DE3134922C2 - - Google Patents

Info

Publication number
DE3134922C2
DE3134922C2 DE3134922A DE3134922A DE3134922C2 DE 3134922 C2 DE3134922 C2 DE 3134922C2 DE 3134922 A DE3134922 A DE 3134922A DE 3134922 A DE3134922 A DE 3134922A DE 3134922 C2 DE3134922 C2 DE 3134922C2
Authority
DE
Germany
Prior art keywords
metal layer
rectifier
layer
connection
rectifier device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3134922A
Other languages
German (de)
English (en)
Other versions
DE3134922A1 (de
Inventor
Yoshiharu Tokyo Jp Yotsumoto
Katsuhiko Yokohama Jp Kubota
Toshinobu Kawasaki Jp Sekiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3134922A1 publication Critical patent/DE3134922A1/de
Application granted granted Critical
Publication of DE3134922C2 publication Critical patent/DE3134922C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
    • H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
    • H02K11/05—Rectifiers associated with casings, enclosures or brackets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Synchronous Machinery (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
DE19813134922 1980-09-04 1981-09-03 Halbleiter-gleichrichtervorrichtung Granted DE3134922A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55122660A JPS5746662A (en) 1980-09-04 1980-09-04 Semiconductor rectifier

Publications (2)

Publication Number Publication Date
DE3134922A1 DE3134922A1 (de) 1982-04-01
DE3134922C2 true DE3134922C2 (enrdf_load_stackoverflow) 1990-05-23

Family

ID=14841471

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813134922 Granted DE3134922A1 (de) 1980-09-04 1981-09-03 Halbleiter-gleichrichtervorrichtung

Country Status (6)

Country Link
US (1) US4604643A (enrdf_load_stackoverflow)
JP (1) JPS5746662A (enrdf_load_stackoverflow)
DE (1) DE3134922A1 (enrdf_load_stackoverflow)
ES (1) ES505186A0 (enrdf_load_stackoverflow)
FR (1) FR2489593B1 (enrdf_load_stackoverflow)
IT (1) IT1138560B (enrdf_load_stackoverflow)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5968958A (ja) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ組立体
US4538169A (en) * 1982-11-04 1985-08-27 Motorola, Inc. Integrated alternator bridge heat sink
JPS59108340A (ja) * 1982-12-14 1984-06-22 Toshiba Corp 半導体整流装置
JPS59108339A (ja) * 1982-12-14 1984-06-22 Toshiba Corp 半導体整流装置
JPS59201457A (ja) * 1983-04-28 1984-11-15 Toshiba Corp 半導体装置
DE3335184A1 (de) * 1983-09-28 1985-04-04 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbausteinen
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
DE3538933A1 (de) * 1985-11-02 1987-05-14 Bbc Brown Boveri & Cie Leistungshalbleitermodul
US4985752A (en) * 1988-08-01 1991-01-15 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements
US4954876A (en) * 1988-08-01 1990-09-04 Sundstrand Corporation Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements
US4994890A (en) * 1989-11-27 1991-02-19 Snap-On Tools Corporation Rectifier structure with individual links
US5731970A (en) * 1989-12-22 1998-03-24 Hitachi, Ltd. Power conversion device and semiconductor module suitable for use in the device
US5087962A (en) * 1991-02-25 1992-02-11 Motorola Inc. Insulated lead frame using plasma sprayed dielectric
DE4403996A1 (de) * 1994-02-09 1995-08-10 Bosch Gmbh Robert Gleichrichteranordnung für einen Drehstromgenerator
JP3206717B2 (ja) * 1996-04-02 2001-09-10 富士電機株式会社 電力用半導体モジュール
US5889319A (en) * 1996-07-19 1999-03-30 Ericsson, Inc. RF power package with a dual ground
FR2790340B1 (fr) * 1999-02-26 2001-05-18 Valeo Equip Electr Moteur Alternateur pour vehicule automobile a redresseur et regulateur
FR2800932B1 (fr) * 1999-11-10 2002-03-01 Valeo Equip Electr Moteur Module electronique pour alternateur de vehicule, notamment automobile, et assemblage comportant un tel alternateur et un tel module
EP1032114B1 (fr) * 1999-02-26 2011-10-26 Valeo Equipements Electriques Moteur Module électrique pour alternateur de véhicule, notamment automobile, et assemblage comportant un tel alternateur et un tel module
DE19946259A1 (de) * 1999-09-27 2001-03-29 Philips Corp Intellectual Pty Gleichrichteranordnung
DE10022268B4 (de) * 2000-05-08 2005-03-31 Infineon Technologies Ag Halbleiterbauelement mit zwei Halbleiterkörpern in einem gemeinsamen Gehäuse
KR100652177B1 (ko) * 2001-02-28 2006-11-29 미쓰비시덴키 가부시키가이샤 회전전기의 통전기판
JP6698705B2 (ja) * 2016-01-14 2020-05-27 三菱電機株式会社 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1100697A (en) * 1965-11-22 1968-01-24 Matsushita Electronics Corp Alternator semiconductor diode and rectifying circuit assembly
GB1328351A (en) * 1969-12-31 1973-08-30 Lucas Industries Ltd Full wave rectifier assemblies
JPS4846559U (enrdf_load_stackoverflow) * 1971-09-30 1973-06-18
DE2208794A1 (de) * 1972-02-24 1973-08-30 Siemens Ag Gleichrichterbruecke
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
US3925809A (en) * 1973-07-13 1975-12-09 Ford Motor Co Semi-conductor rectifier heat sink
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung
US4069497A (en) * 1975-08-13 1978-01-17 Emc Technology, Inc. High heat dissipation mounting for solid state devices and circuits
JPS542067A (en) * 1977-06-07 1979-01-09 Hitachi Ltd Semiconductor device
JPS54118507A (en) * 1978-03-06 1979-09-14 Hitachi Ltd Ac generator for vehicle
US4218694A (en) * 1978-10-23 1980-08-19 Ford Motor Company Rectifying apparatus including six semiconductor diodes sandwiched between ceramic wafers
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
AT363147B (de) * 1978-12-13 1981-07-10 Wienerberger Baustoffind Ag Verfahren zur herstellung eines elektrischen schichtwiderstandes, insbesondere fuer leistungswiderstaende oder heizelemente
JPS6020943Y2 (ja) * 1979-08-29 1985-06-22 三菱電機株式会社 半導体装置
US4259061A (en) * 1979-12-07 1981-03-31 International Business Machines Corporation Method of achieving uniform sintering shrinkage in a laminated planar green ceramic substrate and apparatus therefor
US4320251A (en) * 1980-07-28 1982-03-16 Solamat Inc. Ohmic contacts for solar cells by arc plasma spraying

