WO1980001620A1 - Hermetic electrical feedthrough assembly - Google Patents

Hermetic electrical feedthrough assembly Download PDF

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Publication number
WO1980001620A1
WO1980001620A1 PCT/US1980/000126 US8000126W WO8001620A1 WO 1980001620 A1 WO1980001620 A1 WO 1980001620A1 US 8000126 W US8000126 W US 8000126W WO 8001620 A1 WO8001620 A1 WO 8001620A1
Authority
WO
WIPO (PCT)
Prior art keywords
niobium
gold
feedthrough
insulator
sapphire
Prior art date
Application number
PCT/US1980/000126
Other languages
French (fr)
Inventor
R Kraska
J Lessar
F Wilary
Original Assignee
Medtronic Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Medtronic Inc filed Critical Medtronic Inc
Priority to DE803030687T priority Critical patent/DE3030687T1/en
Publication of WO1980001620A1 publication Critical patent/WO1980001620A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183—Sealing members
    • H01M50/186—Sealing members characterised by the disposition of the sealing members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/183—Sealing members
    • H01M50/19—Sealing members characterised by the material
    • H01M50/191—Inorganic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • This invention relates to a hermetic electrical feed-through assembly which, makes use of niobium and sapphire.
  • the optical transparency of sapphire allows visual inspection of the. sapphire-to-niobium bond for the presence of defects.
  • Hermetic seals in electrical feedthroughs consisting of the. specific combinations of materials disclosed herein and prepared according to this invention have been found to be more likely to resist delamination between the insulator and metal members of the feedthrough i.e., they are. more resistant to stress induced cracking during fabrication or testing.
  • Sapphire is an aluminum oxide which is grown with a single crystal lattice structure and can be easily cut and polished to optical clarity without creating cracks or defects. If cracks or defects do result during preparation of a sapphire insulator for a feedthrough or during fabrication of the feedthrough assembly, they can be easily seen at low magnification. The ease of visual inspection consequently allows for 100% final product inspection.
  • hermetic electrical feedthroughs which, are particularly adapted for use in encapsulated electrical devices, such as electrochemical cells, heartpacers: and the like for human implant.
  • Such devices require high assurety against the presence of defects and loss of hermeticity in the feedthroughs.
  • the improved feedthrough of the. invention consists of a niobium lead wire extending through a sapphire, insula tor, preferably a disc-like insulator.
  • the sapphire insulator is carried by a niobium ferrule or the like.
  • the assembly is brazed together by means of either a gold braze or a gold-vanadium-yttrium alloy braze. Some compositional variations are allowed in this alloy as is discussed below.
  • the surfaces of the sapphire in the brazed areas are first metallized with, a discrete layer of niobium, titanium or a composition of the two i.e., niobium/titanium and a layer of gold the gold overlaying the niobium/titanium.
  • Niobium is preferred over the titanium or compositions of the two in certain instances.
  • Figure 1 is the. schematic cross-section of a first embodiment of a feedthrough according to the invention.
  • Figure 2 is a schematic cross-section of another embodiment" of a feedthrough. according to the invention.
  • Figure.3 is yet another schematic cross-section showing a third embodimen of a feedthrough according to the invention.
  • Figure 4 is a schematic cross-section of a fourth embodiment of the invention.
  • the electrical feedthroughs shown in Figures 1-4 represent several variations of the invention. The same numbers are used to identify similar elements throughout the Figures. All of the embodiments, include a more or less centrally positioned niobium lead-in wire or pin 10 extending through a sapphire insulator body 12. Body 12 is preferably generally disc shaped. Even more preferably, the sapphire body will Be fabricated with a cup-like surface 12 (a) as shown in Figures 1 and 2.
  • the feedthrough assembly also includes a niobium ferrule or the like 14 which may more or less peripherally contact sapphire body 12 as is well known in the case of metal ferrule and glass Insulator arrangements already known In this art. Ferrule 14 Is utilized for mounting the feedthrough. For example, in a preferred use, this feedthrough will be mounted in a titanium encapsulating structure (not shown) which contains an electrical device for human implant. Normally, theferrule will be welded to the titanium container.
  • the niobium used for the lead wire and ferrule herein may also be a niobium alloy so long as its thermal expansion coefficient remains about ⁇ 10% of that. of commercially pure niobium.
  • An example of such an alloy is. 99Nb-1Zr (Wt.%).
  • Wt.% 99Nb-1Zr
  • brazing of the feedthrough. assembly may be accomplished by placing rings of the brazing material at the joints to be brazed and heating the. assembly to the appropriate melting temperature of the braze material.
  • the acceptable brazing materials comprises alloys of gold, vanadium and yttrium and/or scandium, optionally including niobium. Assemblies using this alloy brazing material are shown in Figures 1, 2 and 3.
  • Brazing alloys of the foregoing type which may be utilized with this invention are disclosed in copendlng application Serial No. 885,489, filed March 13, 19.78 and assigned to the same assignee as is this application.
  • the alloys may Include scandium and niobium.
  • One exemplary alloy is vanadium-5.5%, yttrium- 0.2%, balance gold, the percentages being expressed in terms of atomic percentages.
  • braze material which, may be used, as mentioned above, is gold i.e., commercially pure gold (99.9%).
  • the pure gold braze material Is utilized the sapphire must first be provided with a coating of niobium, titanium or niobium/titanium and a coating of gold over the niobium or titanium in the areas where the brazed joint Is to be formed.
  • Various, proportions of niobium and titanium may be co-sputtered to form layer 19.
  • These coatings are preferably formed by sputtering and may be very thin.
  • the niobium, titanium or niobium/titanium coating will have a thickness on the order of about 10,000 angstroms and the gold will have a thickness on the orderof about 2,000 angstroms.
  • a metallized version Is shown in Figure 4, the niobium or titanium and gold layers being schematically indicated at 18 and 19, respectively, the gold braze at 16.
  • the different braze material may be used in any of the feedthrough. configurations disclosed herein.
  • the various configurations differ in geometry, Figure 1 Being the simplest.
  • Figure 2 and 3 are self-fixturing due to the notched, portions included in either the ferrule body 14, as shown in Figure 2, or in the. insulator body 12, as shown in Figure 3.
  • the sapphire used herein may be the "clear" sapphire or the "doped” sapphire i.e., sapphire containing a few tenths of a percent of a dopant such as chromium, cobalt or nickel and taking on a characteristic color such as ruby, Blue or emerald, respectively.
  • a dopant such as chromium, cobalt or nickel

