DE3043156A1 - Verfahren zum trimmen eines bauelementes fuer akustische oberflaechenwellen - Google Patents

Verfahren zum trimmen eines bauelementes fuer akustische oberflaechenwellen

Info

Publication number
DE3043156A1
DE3043156A1 DE19803043156 DE3043156A DE3043156A1 DE 3043156 A1 DE3043156 A1 DE 3043156A1 DE 19803043156 DE19803043156 DE 19803043156 DE 3043156 A DE3043156 A DE 3043156A DE 3043156 A1 DE3043156 A1 DE 3043156A1
Authority
DE
Germany
Prior art keywords
component
etching gas
trimming
center frequency
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19803043156
Other languages
German (de)
English (en)
Inventor
Peter Stanley Palo Alto Calif. Cross
William Robert Sunnyvale Calif. Shreve
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE3043156A1 publication Critical patent/DE3043156A1/de
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE19803043156 1980-01-21 1980-11-15 Verfahren zum trimmen eines bauelementes fuer akustische oberflaechenwellen Ceased DE3043156A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/113,832 US4278492A (en) 1980-01-21 1980-01-21 Frequency trimming of surface acoustic wave devices

Publications (1)

Publication Number Publication Date
DE3043156A1 true DE3043156A1 (de) 1981-07-23

Family

ID=22351767

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803043156 Ceased DE3043156A1 (de) 1980-01-21 1980-11-15 Verfahren zum trimmen eines bauelementes fuer akustische oberflaechenwellen

Country Status (5)

Country Link
US (1) US4278492A (enExample)
JP (1) JPS56103513A (enExample)
DE (1) DE3043156A1 (enExample)
FR (1) FR2474256A1 (enExample)
GB (1) GB2069277B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4364016A (en) * 1980-11-03 1982-12-14 Sperry Corporation Method for post fabrication frequency trimming of surface acoustic wave devices
US4414243A (en) * 1982-07-06 1983-11-08 General Electric Company Method for making surface acoustic wave devices
FR2551861B1 (fr) * 1983-09-09 1985-10-18 Thomson Csf Procede de mesure de la profondeur d'une gravure ionique
US4595853A (en) * 1983-11-17 1986-06-17 Hitachi, Ltd. Apparatus for and method of determining properties of saw substrates
US4764244A (en) * 1985-06-11 1988-08-16 The Foxboro Company Resonant sensor and method of making same
US4672254A (en) * 1985-10-11 1987-06-09 Massachusetts Institute Of Technology Surface acoustic wave devices and method of manufacture thereof
GB2203590B (en) * 1987-04-02 1991-02-06 Stc Plc Resonator manufacture
US4836882A (en) * 1988-09-12 1989-06-06 The United States Of America As Represented By The Secretary Of The Army Method of making an acceleration hardened resonator
US4890369A (en) * 1988-10-28 1990-01-02 United Technologies Corporation Method of manufacturing saw devices
US5111168A (en) * 1990-08-15 1992-05-05 Texas Instruments Incorporated Real-time, in-situ saw filter delay adjustment
JP3244386B2 (ja) * 1994-08-23 2002-01-07 松下電器産業株式会社 弾性表面波装置
US5630949A (en) * 1995-06-01 1997-05-20 Tfr Technologies, Inc. Method and apparatus for fabricating a piezoelectric resonator to a resonant frequency
US6273991B1 (en) * 1999-07-28 2001-08-14 Saunders & Associates, Inc. Apparatus for plasma ion trimming of frequency devices
RU2190922C2 (ru) * 2000-11-30 2002-10-10 Омский научно-исследовательский институт приборостроения Способ настройки на центральную частоту сверхузкополосного элемента на поверхностных акустических волнах
EP1381156A4 (en) * 2001-04-19 2004-09-08 Matsushita Electric Industrial Co Ltd SURFACE WAVE COMPONENT AND METHOD FOR THE PRODUCTION THEREOF AND ELECTRONIC COMPONENT THEREFOR
KR101245296B1 (ko) 2005-04-06 2013-03-19 바이오스케일, 아이엔씨. 전기 응답 디바이스
US9164051B2 (en) 2005-04-06 2015-10-20 Bioscale, Inc. Electrically responsive device
WO2007127107A2 (en) * 2006-04-21 2007-11-08 Bioscale, Inc. Microfabricated devices and method for fabricating microfabricated devices
US8689426B2 (en) 2008-12-17 2014-04-08 Sand 9, Inc. Method of manufacturing a resonating structure
WO2011109382A1 (en) 2010-03-01 2011-09-09 Sand9, Inc. Microelectromechanical gyroscopes and related apparatus and methods
US8833161B2 (en) 2010-04-20 2014-09-16 Sand 9, Inc. Microelectromechanical gyroscopes and related apparatus and methods
WO2012040043A1 (en) 2010-09-20 2012-03-29 Sand9, Inc. Resonant sensing using extensional modes of a plate
US9383208B2 (en) 2011-10-13 2016-07-05 Analog Devices, Inc. Electromechanical magnetometer and applications thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3971684A (en) * 1973-12-03 1976-07-27 Hewlett-Packard Company Etching thin film circuits and semiconductor chips
US4092588A (en) * 1976-03-05 1978-05-30 Thomson-Csf Method of monitoring the machining by ion bombardment of a piezoelectric wafer
US4144507A (en) * 1976-09-29 1979-03-13 Texas Instruments Incorporated Surface acoustic wave resonator incorporating coupling transducer into reflecting arrays
US4176004A (en) * 1978-08-21 1979-11-27 Westinghouse Electric Corp. Method for modifying the characteristics of a semiconductor fusions

