DE3030687C2 - - Google Patents
Info
- Publication number
- DE3030687C2 DE3030687C2 DE3030687T DE3030687T DE3030687C2 DE 3030687 C2 DE3030687 C2 DE 3030687C2 DE 3030687 T DE3030687 T DE 3030687T DE 3030687 T DE3030687 T DE 3030687T DE 3030687 C2 DE3030687 C2 DE 3030687C2
- Authority
- DE
- Germany
- Prior art keywords
- niobium
- insulator
- titanium
- gold
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052758 niobium Inorganic materials 0.000 claims description 37
- 239000010955 niobium Substances 0.000 claims description 37
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 36
- 239000012212 insulator Substances 0.000 claims description 32
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 27
- 229910052719 titanium Inorganic materials 0.000 claims description 27
- 239000010936 titanium Substances 0.000 claims description 27
- 238000005219 brazing Methods 0.000 claims description 21
- 229910052737 gold Inorganic materials 0.000 claims description 20
- 239000010931 gold Substances 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 19
- 229910052594 sapphire Inorganic materials 0.000 claims description 15
- 239000010980 sapphire Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 229910001257 Nb alloy Inorganic materials 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 6
- 229910001020 Au alloy Inorganic materials 0.000 claims description 5
- 239000003353 gold alloy Substances 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 229910052706 scandium Inorganic materials 0.000 claims description 3
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 238000005275 alloying Methods 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229940045605 vanadium Drugs 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- YLNDNABNWASMFD-UHFFFAOYSA-N 4-[(1,3-dimethylimidazol-1-ium-2-yl)diazenyl]-n,n-dimethylaniline Chemical compound C1=CC(N(C)C)=CC=C1N=NC1=[N+](C)C=CN1C YLNDNABNWASMFD-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000542 Sc alloy Inorganic materials 0.000 description 1
- 229910000946 Y alloy Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- PYLYNBWPKVWXJC-UHFFFAOYSA-N [Nb].[Pb] Chemical compound [Nb].[Pb] PYLYNBWPKVWXJC-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- NNBFNNNWANBMTI-UHFFFAOYSA-M brilliant green Chemical compound OS([O-])(=O)=O.C1=CC(N(CC)CC)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](CC)CC)C=C1 NNBFNNNWANBMTI-UHFFFAOYSA-M 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3752—Details of casing-lead connections
- A61N1/3754—Feedthroughs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/26—Lead-in insulators; Lead-through insulators
- H01B17/30—Sealing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/186—Sealing members characterised by the disposition of the sealing members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/19—Sealing members characterised by the material
- H01M50/191—Inorganic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Radiology & Medical Imaging (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Geochemistry & Mineralogy (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Ceramic Products (AREA)
- Materials For Medical Uses (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US715379A | 1979-01-29 | 1979-01-29 | |
| US5198779A | 1979-06-25 | 1979-06-25 | |
| PCT/US1980/000126 WO1980001620A1 (en) | 1979-01-29 | 1980-01-28 | Hermetic electrical feedthrough assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3030687T1 DE3030687T1 (de) | 1981-02-12 |
| DE3030687C2 true DE3030687C2 (enrdf_load_stackoverflow) | 1991-06-13 |
Family
ID=26676599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE803030687T Granted DE3030687T1 (de) | 1979-01-29 | 1980-01-28 | Hermetic electrical feedthrough assembly |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0022863A1 (enrdf_load_stackoverflow) |
| CA (1) | CA1143024A (enrdf_load_stackoverflow) |
| CH (1) | CH649411A5 (enrdf_load_stackoverflow) |
| DE (1) | DE3030687T1 (enrdf_load_stackoverflow) |
| WO (1) | WO1980001620A1 (enrdf_load_stackoverflow) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4678868A (en) * | 1979-06-25 | 1987-07-07 | Medtronic, Inc. | Hermetic electrical feedthrough assembly |
| EP0257954B1 (en) * | 1986-08-15 | 1993-06-16 | Medtronic, Inc. | Oxygen sensing pacemaker |
| EP0269007A1 (de) * | 1986-11-28 | 1988-06-01 | Siemens Aktiengesellschaft | Keramik-Metall-Durchführung, insbesondere für Nerven- oder Herzschrittmacher, und Verfahren zu deren Herstellung |
| US5870272A (en) * | 1997-05-06 | 1999-02-09 | Medtronic Inc. | Capacitive filter feedthrough for implantable medical device |
| US6248080B1 (en) | 1997-09-03 | 2001-06-19 | Medtronic, Inc. | Intracranial monitoring and therapy delivery control device, system and method |
| US5902326A (en) * | 1997-09-03 | 1999-05-11 | Medtronic, Inc. | Optical window for implantable medical devices |
| US6125290A (en) * | 1998-10-30 | 2000-09-26 | Medtronic, Inc. | Tissue overgrowth detector for implantable medical device |
| US6134459A (en) * | 1998-10-30 | 2000-10-17 | Medtronic, Inc. | Light focusing apparatus for medical electrical lead oxygen sensor |
| US6198952B1 (en) | 1998-10-30 | 2001-03-06 | Medtronic, Inc. | Multiple lens oxygen sensor for medical electrical lead |
| US6144866A (en) * | 1998-10-30 | 2000-11-07 | Medtronic, Inc. | Multiple sensor assembly for medical electric lead |
| US6125291A (en) * | 1998-10-30 | 2000-09-26 | Medtronic, Inc. | Light barrier for medical electrical lead oxygen sensor |
| US6163723A (en) * | 1998-10-22 | 2000-12-19 | Medtronic, Inc. | Circuit and method for implantable dual sensor medical electrical lead |
| US6830249B2 (en) * | 2002-04-22 | 2004-12-14 | General Electric Company | Brazeable, multi-lead, low profile sealing fitting and method of installation |
| WO2012110244A1 (de) | 2011-02-18 | 2012-08-23 | Schott Ag | Durchführung |
| US11143304B2 (en) * | 2016-05-23 | 2021-10-12 | Daniel Hiram DEEKS | Methods and apparatus for sealing of metals |
| US12123497B2 (en) | 2016-05-23 | 2024-10-22 | Daniel Hiram DEEKS | Method and apparatus for the hermetic sealing of martensitic metals for precompression for cryogenic applications |
| DE102021110048A1 (de) | 2021-04-21 | 2022-10-27 | Schott Ag | Durchführung durch ein Gehäusebauteil, insbesondere für raue, mechanisch und thermisch belastete Umgebungen |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3001269A (en) * | 1954-09-20 | 1961-09-26 | Gen Electric | Composite material, brazing alloys and process of manufacture |
| US3063144A (en) * | 1956-04-16 | 1962-11-13 | American Lava Corp | Metal-to-ceramic seals |
| US3371406A (en) * | 1965-11-26 | 1968-03-05 | Philips Corp | Hermetic electrical lead-in assembly |
| US3936320A (en) * | 1972-10-18 | 1976-02-03 | Nuclear Battery Corporation | Header |
| FR2217290B1 (enrdf_load_stackoverflow) * | 1972-12-01 | 1975-03-28 | Quartex Sa | |
| US3906311A (en) * | 1974-02-27 | 1975-09-16 | Mallory & Co Inc P R | Metal-to-glass-to-ceramic seal |
| US3920888A (en) * | 1974-06-04 | 1975-11-18 | Nuclear Battery Corp | Electrical feed-through assembly suitable for electronic devices implantable in a human body |
| US4016527A (en) * | 1975-09-25 | 1977-04-05 | North American Philips Corporation | Hermetically sealed film resistor |
| US4078711A (en) * | 1977-04-14 | 1978-03-14 | Rockwell International Corporation | Metallurgical method for die attaching silicon on sapphire devices to obtain heat resistant bond |
| US4180700A (en) * | 1978-03-13 | 1979-12-25 | Medtronic, Inc. | Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs |
-
1980
- 1980-01-28 CH CH7375/80A patent/CH649411A5/de not_active IP Right Cessation
- 1980-01-28 DE DE803030687T patent/DE3030687T1/de active Granted
- 1980-01-28 WO PCT/US1980/000126 patent/WO1980001620A1/en active Application Filing
- 1980-01-29 CA CA000344568A patent/CA1143024A/en not_active Expired
- 1980-08-22 EP EP80900389A patent/EP0022863A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE3030687T1 (de) | 1981-02-12 |
| EP0022863A1 (en) | 1981-01-28 |
| CH649411A5 (de) | 1985-05-15 |
| CA1143024A (en) | 1983-03-15 |
| WO1980001620A1 (en) | 1980-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Free format text: STREHL, P., DIPL.-ING. DIPL.-WIRTSCH.-ING. SCHUEBEL-HOPF, U., DIPL.-CHEM. DR.RER.NAT. GROENING, H., DIPL.-ING., PAT.-ANWAELTE, 8000 MUENCHEN |
|
| 8339 | Ceased/non-payment of the annual fee |