Abstract

A hermetic feedthrough assembly consists of a niobium pin (10) surrounded by a sapphire insulator (12) which is carried by a niobium ferrule (14). The hermetic seal between the insulator, the ferrule and the pin is often subject to delamination as a result of cracking induced by stresses associated with the fabrication and testing procedures. Hermeticity can be maintained by brazing the assembly together with a braze (16) of gold or a gold-vanadium-yettrium alloy. The sapphire insulator must be metallized when the gold braze is used, the metallization consisting of a coating (19) of niobium, titanium or alloys thereof and an overlayer (18) of gold. Such hermetic feedthrough assemblies are adapted for use in encapsulated electrical devices, such as electrochemical cells and heart pacemakers implanted within the human body.

Description

HERMETIC ELECTRICAL FEEDTHROUGH ASSEMBLY I. DESCRIPTION. Background of Prior Art.
This application is a continuation-in-part of parent application Serial No. 7,153, filed January 29, 1979, for HERMETIC ELECTRICAL FEEDTHROUGH ASSEMBLY.
This invention relates to a hermetic electrical feed-through assembly which, makes use of niobium and sapphire. The optical transparency of sapphire allows visual inspection of the. sapphire-to-niobium bond for the presence of defects. Hermetic seals in electrical feedthroughs consisting of the. specific combinations of materials disclosed herein and prepared according to this invention have been found to be more likely to resist delamination between the insulator and metal members of the feedthrough i.e., they are. more resistant to stress induced cracking during fabrication or testing.
Sapphire is an aluminum oxide which is grown with a single crystal lattice structure and can be easily cut and polished to optical clarity without creating cracks or defects. If cracks or defects do result during preparation of a sapphire insulator for a feedthrough or during fabrication of the feedthrough assembly, they can be easily seen at low magnification. The ease of visual inspection consequently allows for 100% final product inspection.
The specific combination of materials i.e., sapphire and niobium, are resistant to defect formation during manufacture. Hence, greater yields are provided. Off-the-shelf watch jewels of s.apphire are. readily available, for use in accordance with this invention.
It is a purpose of this invention to provide high yield electrical feedthroughs which can be optically inspected.
Additionally, and more importantly, it is a purpose of this invention to provide improved hermetic electrical feedthroughs which, are particularly adapted for use in encapsulated electrical devices, such as electrochemical cells, heartpacers: and the like for human implant. Such devices require high assurety against the presence of defects and loss of hermeticity in the feedthroughs.
Brief Summary of the Invention.
The improved feedthrough of the. invention consists of a niobium lead wire extending through a sapphire, insula tor, preferably a disc-like insulator. The sapphire insulator is carried by a niobium ferrule or the like. The assembly is brazed together by means of either a gold braze or a gold-vanadium-yttrium alloy braze. Some compositional variations are allowed in this alloy as is discussed below. When the gold braze is used, the surfaces of the sapphire in the brazed areas are first metallized with, a discrete layer of niobium, titanium or a composition of the two i.e., niobium/titanium and a layer of gold the gold overlaying the niobium/titanium. Niobium is preferred over the titanium or compositions of the two in certain instances.
Brief Description of the Drawings.
Figure 1 is the. schematic cross-section of a first embodiment of a feedthrough according to the invention. Figure 2 is a schematic cross-section of another embodiment" of a feedthrough. according to the invention.
Figure.3 is yet another schematic cross-section showing a third embodimen of a feedthrough according to the invention. Figure 4 is a schematic cross-section of a fourth embodiment of the invention.
Detailed Description of the Invention.
