JPS6367761A - Air-tight glass terminal - Google Patents
Air-tight glass terminalInfo
- Publication number
- JPS6367761A JPS6367761A JP21242186A JP21242186A JPS6367761A JP S6367761 A JPS6367761 A JP S6367761A JP 21242186 A JP21242186 A JP 21242186A JP 21242186 A JP21242186 A JP 21242186A JP S6367761 A JPS6367761 A JP S6367761A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- iron
- glass
- lead wire
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 36
- 238000007747 plating Methods 0.000 claims abstract description 55
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 41
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 39
- 238000005260 corrosion Methods 0.000 claims abstract description 24
- 230000007797 corrosion Effects 0.000 claims abstract description 24
- 229910052742 iron Inorganic materials 0.000 claims abstract description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 150000002505 iron Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 229910000833 kovar Inorganic materials 0.000 abstract description 5
- 230000001590 oxidative effect Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 9
- 235000013980 iron oxide Nutrition 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- -1 cobalt metal oxide Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、半導体素子などを搭載するのに用いられる気
密ガラス端子（以下気密端子という）に係り、特に、耐
食性および気密特性に優れた気密端子に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to an airtight glass terminal (hereinafter referred to as an airtight terminal) used for mounting semiconductor elements, etc. Regarding terminals.
（従来技術とその問題点）
前述した気密端子には、一般に、第２図（ａ）に−例を
示すように、鉄−ニッケルーコバルト合金（以下コバー
ルと称する）からなるアイレフト（金属外環）１を有す
るものがある。このアイレット１は＋部開口２を備えた
深皿状に形成され、その頂壁３にはリード線４が遊挿さ
れる開口５が穿設されている。なお９はアースリード線
である。(Prior art and its problems) The above-mentioned airtight terminal generally has an eye left (metallic outer ring) made of an iron-nickel-cobalt alloy (hereinafter referred to as Kovar), as shown in FIG. 2(a). )1. This eyelet 1 is formed in the shape of a deep dish with an opening 2 at the positive end, and an opening 5 is formed in the top wall 3 of the eyelet 1, into which a lead wire 4 is loosely inserted. Note that 9 is a ground lead wire.
そして、これらの開口５には、アイレット１と同様、コ
バールからなるリード線４力に挿通され、これらアイレ
ット１、リード線４、およびアースリード線９は、アイ
レット１内に充處された硬質ガラス６により気密に封止
されている。Similarly to the eyelet 1, lead wires 4 made of Kovar are inserted into these openings 5, and these eyelets 1, lead wires 4, and ground lead wires 9 are made of hard glass filled in the eyelet 1. 6, hermetically sealed.
このような気密端子は、従来、アイレフト表面およびリ
ード線表面にＦｅ２ｅ３、Ｆｅ３ｅ４等鉄の酸化膜を形
成した後に、これらのアイレッ日および各リード線４．
９を成形しである硬質ガラスとともに組立て、加熱処理
によりガラスを溶融してこのガラス６によりアイレット
１および各リード線４．９を気密に溶着する。その後、
ガラス６がら露出しているアイレット１および各リード
線４．９の部位にめっき７を施して気密端子が形成され
る。Conventionally, such an airtight terminal is manufactured by forming an oxide film of iron such as Fe2e3 or Fe3e4 on the eye left surface and the lead wire surface, and then attaching the eye left surface and each lead wire 4.
9 is assembled with molded hard glass, the glass is melted by heat treatment, and the eyelet 1 and each lead wire 4.9 are hermetically welded to this glass 6. after that,
Plating 7 is applied to the eyelet 1 and each lead wire 4.9 exposed through the glass 6 to form an airtight terminal.
しかしながら、前述した従来の気密端子においては、各
リード線４．９に負荷がかかるなどして各リード線４．
９が曲がったりすると、第３図にＡで示すようにリード
線４または９の外周のガラス６のメニスカス部６ａが欠
けてめっきが施されていない部位のリード線４ （また
は９）が露出することがある。そして、この部位の各リ
ード線４．９が直接外気に触れるため錆が発生し、耐食
性が低下する問題があった。However, in the conventional airtight terminal described above, each lead wire 4.9 is subjected to a load, etc.
If the lead wire 9 is bent, the meniscus portion 6a of the glass 6 on the outer periphery of the lead wire 4 or 9 will be chipped and the unplated portion of the lead wire 4 (or 9) will be exposed, as shown by A in FIG. Sometimes. Since each lead wire 4.9 in this portion is directly exposed to the outside air, rust occurs, resulting in a problem of reduced corrosion resistance.
