DE3113334C2 - - Google Patents
Info
- Publication number
- DE3113334C2 DE3113334C2 DE19813113334 DE3113334A DE3113334C2 DE 3113334 C2 DE3113334 C2 DE 3113334C2 DE 19813113334 DE19813113334 DE 19813113334 DE 3113334 A DE3113334 A DE 3113334A DE 3113334 C2 DE3113334 C2 DE 3113334C2
- Authority
- DE
- Germany
- Prior art keywords
- etched
- resin
- layer
- printed circuit
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002313 adhesive film Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000012876 carrier material Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000002311 subsequent effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813113334 DE3113334A1 (de) | 1981-04-02 | 1981-04-02 | Verfahren zur herstellung von mehrlagenleiterplatten |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813113334 DE3113334A1 (de) | 1981-04-02 | 1981-04-02 | Verfahren zur herstellung von mehrlagenleiterplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3113334A1 DE3113334A1 (de) | 1982-10-28 |
| DE3113334C2 true DE3113334C2 (OSRAM) | 1989-03-23 |
Family
ID=6129163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813113334 Granted DE3113334A1 (de) | 1981-04-02 | 1981-04-02 | Verfahren zur herstellung von mehrlagenleiterplatten |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3113334A1 (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2362037A (en) * | 2000-05-03 | 2001-11-07 | Bancha Ongkosit | Printed circuit board manufacture |
| DE10126002A1 (de) * | 2000-06-24 | 2002-01-31 | Rotra Leiterplatten Produktion | Mehrlagen-Leiterplatten-Verbundkörper und Verfahren zu dessen Herstellung |
| JP3903701B2 (ja) * | 2000-08-17 | 2007-04-11 | 松下電器産業株式会社 | 多層回路基板とその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3681171A (en) * | 1968-08-23 | 1972-08-01 | Hitachi Ltd | Apparatus for producing a multilayer printed circuit plate assembly |
-
1981
- 1981-04-02 DE DE19813113334 patent/DE3113334A1/de active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3113334A1 (de) | 1982-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |