DE3026183C2 - - Google Patents

Info

Publication number
DE3026183C2
DE3026183C2 DE3026183A DE3026183A DE3026183C2 DE 3026183 C2 DE3026183 C2 DE 3026183C2 DE 3026183 A DE3026183 A DE 3026183A DE 3026183 A DE3026183 A DE 3026183A DE 3026183 C2 DE3026183 C2 DE 3026183C2
Authority
DE
Germany
Prior art keywords
substrate
chips
cover
connecting lines
external connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3026183A
Other languages
German (de)
English (en)
Other versions
DE3026183A1 (de
Inventor
Hiroshi Murano
Moritoshi Tokio/Tokyo Jp Akino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of DE3026183A1 publication Critical patent/DE3026183A1/de
Application granted granted Critical
Publication of DE3026183C2 publication Critical patent/DE3026183C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W40/226—
    • H10W40/47—
    • H10W70/685—
    • H10W76/12—
    • H10W90/00—
    • H10W70/63—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
DE19803026183 1979-07-10 1980-07-10 Gehaeuse fuer integrierte logikschaltkreise Granted DE3026183A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8702279A JPS5612760A (en) 1979-07-10 1979-07-10 Multi chip lsi package

Publications (2)

Publication Number Publication Date
DE3026183A1 DE3026183A1 (de) 1981-02-19
DE3026183C2 true DE3026183C2 (enExample) 1988-03-10

Family

ID=13903327

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803026183 Granted DE3026183A1 (de) 1979-07-10 1980-07-10 Gehaeuse fuer integrierte logikschaltkreise

Country Status (4)

Country Link
US (1) US4398208A (enExample)
JP (1) JPS5612760A (enExample)
DE (1) DE3026183A1 (enExample)
FR (1) FR2461361B1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818951A (ja) * 1981-07-22 1983-02-03 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体チツプ装着用基板
CA1229155A (en) * 1983-03-29 1987-11-10 Toshihiko Watari High density lsi package for logic circuits
DE3435341A1 (de) * 1984-09-26 1986-04-03 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum loesbaren befestigen von kuehlkoerpern auf einer mehrzahl von integrierten bausteinen
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
DE3633625A1 (de) * 1985-12-04 1987-06-11 Vdo Schindling Traegerplatte
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
JPS6376444A (ja) * 1986-09-19 1988-04-06 Nec Corp チツプキヤリア
FR2608863B1 (fr) * 1986-12-19 1994-04-29 Nec Corp Circuit integre logique comportant des bascules electroniques d'entree et de sortie pour stabiliser les durees des impulsions
US4805691A (en) * 1986-12-22 1989-02-21 Sundstrand Corporation Cooling technique for compact electronics inverter
US5144412A (en) * 1987-02-19 1992-09-01 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
JPS63228206A (ja) * 1987-03-17 1988-09-22 Nec Corp クロツク分配方式
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4918335A (en) * 1987-11-06 1990-04-17 Ford Aerospace Corporation Interconnection system for integrated circuit chips
US4858072A (en) * 1987-11-06 1989-08-15 Ford Aerospace & Communications Corporation Interconnection system for integrated circuit chips
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
DE3853197T2 (de) * 1987-12-07 1995-06-29 Nippon Electric Co Kühlungssystem für integrierte Schaltungspackung.
US5040052A (en) * 1987-12-28 1991-08-13 Texas Instruments Incorporated Compact silicon module for high density integrated circuits
US4907065A (en) * 1988-03-01 1990-03-06 Lsi Logic Corporation Integrated circuit chip sealing assembly
DE68918156T2 (de) * 1988-05-09 1995-01-12 Nippon Electric Co Flache Kühlungsstruktur für integrierte Schaltung.
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
EP0363687B1 (en) * 1988-09-20 1996-01-10 Nec Corporation Cooling structure for electronic components
US5285012A (en) * 1992-02-18 1994-02-08 Axon Instruments, Inc. Low noise integrated circuit package
DE4222402A1 (de) * 1992-07-08 1994-01-13 Daimler Benz Ag Anordnung für die Mehrfachverdrahtung von Mulichipmodulen
US6262477B1 (en) 1993-03-19 2001-07-17 Advanced Interconnect Technologies Ball grid array electronic package
TWI320300B (en) * 2005-11-18 2010-02-01 Dissipating heat device of fin-type
US8064224B2 (en) 2008-03-31 2011-11-22 Intel Corporation Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
US9429983B1 (en) 2013-09-12 2016-08-30 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
US8381031B2 (en) * 2009-08-07 2013-02-19 Advanced Processor Architectures, Llc Distributed computing
US11042211B2 (en) 2009-08-07 2021-06-22 Advanced Processor Architectures, Llc Serially connected computing nodes in a distributed computing system
US9645603B1 (en) 2013-09-12 2017-05-09 Advanced Processor Architectures, Llc System clock distribution in a distributed computing environment
US10014238B2 (en) * 2016-07-19 2018-07-03 Ge Energy Power Conversion Technology Ltd Method, system, and electronic assembly for thermal management