なお、第２図（ｂ）に示すような気密端子においても、
リード線４の外周のガラス６ａが欠け、同様の問題があ
った。In addition, even in the airtight terminal as shown in Fig. 2(b),
The glass 6a on the outer periphery of the lead wire 4 was chipped, causing a similar problem.
上記の問題点を解消するため、第４図に示すように、リ
ード線４．９にニッケルおよび／またはコバルトめっき
からなる下地めっき８を施し、次いで酸化雰囲気中で加
熱処理して下地めっき８上にニッケルおよび／またはコ
バルトの金属酸化膜を形成し７、このように処理したリ
ード線４．９をアイレット１、ガラス６と共に溶着治具
中に組込み、加熱処理によりガラスを溶融してガラス６
によりアイレット１および各リード線４．９を気密に溶
着したものがある（特願昭６１−１５８２６１号）。In order to solve the above problems, as shown in FIG. 4, the lead wire 4.9 is coated with a base plating 8 made of nickel and/or cobalt plating, and then heat-treated in an oxidizing atmosphere to coat the base plating 8. A metal oxide film of nickel and/or cobalt is formed on the lead wire 7, and the lead wire 4.9 treated in this way is incorporated into a welding jig together with the eyelet 1 and the glass 6, and the glass is melted by heat treatment to form the glass 6.
There is a device in which the eyelet 1 and each lead wire 4.9 are hermetically welded (Japanese Patent Application No. 158261/1982).
このような気密端子においては、ニッケルおよび／また
はコバルトの金属酸化膜とガラス６との密着強度が充分
でなく、上記の下地めっき８を施した段階でリード線４
．９に高温の加熱処理を施してリード線素材中の鉄を下
地めっき８表面にまで拡散させ、この拡散した鉄の酸化
物を形成して、ガラス６との気密性を向上させることが
必要であることが判明した。In such an airtight terminal, the adhesion strength between the nickel and/or cobalt metal oxide film and the glass 6 is insufficient, and the lead wire 4 is removed at the stage where the base plating 8 is applied.
．． It is necessary to apply high temperature heat treatment to the lead wire material 9 to diffuse the iron in the lead wire material to the surface of the base plating 8, and to form oxides of the diffused iron to improve the airtightness with the glass 6. It turns out that there is something.
しかしこの場合、鉄を下地めっき８表面にまで拡散させ
るた′めには高温で長時間の加熱処理を必要とし、また
この加熱処理中にリード線同志のくっ付きが甚だしく、
実用性に問題がある。However, in this case, in order to diffuse the iron to the surface of the base plating 8, heat treatment at high temperature for a long time is required, and during this heat treatment, the lead wires stick together severely.
There is a problem with practicality.
（発明の目的）
そこで本発明は上述の問題点を克服し、耐食性かつ気密
特性に優れる気密端子を提供することを目的とする。(Objective of the Invention) Therefore, an object of the present invention is to overcome the above-mentioned problems and provide an airtight terminal having excellent corrosion resistance and airtightness characteristics.
（発明の概要）
上記目的による本発明の気密端子は、アイレットと、鉄
を含む素材からなるリード線とを有し、ガラスにより前
記アイレフトおよびリード線を気密に封止してなる気密
ガラス端子において、前記リード線は、リード線素材上
にニッケルめっき等の耐食めっきが施され、さらにこの
耐食めっき上に鉄を主成分とするめっきが施され、さら
にまたこの鉄を主成分とするめっきの酸化物が形成され
て、この酸化物との間で前記ガラスにより気密に封止さ
れていることを特徴としている。(Summary of the Invention) The airtight terminal of the present invention for the above purpose is an airtight glass terminal comprising an eyelet and a lead wire made of a material containing iron, and the eye left and the lead wire are hermetically sealed with glass. , the lead wire is formed by applying corrosion-resistant plating such as nickel plating on the lead wire material, further applying iron-based plating on this corrosion-resistant plating, and further oxidizing the iron-based plating. It is characterized in that a substance is formed and hermetically sealed between the oxide and the glass.
（実施例）
以下には本発明の好適な一実施例を添付図面に基づいて
詳細に説明する。(Embodiment) A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
なお前記従来のものと同一の部材は同一符号をもって示
し、その説明は省略する。Incidentally, the same members as those of the conventional one are indicated by the same reference numerals, and the explanation thereof will be omitted.
