbiting cutting tool |
| US7351018B2 (en) | 2003-06-02 | 2008-04-01 | Novator Ab | Method and apparatus for measuring a depth of holes in composite-material workpieces being machined by an orbiting cutting tool |
| EP1663569A4 (en) * | 2003-09-19 | 2009-04-15 | Viasystems Group Inc | BORE HOUSING SYSTEM WITH CLOSED LOOP |
| ITBS20100131A1 (it) * | 2010-07-26 | 2012-01-27 | Cover Technology S R L | Macchina fresatrice |
| WO2012156087A1 (de) * | 2011-05-17 | 2012-11-22 | Fela Holding Gmbh | Schaltungsträger |
| DE102012203318A1 (de) * | 2011-12-22 | 2013-06-27 | Rohde & Schwarz Gmbh & Co. Kg | Verfahren zum Freilegen einer Schicht einer Leiterplatte und entsprechend freigelegte Leiterplatte |
| DE102012203318B4 (de) * | 2011-12-22 | 2025-12-11 | Rohde & Schwarz GmbH & Co. Kommanditgesellschaft | Verfahren zum Freilegen einer Schicht einer Leiterplatte und entsprechend freigelegte Leiterplatte |
| US20140093321A1 (en) * | 2012-09-28 | 2014-04-03 | Huawei Technologies Co., Ltd. | Printed circuit board, and method and apparatus for drilling printed circuit board |
| US9426902B2 (en) * | 2012-09-28 | 2016-08-23 | Huawei Technologies Co., Ltd. | Printed circuit board, and method and apparatus for drilling printed circuit board |
| CN106424828A (zh) * | 2016-12-07 | 2017-02-22 | 贵州黎阳航空动力有限公司 | 一种内腔深处斜孔加工防差错方法及装置 |
| EP4133912A4 (en) * | 2020-04-07 | 2024-04-10 | Nextgin Technology B.v. | Methods and systems for back-drilling a multi-layer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3206354C2 (https=) | 1989-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8127 | New person/name/address of the applicant |
Owner name: TELENORMA TELEFONBAU UND NORMALZEIT GMBH, 6000 FRA |
|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8363 | Opposition against the patent | ||
| 8339 | Ceased/non-payment of the annual fee |