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3202888A (en) * 1962-02-09 1965-08-24 Hughes Aircraft Co Micro-miniature semiconductor devices
US3311798A (en) * 1963-09-27 1967-03-28 Trw Semiconductors Inc Component package
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3373322A (en) * 1966-01-13 1968-03-12 Mitronics Inc Semiconductor envelope
US3404215A (en) * 1966-04-14 1968-10-01 Sprague Electric Co Hermetically sealed electronic module
US3361868A (en) * 1966-08-04 1968-01-02 Coors Porcelain Co Support for electrical circuit component
US3496634A (en) * 1966-12-30 1970-02-24 Ibm Method of wiring and metal embedding an electrical back panel
US3404214A (en) * 1967-07-17 1968-10-01 Alloys Unltd Inc Flat package for semiconductors
US3519895A (en) * 1968-02-06 1970-07-07 Westinghouse Electric Corp Combination of solderless terminal assembly and semiconductor
US3649881A (en) * 1970-08-31 1972-03-14 Rca Corp High-power semiconductor device assembly
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US4082394A (en) * 1977-01-03 1978-04-04 International Business Machines Corporation Metallized ceramic and printed circuit module
US4220917A (en) * 1978-07-31 1980-09-02 International Business Machines Corporation Test circuitry for module interconnection network

Also Published As

Publication number Publication date
US4398208A (en) 1983-08-09
JPS5612760A (en) 1981-02-07
DE3026183A1 (de) 1981-02-19
JPS6249989B2 (enExample) 1987-10-22
FR2461361B1 (fr) 1985-09-13
FR2461361A1 (fr) 1981-01-30

Similar Documents

Publication Publication Date Title
DE3026183C2 (enExample)
DE2554965C2 (enExample)
DE69605286T2 (de) Organischer chipträger für chips des drahtbondtpys
DE69834561T2 (de) Halbleiteranordnung und herstellungsverfahren dafür
DE69106225T2 (de) Integrierte Schaltungseinheit mit flexiblem Substrat.
DE4410467C2 (de) Wärmesenkenanordnung mit einer thermisch leitenden Platte für eine Mehrzahl von integrierten Schaltungen auf einem Substrat
DE3786861T2 (de) Halbleiteranordnung mit Gehäuse mit Kühlungsmitteln.
DE69321864T2 (de) Verfahren und Vorrichtung zur Verkapselung von dreidimensionalen Halbleiterplättchen
DE69527473T2 (de) Halbleiteranordnung bestehend aus einem Halbleiterchip, der mittels Kontakthöckern auf der Leiterplatte verbunden ist und Montageverfahren
EP0022176B1 (de) Modul für Schaltungschips
DE10234951B4 (de) Verfahren zur Herstellung von Halbleiterschaltungsmodulen
DE3787032T2 (de) Elektronische module hoher dichte, verfahren und erzeugnis.
DE10301512A1 (de) Verkleinertes Chippaket und Verfahren zu seiner Herstellung
DE2536316C2 (de) Schaltungskarte für integrierte Halbleiterschaltungen
DE19940633A1 (de) IC-Gehäuse
DE2749848A1 (de) Kuehlkoerper fuer integrierte schaltungen
DE3887849T2 (de) Integrierte Schaltungspackung.
EP1620893B1 (de) Verfahren zur herstellung eines nutzens und verfahren zur herstellung elektronischer bauteile mit gestapelten halbleiterchips aus dem nutzen
DE3783266T2 (de) Loesbares montierungssystem fuer halbleiter auf einem leitenden substrat.
DE69723801T2 (de) Herstellungsverfahren einer Kontaktgitter-Halbleiterpackung
DE69313062T2 (de) Chip-Direktmontage
EP1470743B1 (de) Leistungsmodul
DE102004041088A1 (de) Halbleiterbauteil in Flachleitertechnik mit einem Halbleiterchip
DE69802146T2 (de) Umarbeitungsfähige Leiterplattenbestückung mit einem Flip-Chip
DE4315082C2 (de) Verbinderanordnung zum Testen eines integrierten Schaltungsbausteins

Legal Events

Date Code Title Description
OAR Request for search filed
OB Request for examination as to novelty
D2 Grant after examination
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: VOSSIUS, V., DIPL.-CHEM. DR.RER.NAT. TAUCHNER, P., DIPL.-CHEM. DR.RER.NAT. HEUNEMANN, D., DIPL.-PHYS. DR.RER.NAT. RAUH, P., DIPL.-CHEM. DR.RER.NAT., PAT.-ANWAELTE, 8000 MUENCHEN

8328 Change in the person/name/address of the agent

Free format text: TAUCHNER, P., DIPL.-CHEM. DR.RER.NAT. HEUNEMANN, D., DIPL.-PHYS. DR.RER.NAT. RAUH, P., DIPL.-CHEM. DR.RER.NAT., PAT.-ANWAELTE, 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee