DE3034175C2 - - Google Patents

Info

Publication number
DE3034175C2
DE3034175C2 DE19803034175 DE3034175A DE3034175C2 DE 3034175 C2 DE3034175 C2 DE 3034175C2 DE 19803034175 DE19803034175 DE 19803034175 DE 3034175 A DE3034175 A DE 3034175A DE 3034175 C2 DE3034175 C2 DE 3034175C2
Authority
DE
Germany
Prior art keywords
layer
electrical
resistance
properties
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19803034175
Other languages
German (de)
English (en)
Other versions
DE3034175A1 (de
Inventor
Rolf 8941 Buxheim De Knoblauch
Robert Dr.-Ing. 7900 Ulm De Ostwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19803034175 priority Critical patent/DE3034175A1/de
Publication of DE3034175A1 publication Critical patent/DE3034175A1/de
Application granted granted Critical
Publication of DE3034175C2 publication Critical patent/DE3034175C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Chemically Coating (AREA)
DE19803034175 1980-09-11 1980-09-11 Verfahren zur herstellung chemisch abscheidbarer, elektrisch leitfaehiger schichten Granted DE3034175A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19803034175 DE3034175A1 (de) 1980-09-11 1980-09-11 Verfahren zur herstellung chemisch abscheidbarer, elektrisch leitfaehiger schichten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803034175 DE3034175A1 (de) 1980-09-11 1980-09-11 Verfahren zur herstellung chemisch abscheidbarer, elektrisch leitfaehiger schichten

Publications (2)

Publication Number Publication Date
DE3034175A1 DE3034175A1 (de) 1982-04-15
DE3034175C2 true DE3034175C2 (US06534493-20030318-C00184.png) 1987-12-23

Family

ID=6111652

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803034175 Granted DE3034175A1 (de) 1980-09-11 1980-09-11 Verfahren zur herstellung chemisch abscheidbarer, elektrisch leitfaehiger schichten

Country Status (1)

Country Link
DE (1) DE3034175A1 (US06534493-20030318-C00184.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935936A1 (de) * 1988-10-29 1990-05-03 Ngk Insulators Ltd Verfahren zum herstellen eines detektorelements
DE19958202A1 (de) * 1999-12-02 2001-07-12 Infineon Technologies Ag Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477484A (en) * 1982-12-10 1984-10-16 International Business Machines Corporation Electroless plating monitor
US4756923A (en) * 1986-07-28 1988-07-12 International Business Machines Corp. Method of controlling resistivity of plated metal and product formed thereby
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof
CN105758891B (zh) * 2015-07-17 2019-03-05 生益电子股份有限公司 一种pcb的性能检测方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD91845A (US06534493-20030318-C00184.png) *
US2525668A (en) * 1949-02-05 1950-10-10 Erie Resistor Corp Method of making electrical condensers
DE1822766U (de) * 1960-07-13 1960-12-01 Heraeus Gmbh W C Vorrichtung zum vakuumbedampfen von baendern.
US3457637A (en) * 1967-02-06 1969-07-29 Gen Instrument Corp Method for trimming cermet resistors
DE1954582C3 (de) * 1969-10-30 1974-10-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Herstellen von Halbleiterbauelementen
JPS51140560A (en) * 1975-05-30 1976-12-03 Hitachi Ltd Method of monitoring homoepitaxy film thickness
US4147435A (en) * 1977-06-30 1979-04-03 International Business Machines Corporation Interferometric process and apparatus for the measurement of the etch rate of opaque surfaces
US4141780A (en) * 1977-12-19 1979-02-27 Rca Corporation Optically monitoring the thickness of a depositing layer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935936A1 (de) * 1988-10-29 1990-05-03 Ngk Insulators Ltd Verfahren zum herstellen eines detektorelements
DE19958202A1 (de) * 1999-12-02 2001-07-12 Infineon Technologies Ag Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke
US6303401B2 (en) 1999-12-02 2001-10-16 Infineon Technologies Ag Method for producing a metal layer with a given thickness
DE19958202C2 (de) * 1999-12-02 2003-08-14 Infineon Technologies Ag Verfahren zur Herstellung einer Metallschicht mit einer vorgegebenen Dicke

Also Published As

Publication number Publication date
DE3034175A1 (de) 1982-04-15

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee