DE3021140C2 - Verfahren zur Herstellung von Kühlblöcken für Halbleiterlaser und Halbleiterlaser mit einem nach diesem Verfahren hergestellten Kühlblock - Google Patents
Verfahren zur Herstellung von Kühlblöcken für Halbleiterlaser und Halbleiterlaser mit einem nach diesem Verfahren hergestellten KühlblockInfo
- Publication number
- DE3021140C2 DE3021140C2 DE3021140A DE3021140A DE3021140C2 DE 3021140 C2 DE3021140 C2 DE 3021140C2 DE 3021140 A DE3021140 A DE 3021140A DE 3021140 A DE3021140 A DE 3021140A DE 3021140 C2 DE3021140 C2 DE 3021140C2
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- laser element
- cooling block
- attached
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49787—Obtaining plural composite product pieces from preassembled workpieces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
- Y10T29/49812—Temporary protective coating, impregnation, or cast layer
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NLAANVRAGE7904550,A NL180365C (nl) | 1979-06-11 | 1979-06-11 | Werkwijze voor het vervaardigen van koelblokken voor halfgeleiderlasers, alsmede halfgeleiderlaser die een volgens deze werkwijze vervaardigd koelblok bevat. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3021140A1 DE3021140A1 (de) | 1981-01-08 |
| DE3021140C2 true DE3021140C2 (de) | 1985-01-17 |
Family
ID=19833324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3021140A Expired DE3021140C2 (de) | 1979-06-11 | 1980-06-04 | Verfahren zur Herstellung von Kühlblöcken für Halbleiterlaser und Halbleiterlaser mit einem nach diesem Verfahren hergestellten Kühlblock |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4348795A (enExample) |
| JP (2) | JPS562695A (enExample) |
| CA (1) | CA1143463A (enExample) |
| DE (1) | DE3021140C2 (enExample) |
| FR (1) | FR2458922A1 (enExample) |
| GB (1) | GB2050896B (enExample) |
| IT (1) | IT1131523B (enExample) |
| NL (1) | NL180365C (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0612453B2 (ja) * | 1982-05-17 | 1994-02-16 | 積水フアインケミカル株式会社 | 光硬化性樹脂組成物 |
| FR2531819A1 (fr) * | 1982-08-12 | 1984-02-17 | Demeure Loic | Embase pour laser a semi-conducteur et son procede de fabrication |
| US4550333A (en) * | 1983-09-13 | 1985-10-29 | Xerox Corporation | Light emitting semiconductor mount |
| JPH05173046A (ja) * | 1991-12-20 | 1993-07-13 | Sony Corp | 光導波路装置 |
| US5324387A (en) * | 1993-05-07 | 1994-06-28 | Xerox Corporation | Method of fabricating asymmetric closely-spaced multiple diode lasers |
| JP2737625B2 (ja) * | 1993-12-27 | 1998-04-08 | 日本電気株式会社 | 半導体レーザ装置 |
| US20140143996A1 (en) * | 2012-11-28 | 2014-05-29 | Venkata Adiseshaiah Bhagavatula | Methods of forming gradient index (grin) lens chips for optical connections and related fiber optic connectors |
| US9529155B2 (en) | 2012-11-28 | 2016-12-27 | Corning Optical Communications LLC | Gradient index (GRIN) lens chips and associated small form factor optical arrays for optical connections, related fiber optic connectors |
| CN109332775B (zh) * | 2018-11-27 | 2020-05-05 | 株洲钻石切削刀具股份有限公司 | 一种内冷三面刃铣刀 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2762954A (en) * | 1950-09-09 | 1956-09-11 | Sylvania Electric Prod | Method for assembling transistors |
| US3165824A (en) * | 1962-05-21 | 1965-01-19 | Leach & Garner Co | Method for producing jewelers' stock |
| NL301162A (enExample) * | 1962-12-03 | |||
| US3613228A (en) * | 1969-07-02 | 1971-10-19 | Ibm | Manufacture of multielement magnetic head assemblies |
| US3685110A (en) * | 1970-08-31 | 1972-08-22 | George J J Randolph Jr | Manufacture of piezoresistive bars |
| GB1500156A (en) * | 1974-09-06 | 1978-02-08 | Rca Corp | Semiconductor injection laser |
| DE2542174C3 (de) * | 1974-09-21 | 1980-02-14 | Nippon Electric Co., Ltd., Tokio | Halbleiterlaservorrichtung |