The electrical feedthroughs shown in Figures 1-4 represent several variations of the invention. The same numbers are used to identify similar elements throughout the Figures. All of the embodiments, include a more or less centrally positioned niobium lead-in wire or pin 10 extending through a sapphire insulator body 12. Body 12 is preferably generally disc shaped. Even more preferably, the sapphire body will Be fabricated with a cup-like surface 12 (a) as shown in Figures 1 and 2. The feedthrough assembly also includes a niobium ferrule or the like 14 which may more or less peripherally contact sapphire body 12 as is well known in the case of metal ferrule and glass Insulator arrangements already known In this art. Ferrule 14 Is utilized for mounting the feedthrough. For example, in a preferred use, this feedthrough will be mounted in a titanium encapsulating structure (not shown) which contains an electrical device for human implant. Normally, theferrule will be welded to the titanium container.
The niobium used for the lead wire and ferrule herein may also be a niobium alloy so long as its thermal expansion coefficient remains about ± 10% of that. of commercially pure niobium. An example of such an alloy is. 99Nb-1Zr (Wt.%). Herein, when these components are described as consisting essentially of niobium, such alloys are intended to be Included along with pure niobium.
The members of the feedthrough are assemhled together by brazing. As is well known in the art, brazing of the feedthrough. assembly may be accomplished by placing rings of the brazing material at the joints to be brazed and heating the. assembly to the appropriate melting temperature of the braze material. However, in the Instance of this invention, only two brazing materials are acceptable. One of the acceptable brazing materials comprises alloys of gold, vanadium and yttrium and/or scandium, optionally including niobium. Assemblies using this alloy brazing material are shown in Figures 1, 2 and 3.
Brazing alloys of the foregoing type which may be utilized with this invention are disclosed in copendlng application Serial No. 885,489, filed March 13, 19.78 and assigned to the same assignee as is this application. As Indicated therein, the alloys may Include scandium and niobium. One exemplary alloy is vanadium-5.5%, yttrium- 0.2%, balance gold, the percentages being expressed in terms of atomic percentages.
Another and the most preferred braze material which, may be used, as mentioned above, is gold i.e., commercially pure gold (99.9%). However, when the pure gold braze material Is utilized, the sapphire must first be provided with a coating of niobium, titanium or niobium/titanium and a coating of gold over the niobium or titanium in the areas where the brazed joint Is to be formed. Various, proportions of niobium and titanium may be co-sputtered to form layer 19. Such an alloy Is referred to herein as "niohlum/tltanlum". These coatings, are preferably formed by sputtering and may be very thin. Preferably, the niobium, titanium or niobium/titanium coating will have a thickness on the order of about 10,000 angstroms and the gold will have a thickness on the orderof about 2,000 angstroms. Such a metallized version Is shown in Figure 4, the niobium or titanium and gold layers being schematically indicated at 18 and 19, respectively, the gold braze at 16. Niobium Is the preferred coating material 19 although titanium is acceptable for use in dry and low temperature environments. Niobium Is less, susceptible to degradation and corrosion when exposed to moisture than the titanium or niobium/titanium is.
The different braze material may be used in any of the feedthrough. configurations disclosed herein. The various configurations differ in geometry, Figure 1 Being the simplest. Figure 2 and 3 are self-fixturing due to the notched, portions included in either the ferrule body 14, as shown in Figure 2, or in the. insulator body 12, as shown in Figure 3.
The sapphire used herein may be the "clear" sapphire or the "doped" sapphire i.e., sapphire containing a few tenths of a percent of a dopant such as chromium, cobalt or nickel and taking on a characteristic color such as ruby, Blue or emerald, respectively.
Having described the invention, the exclusive rights and priviliges thereto are to be defined by the following claims in the light of the foregoing description.

Claims

II. CLAIMS .
1. An electrical feedthrough comprising an electrical lead-wire consisting essentially of niobium; and insulator around a portion of the lead-wire, the insulator consisting essentially. of sapphire; a ferrule consisting essentially of niobium positioned around at least a peripheral portion of the insulator, and brazes joining the lead-wire to the Insulator and the Insulator to the ferrule, the braze composition being selected from the group consisting of substantially pure gold, the sapphire Being first metallized at the areas to be brazed when pure gold Is used, and an alloy of gold, vanadium, yttrium and/or scandium and optionally Including an amount of niobium.
2. The feedthrough of Claim 1 in which the surfaces of the sapphire at the brazed areas are metallized.
3. The feedthrough of Claim 2 in which the metallization consists of a layer selected from the group consisting of titanium, niobium and niobium/titanium, and a layer of gol d.
4. The feedthrough of Claim 3 in which the gold layer overlays the other layer.
5. The feedthrough of Claim 4 in which the other layer is about 10,000 angstroms thick and the gold is less thick .
6. The feedthrough of Claim 5 in which the gold layer is about 2,000 angstroms thick.
7. The feedthrough of Claim 1, 2, 3, 4, 5 or 6 in which the braze composition is gold.
PCT/US1980/000126 1979-01-29 1980-01-28 Hermetic electrical feedthrough assembly WO1980001620A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE803030687T DE3030687T1 (en) 1979-01-29 1980-01-28 HERMETIC ELECTRICAL FEEDTHROUGH ASSEMBLY

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US715379A 1979-01-29 1979-01-29
US5198779A 1979-06-25 1979-06-25
US7153 2001-12-04

Publications (1)

Publication Number Publication Date
WO1980001620A1 true WO1980001620A1 (en) 1980-08-07

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EP (1) EP0022863A1 (en)
CA (1) CA1143024A (en)
CH (1) CH649411A5 (en)
DE (1) DE3030687T1 (en)
WO (1) WO1980001620A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4678868A (en) * 1979-06-25 1987-07-07 Medtronic, Inc. Hermetic electrical feedthrough assembly
EP0257954A2 (en) * 1986-08-15 1988-03-02 Medtronic, Inc. Oxygen sensing pacemaker
EP0269007A1 (en) * 1986-11-28 1988-06-01 Siemens Aktiengesellschaft Ceramic-metal feedthrough assembly, in particular for cardiac or neural stimulation, and method of manufacturing it
FR2766719A1 (en) * 1997-05-06 1999-02-05 Medtronic Inc CAPACITIVE FILTER CROSSOVER FOR AN IMPLANTABLE MEDICAL DEVICE
US5902326A (en) * 1997-09-03 1999-05-11 Medtronic, Inc. Optical window for implantable medical devices
WO2000025861A1 (en) 1998-10-30 2000-05-11 Medtronic, Inc. Light barrier for medical electrical lead oxygen sensor
WO2000025860A1 (en) 1998-10-30 2000-05-11 Medtronic, Inc. Tissue overgrowth detector for implantable medical device
WO2000025862A1 (en) 1998-10-30 2000-05-11 Medtronic, Inc. Multiple lens oxygen sensor for medical electrical lead
US6134459A (en) * 1998-10-30 2000-10-17 Medtronic, Inc. Light focusing apparatus for medical electrical lead oxygen sensor
US6144866A (en) * 1998-10-30 2000-11-07 Medtronic, Inc. Multiple sensor assembly for medical electric lead
US6163723A (en) * 1998-10-22 2000-12-19 Medtronic, Inc. Circuit and method for implantable dual sensor medical electrical lead
US6248080B1 (en) 1997-09-03 2001-06-19 Medtronic, Inc. Intracranial monitoring and therapy delivery control device, system and method
CN103298763A (en) * 2011-02-18 2013-09-11 肖特公开股份有限公司 Feed-through
DE102021110048A1 (en) 2021-04-21 2022-10-27 Schott Ag Feedthrough through a housing component, especially for harsh, mechanically and thermally stressed environments