第１図に示すように本発明においては、コバール製のリ
ード線４．９外表面にニッケルめっき等の耐食めっき１
０が施される。次いでこの耐食めっき１０が施されたリ
ード線４．９を７００℃程度の還元性雰囲気中で適度に
加熱処理して（素材中の鉄が耐食めっき表面にまで拡散
しない、程度に）、素材と耐食めっき１０とのなじみを
よくする。As shown in FIG. 1, in the present invention, the outer surface of the Kovar lead wire 4.9 is coated with corrosion-resistant plating such as nickel plating.
0 is applied. Next, the lead wire 4.9 coated with this corrosion-resistant plating 10 is moderately heat-treated in a reducing atmosphere at about 700°C (to the extent that the iron in the material does not diffuse to the surface of the corrosion-resistant plating), and the material and Improves compatibility with corrosion-resistant plating 10.
次に耐食めっき１０上に鉄めっき、鉄−ニッケルめっき
等の鉄を主成分とするめっき１１（以下単に鉄めっきと
いう。図示せず）を０．１〜５μｍ程度施す。Next, on the corrosion-resistant plating 10, a plating 11 whose main component is iron such as iron plating or iron-nickel plating (hereinafter simply referred to as iron plating, not shown) is applied to a thickness of about 0.1 to 5 μm.
次いで酸化性雰囲気中で加熱処理して鉄めっき１１の酸
化物を形成する。Next, heat treatment is performed in an oxidizing atmosphere to form an oxide of iron plating 11.
そしてこの外表面に鉄の酸化物が形成されたリード線４
．９をアイレット１とガラス６と共に溶着治具（図示せ
ず）中に組込み、１０００℃程度の加熱処理によりガラ
スを熔融して、ガラス６によりアイレット１および各リ
ード線４．９を気密に溶着するのである。The lead wire 4 has iron oxide formed on its outer surface.
．． 9 is assembled into a welding jig (not shown) together with the eyelet 1 and the glass 6, the glass is melted by heat treatment at about 1000°C, and the eyelet 1 and each lead wire 4.9 are hermetically welded by the glass 6. It is.
鉄の酸化物とガラス６とはなじみが極めてよく、鉄の酸
化物がガラス中に拡散することで両者は極めて強固に接
合し、高温時でも優れた気密性を有する。The iron oxide and the glass 6 are extremely compatible, and as the iron oxide diffuses into the glass, they are bonded extremely firmly and have excellent airtightness even at high temperatures.
上記のように形成したのち、外部に露出しているアイレ
ット１および各リード線４．９の部位上には必要な外装
めっき１２を施して気密端子が形成される。この場合前
記の鉄めっきの酸化物は、外装めっき１２のめっき前処
理としての酸処理で容易に除去することができ、直接耐
食めっき１０上に外装めっき１２を施すことができる。After forming as described above, necessary exterior plating 12 is applied to the portions of the eyelet 1 and each lead wire 4.9 exposed to the outside to form an airtight terminal. In this case, the oxides of the iron plating can be easily removed by acid treatment as a pre-treatment for the exterior plating 12, and the exterior plating 12 can be directly applied on the corrosion-resistant plating 10.
このようにして形成された気密端子は、各リード線４．
９素村上にあらかじめ耐食めっき１０が施されているの
で、ガラス６ａが欠けて外装めっき１２が施されていな
い部位の各リード線４．９が露出したとしても、各リー
ド線４．９素材が外気に触れて錆びるおそれがない。The airtight terminal thus formed is attached to each lead wire 4.
Since the corrosion-resistant plating 10 has been applied in advance on the top of the 9th element, even if the glass 6a is chipped and each lead wire 4.9 is exposed in the area where the exterior plating 12 is not applied, each lead wire 4.9 material will remain intact. There is no risk of rust due to exposure to outside air.
なおガラス６ａが欠けた部位の耐食めっき１０上には鉄
めっき１１が施されているが、鉄の酸化物はガラス６中
に拡散してしまうこと、また耐食めっき１０が存在する
こともあってリード線４．９素材に錆が発生することは
ない。Note that iron plating 11 is applied on the corrosion-resistant plating 10 in the area where the glass 6a is chipped, but iron oxides will diffuse into the glass 6 and the corrosion-resistant plating 10 is also present. Lead wire 4.9 No rust will occur on the material.
実際に塩水噴霧試験を行って耐食性を調べたところ錆の
発生は皆無であった。When we actually conducted a salt spray test to examine the corrosion resistance, no rust occurred.
また前述のごとく、鉄の酸化物とガラス６とのＶＩ！着
性は掻めて良好なので、耐熱気密特性にも極めて優れて
いる。Also, as mentioned above, VI! of iron oxide and glass 6! Since the adhesion is easily scratched, it also has excellent heat-resistant and airtight properties.