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1529941A (en) * 1975-01-15 1978-10-25 Mullard Ltd Electrical filters including coupled resonators

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3971684A (en) * 1973-12-03 1976-07-27 Hewlett-Packard Company Etching thin film circuits and semiconductor chips
US4092588A (en) * 1976-03-05 1978-05-30 Thomson-Csf Method of monitoring the machining by ion bombardment of a piezoelectric wafer
US4144507A (en) * 1976-09-29 1979-03-13 Texas Instruments Incorporated Surface acoustic wave resonator incorporating coupling transducer into reflecting arrays
US4176004A (en) * 1978-08-21 1979-11-27 Westinghouse Electric Corp. Method for modifying the characteristics of a semiconductor fusions

Non-Patent Citations (7)

* Cited by examiner, † Cited by third party
Title
#### *
ADAMS,CH. et al: Deeplay Etched S.A.W. Resonators,In: Proc. 31st Frequency Control Symposium (1977),S. 246-250 *
COLDREN, L.A. et al: Surface-Acoustic-Wave Resonator Filters. In: Proc. of the IEEE, Vol.67, No.1, Jan. 1979, S.147-158 *
CROSS, P.S. et al: Electronically variable survace-acoustic-wave velocity and tunable SAW resonators. In: Applied Physics Letters, Vol.28, No.1, 1. Jan. 1976, S.1-3 *
HAYDL,W.H. et al: Fine Tuning of Surface-Acoustic-Wave Resonantor Filters with Metallisation Thickness. In: Electronics Letters, 12th June 1975Vol. 11, No.12, S.252-253 *
JAMES, S. et al: Fine Tuning of S.A.W. Resona- tors using Argon Ion Bombardment. In: Electronics Letters, 11th Oct. 1979, Vol.15, No.21, S.683-684 *
TANSKI, W.J.: Surface Acoustic Wave Resonators on Quartz. In: IEEE Transactions on Sonics and Ultrasonics, Vol.SU-26,No.2,March 1979,S.03-104 *

Also Published As

Publication number Publication date
US4278492A (en) 1981-07-14
JPS56103513A (en) 1981-08-18
FR2474256B1 (enExample) 1985-03-29
GB2069277B (en) 1984-05-10
GB2069277A (en) 1981-08-19
FR2474256A1 (fr) 1981-07-24

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: SCHULTE, K., DIPL.-ING., PAT.-ASS., 7030 BOEBLINGE

8128 New person/name/address of the agent

Representative=s name: KOHLER, R., DIPL.-PHYS. SCHWINDLING, H., DIPL.-PHY

8110 Request for examination paragraph 44
8131 Rejection