DE3040676C2 - - Google Patents
Info
- Publication number
- DE3040676C2 DE3040676C2 DE19803040676 DE3040676A DE3040676C2 DE 3040676 C2 DE3040676 C2 DE 3040676C2 DE 19803040676 DE19803040676 DE 19803040676 DE 3040676 A DE3040676 A DE 3040676A DE 3040676 C2 DE3040676 C2 DE 3040676C2
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor body
- conductor grid
- conductors
- metal layer
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000002411 adverse Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- WCZWUYYJZVBKDZ-FGSXEWAUSA-N Vertine Natural products O([C@@H]1C[C@H](N2CCCC[C@@H]2C1)C=1C=C(C(=CC=11)OC)OC)C(=O)C=CC2=CC=C(O)C1=C2 WCZWUYYJZVBKDZ-FGSXEWAUSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000834 fixative Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803040676 DE3040676A1 (de) | 1980-10-29 | 1980-10-29 | Verfahren zum herstellen von halbleiteranordnugen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803040676 DE3040676A1 (de) | 1980-10-29 | 1980-10-29 | Verfahren zum herstellen von halbleiteranordnugen |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3040676A1 DE3040676A1 (de) | 1982-05-27 |
DE3040676C2 true DE3040676C2 (US06633600-20031014-M00021.png) | 1989-07-06 |
Family
ID=6115422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19803040676 Granted DE3040676A1 (de) | 1980-10-29 | 1980-10-29 | Verfahren zum herstellen von halbleiteranordnugen |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3040676A1 (US06633600-20031014-M00021.png) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3338347A1 (de) * | 1983-10-21 | 1985-05-02 | Siemens AG, 1000 Berlin und 8000 München | Feuerverzinnen von anschlussbeinchen elektronischer bauelemente, die sich im verband eines traegerbandes befinden |
JPS61257443A (ja) * | 1985-05-08 | 1986-11-14 | Mitsubishi Shindo Kk | 半導体装置用Cu合金リ−ド素材 |
US4589962A (en) * | 1985-06-03 | 1986-05-20 | National Semiconductor Corporation | Solder plating process and semiconductor product |
US5075258A (en) * | 1990-07-31 | 1991-12-24 | Motorola, Inc. | Method for plating tab leads in an assembled semiconductor package |
US5529682A (en) * | 1995-06-26 | 1996-06-25 | Motorola, Inc. | Method for making semiconductor devices having electroplated leads |
DE19921867C2 (de) | 1999-05-11 | 2001-08-30 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauelements mit mindestens einem verkapselten Chip auf einem Substrat |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1173506A (en) * | 1966-03-16 | 1969-12-10 | Motorola Inc | Metallic Frame Member for Fabrication of Semiconductor Devices. |
NL7018378A (US06633600-20031014-M00021.png) * | 1970-12-17 | 1972-06-20 | ||
JPS5144385B2 (US06633600-20031014-M00021.png) * | 1973-02-16 | 1976-11-27 | ||
US4141029A (en) * | 1977-12-30 | 1979-02-20 | Texas Instruments Incorporated | Integrated circuit device |
-
1980
- 1980-10-29 DE DE19803040676 patent/DE3040676A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
DE3040676A1 (de) | 1982-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
8120 | Willingness to grant licenses paragraph 23 | ||
D2 | Grant after examination | ||
8363 | Opposition against the patent | ||
8365 | Fully valid after opposition proceedings | ||
8339 | Ceased/non-payment of the annual fee |