DE3015100A1 - Anordnung und verfahren zur ausfuehrung von gedruckten schaltungen - Google Patents

Anordnung und verfahren zur ausfuehrung von gedruckten schaltungen

Info

Publication number
DE3015100A1
DE3015100A1 DE19803015100 DE3015100A DE3015100A1 DE 3015100 A1 DE3015100 A1 DE 3015100A1 DE 19803015100 DE19803015100 DE 19803015100 DE 3015100 A DE3015100 A DE 3015100A DE 3015100 A1 DE3015100 A1 DE 3015100A1
Authority
DE
Germany
Prior art keywords
foil
adhesive
arrangement according
conductive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803015100
Other languages
German (de)
English (en)
Inventor
Raymond Prof Castanet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE3015100A1 publication Critical patent/DE3015100A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)
DE19803015100 1979-04-23 1980-04-19 Anordnung und verfahren zur ausfuehrung von gedruckten schaltungen Withdrawn DE3015100A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911179A FR2455422A1 (fr) 1979-04-23 1979-04-23 Dispositif pour l'obtention de circuits imprimes

Publications (1)

Publication Number Publication Date
DE3015100A1 true DE3015100A1 (de) 1980-11-13

Family

ID=9224975

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803015100 Withdrawn DE3015100A1 (de) 1979-04-23 1980-04-19 Anordnung und verfahren zur ausfuehrung von gedruckten schaltungen

Country Status (3)

Country Link
DE (1) DE3015100A1 (cg-RX-API-DMAC10.html)
FR (1) FR2455422A1 (cg-RX-API-DMAC10.html)
GB (1) GB2047971A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312631A1 (de) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten
DE19809193A1 (de) * 1998-03-04 1999-09-23 Hannes Riebl Verfahren zur Herstellung einer Leiterbahnstruktur sowie damit hergestellte Flachtastatur
DE102017123291A1 (de) * 2017-10-06 2019-04-11 Eppsteinfoils Gmbh & Co.Kg Selbstklebende Folie und Verfahren zu deren Herstellung

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11116070B2 (en) 2017-07-13 2021-09-07 Cellink Corporation Interconnect circuit methods and devices
FR3101748A1 (fr) * 2019-10-07 2021-04-09 Centiloc Procédé de fabrication d’un circuit imprimé et circuit imprimé

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1589885A1 (de) * 1967-03-01 1970-10-22 Holtz Hermann Magnetisch haftende bzw. der magnetischen Haftung dienende Folie
DE2246208A1 (de) * 1971-09-22 1973-03-29 Circuit Materials Division Dod Verfahren zur herstellung von gedruckten schaltungen
FR2217906B3 (cg-RX-API-DMAC10.html) * 1973-02-15 1976-02-13 Radiall Fr
DE2334585A1 (de) * 1973-07-07 1975-03-13 Reulein Fa Georg Schaltplatte

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312631A1 (de) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten
DE19809193A1 (de) * 1998-03-04 1999-09-23 Hannes Riebl Verfahren zur Herstellung einer Leiterbahnstruktur sowie damit hergestellte Flachtastatur
DE102017123291A1 (de) * 2017-10-06 2019-04-11 Eppsteinfoils Gmbh & Co.Kg Selbstklebende Folie und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
FR2455422A1 (fr) 1980-11-21
GB2047971A (en) 1980-12-03
FR2455422B1 (cg-RX-API-DMAC10.html) 1983-11-10

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Legal Events

Date Code Title Description
8130 Withdrawal