| US4268946A (en) * | 1977-06-08 | 1981-05-26 | Owens-Corning Fiberglas Corporation | Method for finishing a plate |
-
1979
- 1979-06-11 NL NLAANVRAGE7904550,A patent/NL180365C/xx not_active IP Right Cessation
-
1980
- 1980-06-04 DE DE3021140A patent/DE3021140C2/de not_active Expired
- 1980-06-06 IT IT22639/80A patent/IT1131523B/it active
- 1980-06-06 US US06/157,139 patent/US4348795A/en not_active Expired - Lifetime
- 1980-06-09 JP JP7759280A patent/JPS562695A/ja active Granted
- 1980-06-10 GB GB8018986A patent/GB2050896B/en not_active Expired
- 1980-06-11 FR FR8012987A patent/FR2458922A1/fr active Granted
- 1980-06-11 CA CA000353806A patent/CA1143463A/en not_active Expired
-
1985
- 1985-04-22 JP JP60084668A patent/JPS611082A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NL180365C (nl) | 1987-02-02 |
| JPS611082A (ja) | 1986-01-07 |
| FR2458922B1 (enExample) | 1981-12-04 |
| NL7904550A (nl) | 1980-12-15 |
| JPS562695A (en) | 1981-01-12 |
| IT8022639A0 (it) | 1980-06-06 |
| JPS6237896B2 (enExample) | 1987-08-14 |
| US4348795A (en) | 1982-09-14 |
| GB2050896A (en) | 1981-01-14 |
| NL180365B (nl) | 1986-09-01 |
| IT1131523B (it) | 1986-06-25 |
| CA1143463A (en) | 1983-03-22 |
| GB2050896B (en) | 1983-01-19 |
| FR2458922A1 (fr) | 1981-01-02 |
| DE3021140A1 (de) | 1981-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE4412278A1 (de) | Starre und flexible Bereiche aufweisende Leiterplatte | |
| DE69311478T2 (de) | Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente | |
| DE3138296C2 (enExample) | ||
| DE60317156T2 (de) | Aktuator und dessen Herstellungsverfahren | |
| DE69120817T2 (de) | Schaltbare optische Verbindung | |
| DE2449359A1 (de) | Koppelvorrichtung fuer optische fasern | |
| DE3021140C2 (de) | Verfahren zur Herstellung von Kühlblöcken für Halbleiterlaser und Halbleiterlaser mit einem nach diesem Verfahren hergestellten Kühlblock | |
| DE4429080C1 (de) | Verfahren zur Herstellung von Prismen, insbesondere Mikroprismen | |
| DE69901132T2 (de) | Piezoelektrischer Tintenstrahlaufzeichnungskopf sowie Verfahren zur dessen Herstellung | |
| DE2642643C2 (de) | Verfahren zur Herstellung von Magnetköpfen geringer Spurbreite | |
| DE2851679A1 (de) | Verzweigerelement und verfahren zu seiner herstellung | |
| DE3343034C2 (de) | Gehäuse für Halbleitervorrichtungen | |
| DE2328485C2 (de) | Verfahren zur Herstellung einer Polstückeinheit für einen Magnetkopf | |
| DE4435914A1 (de) | Piezoelektrischer Antrieb für einen Tintenstrahldruckkopf und Verfahren zu dessen Herstellung | |
| DE2523232A1 (de) | Kuehldose fuer einen thyristor | |
| DE2318322C3 (de) | Verfahren zur Herstellung einer Magnetkopfanordnung mit zwei in Spurrichtung hintereinander liegenden Magnetkopfeinheiten | |
| DE69318327T2 (de) | Verfahren zur Herstellung eines Magnetkopfkernes mit Magnetspalt und schmaller Spur | |
| DE3019420A1 (de) | Verfahren zum herstellen einer ultraschallwandleranordnung | |
| DE2130865C3 (enExample) | ||
| DE3602654C2 (de) | Verfahren zur Bildung einer Verbund-Magnetkopf-Stuktur und Verbund-Magnetkopf-Struktur | |
| DE19748157C2 (de) | Verfahren zum Herstellen eines verbundartigen Informationsträgers | |
| DE69421882T2 (de) | Magnetkopf und Herstellungsverfahren | |
| DE112014003859B4 (de) | Laserbauelementeverbund und Verfahren zum Herstellen eines Laserbauelements | |
| DE1146540B (de) | Mehrspur-Magnetkopf | |
| DE60013530T2 (de) | Optische Komponenten und ihre Herstellung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| 8128 | New person/name/address of the agent |
Representative=s name: NEHMZOW-DAVID, F., PAT.-ASS., 2000 HAMBURG |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
| 8339 | Ceased/non-payment of the annual fee |