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6830249B2 (en) * 2002-04-22 2004-12-14 General Electric Company Brazeable, multi-lead, low profile sealing fitting and method of installation

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US3063144A (en) * 1956-04-16 1962-11-13 American Lava Corp Metal-to-ceramic seals
US3371406A (en) * 1965-11-26 1968-03-05 Philips Corp Hermetic electrical lead-in assembly
US3936320A (en) * 1972-10-18 1976-02-03 Nuclear Battery Corporation Header
US3901772A (en) * 1972-12-01 1975-08-26 Quartex Societe Pour L Applic Method of sealing by brazing of a metal part on a ceramic part
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Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4678868A (en) * 1979-06-25 1987-07-07 Medtronic, Inc. Hermetic electrical feedthrough assembly
EP0257954A2 (en) * 1986-08-15 1988-03-02 Medtronic, Inc. Oxygen sensing pacemaker
EP0257954A3 (en) * 1986-08-15 1988-08-10 Medtronic, Inc. Oxygen sensing pacemaker
EP0269007A1 (en) * 1986-11-28 1988-06-01 Siemens Aktiengesellschaft Ceramic-metal feedthrough assembly, in particular for cardiac or neural stimulation, and method of manufacturing it
US4816621A (en) * 1986-11-28 1989-03-28 Siemens Aktiengesellschaft Ceramic-metal feedthrough lead assembly and method for making same
FR2766719A1 (en) * 1997-05-06 1999-02-05 Medtronic Inc CAPACITIVE FILTER CROSSOVER FOR AN IMPLANTABLE MEDICAL DEVICE
US5902326A (en) * 1997-09-03 1999-05-11 Medtronic, Inc. Optical window for implantable medical devices
US6248080B1 (en) 1997-09-03 2001-06-19 Medtronic, Inc. Intracranial monitoring and therapy delivery control device, system and method
US6163723A (en) * 1998-10-22 2000-12-19 Medtronic, Inc. Circuit and method for implantable dual sensor medical electrical lead
US6134459A (en) * 1998-10-30 2000-10-17 Medtronic, Inc. Light focusing apparatus for medical electrical lead oxygen sensor
WO2000025861A1 (en) 1998-10-30 2000-05-11 Medtronic, Inc. Light barrier for medical electrical lead oxygen sensor
US6125291A (en) * 1998-10-30 2000-09-26 Medtronic, Inc. Light barrier for medical electrical lead oxygen sensor
WO2000025862A1 (en) 1998-10-30 2000-05-11 Medtronic, Inc. Multiple lens oxygen sensor for medical electrical lead
US6144866A (en) * 1998-10-30 2000-11-07 Medtronic, Inc. Multiple sensor assembly for medical electric lead
WO2000025860A1 (en) 1998-10-30 2000-05-11 Medtronic, Inc. Tissue overgrowth detector for implantable medical device
US6198952B1 (en) 1998-10-30 2001-03-06 Medtronic, Inc. Multiple lens oxygen sensor for medical electrical lead
US6125290A (en) * 1998-10-30 2000-09-26 Medtronic, Inc. Tissue overgrowth detector for implantable medical device
CN103298763A (en) * 2011-02-18 2013-09-11 肖特公开股份有限公司 Feed-through
CN103298762A (en) * 2011-02-18 2013-09-11 肖特公开股份有限公司 Feed-through
CN103380097A (en) * 2011-02-18 2013-10-30 肖特公开股份有限公司 Feed-through, in particular for batteries and method for integrating said feed-through in a housing by means of ultrasonic welding
CN103298763B (en) * 2011-02-18 2016-03-30 肖特公开股份有限公司 Feedthrough
CN103380097B (en) * 2011-02-18 2016-11-09 肖特公开股份有限公司 For the Feed-through of particularly battery and utilize the method that Feed-through is incorporated in shell by ultrasound wave melting welding
US9527157B2 (en) 2011-02-18 2016-12-27 Schott Ag Feed-through
CN103298762B (en) * 2011-02-18 2017-09-26 肖特公开股份有限公司 Feedthrough
DE102021110048A1 (en) 2021-04-21 2022-10-27 Schott Ag Feedthrough through a housing component, especially for harsh, mechanically and thermally stressed environments

Also Published As

Publication number Publication date
DE3030687C2 (en) 1991-06-13
CA1143024A (en) 1983-03-15
CH649411A5 (en) 1985-05-15
EP0022863A1 (en) 1981-01-28
DE3030687T1 (en) 1981-02-12

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