またリード線４．９およびアイレット１の素材はコバー
ルに限られず、４２７０イ（鉄−ニッケル合金）等の素
材にも通用できる。Further, the material of the lead wire 4.9 and the eyelet 1 is not limited to Kovar, but materials such as 4270I (iron-nickel alloy) can also be used.
また耐食めっき１０もニッケルめっきに限られないこと
はもちろんであり、耐食めっき１０は、少なくともガラ
ス６ａが欠ける可能性のある範囲に亘って、リード線に
部分的にめっきを施すようにしてもよい。Furthermore, it goes without saying that the corrosion-resistant plating 10 is not limited to nickel plating, and the corrosion-resistant plating 10 may be partially plated on the lead wire, at least over a range where the glass 6a may be chipped. .
（発明の効果）
以上のように本発明に係る気密端子によれば耐食性、耐
熱気密特性に優れるという著効を奏する。(Effects of the Invention) As described above, the airtight terminal according to the present invention has excellent corrosion resistance and heat-resistant airtightness.
以上本発明につき好適な実施例を挙げて種々説明したが
、本発明はこの実施例に限定されるものではなく、発明
の精神を逸脱しない範囲内で多（の改変を施し得るのは
もちろんのことである。Although the present invention has been variously explained above with reference to preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. That's true.
第１図は本発明に係る気密端子の実施例を示す要部の縦
断面図、第２図は一般的な気密端子の一例を示す縦断面
図、第３図は従来の気密端子の要部の縦断面図である。
第４図は他の従来の気密端子の要部を示す縦断面図であ
る。
１・・・アイレフト、 ２・・・下部開口、３・・・頂
壁、 ４・・・リード線、
５・・・開口、 ６・・・ガラス、
６ａ・・・メニスカス部、 ７・・・めっき、８・・
・下地めっき、 ９・・・アースリード線、ｌＯ・・・
耐食めっき、 １１・・・飲めつき、１２・・・外装
めっき。Fig. 1 is a vertical sectional view of the main parts showing an embodiment of the airtight terminal according to the present invention, Fig. 2 is a longitudinal sectional view showing an example of a general airtight terminal, and Fig. 3 is the main parts of the conventional airtight terminal. FIG. FIG. 4 is a longitudinal sectional view showing the main parts of another conventional airtight terminal. DESCRIPTION OF SYMBOLS 1... Eye left, 2... Lower opening, 3... Top wall, 4... Lead wire, 5... Opening, 6... Glass, 6a... Meniscus part, 7... Plating, 8...
・Base plating, 9... Earth lead wire, lO...
Corrosion-resistant plating, 11...Drinkable, 12...Exterior plating.
Claims (1)
有し、ガラスにより前記アイレットおよびリード線を気
密に封止してなる気密ガラス端子において、 前記リード線は、リード線素材上にニッケ ルめっき等の耐食めっきが施され、さらにこの耐食めっ
き上に鉄を主成分とするめっきが施され、さらにまたこ
の鉄を主成分とするめっきの酸化物が形成されて、この
酸化物との間で前記ガラスにより気密に封止されている
ことを特徴とする気密ガラス端子。[Scope of Claims] 1. An airtight glass terminal having an eyelet and a lead wire made of a material containing iron, the eyelet and the lead wire being hermetically sealed with glass, wherein the lead wire is a lead wire. Corrosion-resistant plating such as nickel plating is applied to the wire material, and then iron-based plating is applied on top of this corrosion-resistant plating, and furthermore, an oxide of this iron-based plating is formed. An airtight glass terminal characterized in that the terminal is hermetically sealed between an oxide and the glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21242186A JPS6367761A (en) | 1986-09-09 | 1986-09-09 | Air-tight glass terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21242186A JPS6367761A (en) | 1986-09-09 | 1986-09-09 | Air-tight glass terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367761A true JPS6367761A (en) | 1988-03-26 |
Family
ID=16622309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21242186A Pending JPS6367761A (en) | 1986-09-09 | 1986-09-09 | Air-tight glass terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0824258A1 (en) * | 1996-08-09 | 1998-02-18 | Hitachi, Ltd. | Structure of electronic device |
-
1986
- 1986-09-09 JP JP21242186A patent/JPS6367761A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0824258A1 (en) * | 1996-08-09 | 1998-02-18 | Hitachi, Ltd. | Structure of electronic device |
| US6344790B1 (en) | 1996-08-09 | 2002-02-05 | Hitachi, Ltd. | Electronic device such as a thermistor and the like with improved corrosion resistance |
| CN1123014C (en) * | 1996-08-09 | 2003-10-01 | 株式会社日立制作所 | Structure of electronic components |
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