Also Published As

Publication number Publication date
ES8206095A1 (es) 1982-06-16
FR2489593B1 (fr) 1985-11-22
US4604643A (en) 1986-08-05
JPS641938B2 (enrdf_load_stackoverflow) 1989-01-13
FR2489593A1 (fr) 1982-03-05
IT8123757A0 (it) 1981-09-03
JPS5746662A (en) 1982-03-17
ES505186A0 (es) 1982-06-16
DE3134922A1 (de) 1982-04-01
IT1138560B (it) 1986-09-17

Similar Documents

Publication Publication Date Title
DE3134922C2 (enrdf_load_stackoverflow)
EP0931346B1 (de) Mikroelektronisches bauteil in sandwich-bauweise
DE60305734T2 (de) Verkapseltes elektronisches Bauelement und Verfahren zu dessen Herstellung
DE68920540T2 (de) Schaltungsteil unter Verwendung von mehrschichtigen gedruckten Leiterplatten und Verfahren zu dessen Herstellung.
DE102009033321A1 (de) Leistungshalbleitervorrichtung
DE3204231A1 (de) Laminataufbau aus matrix-faser-verbundschichten und einer metallschicht
DE3221199A1 (de) Halbleiteranordnung des isolierten typs
DE102021110251B4 (de) Leistungshalbleiteranordnung und Wechselrichterbrücke mit Leistungshalbleiteranordnung
EP0340520A2 (de) Anordnung zur konvektiven Kühlung von elektronischen Bauelementen, insbesondere von integrierten Halbleiterschaltungen
DE10009171B4 (de) Stromrichter und sein Herstellverfahren
DE2247627C3 (de) Halbleiter-Gleichrichtervorrichtung
DE4312409B4 (de) Einstellbarer Kondensator
DE69105070T2 (de) Verfahren zum Herstellen eines isolierenden Substrats für Halbleiterbauelemente und eine dazu verwendete, mit einem Muster versehene, Metallplatte.
DE1253806B (de) Luftstromgekuehlte, ringplattenfoermige, waermeableitende und stromfuehrende Halterung aus Aluminium fuer Gleichrichter fuer elektrische Maschinen
EP1943721A2 (de) Elektrische vorrichtung, insbesondere zur ansteuerung einer motorisch und/oder generatorisch betreibbaren elektrischen maschine
EP0243637A2 (de) Leistungshalbleitermodul
DE102019206263B4 (de) Halbleiterbauteil, Kraftfahrzeug und Verfahren zur Herstellung eines Halbleiterbauteils
DE102020127408A1 (de) Herstellen eines Zellgehäuses einer Batteriezelle sowie Zellgehäuse
EP0086483B1 (de) Leistungsgleichrichteranordnung
DE102021103046B4 (de) Leistungselektronikanordnung für ein Kraftfahrzeug und Verfahren zur Herstellung einer Leistungselektronikanordnung für ein Kraftfahrzeug
DE102019115573B4 (de) Leistungselektronische Schalteinrichtung und Verfahren zur Herstellung
EP0472817B1 (de) Hochspannungserzeuger für eine elektrostatische Sprühpistole
DE102016214310B4 (de) Schaltungsträger, Leistungsschaltungsanordnung mit einem Schaltungsträger, Verfahren zum Herstellen eines Schaltungsträgers
DE3539318C2 (enrdf_load_stackoverflow)
DE102019206260A1 (de) Verfahren zur Herstellung eines Halbleitermoduls

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8128 New person/name/address of the agent

Representative=s name: HENKEL, G., DR.PHIL. FEILER, L., DR.RER.NAT. HAENZ

8127 New person/name/address of the applicant

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

D2 Grant after examination
8363 Opposition against the patent
8331 Complete revocation