FR2455422A1 - Dispositif pour l'obtention de circuits imprimes - Google Patents

Dispositif pour l'obtention de circuits imprimes

Info

Publication number
FR2455422A1
FR2455422A1 FR7911179A FR7911179A FR2455422A1 FR 2455422 A1 FR2455422 A1 FR 2455422A1 FR 7911179 A FR7911179 A FR 7911179A FR 7911179 A FR7911179 A FR 7911179A FR 2455422 A1 FR2455422 A1 FR 2455422A1
Authority
FR
France
Prior art keywords
support
tape
insulation
sharp
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7911179A
Other languages
English (en)
Other versions
FR2455422B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR7911179A priority Critical patent/FR2455422A1/fr
Priority to GB8012699A priority patent/GB2047971A/en
Priority to DE19803015100 priority patent/DE3015100A1/de
Publication of FR2455422A1 publication Critical patent/FR2455422A1/fr
Application granted granted Critical
Publication of FR2455422B1 publication Critical patent/FR2455422B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulating Bodies (AREA)

Abstract

DISPOSITIF PERMETTANT LA CONFECTION DE RESEAUX DE CONDUCTEURS DU TYPE APPELE COURAMMENT "CIRCUITS IMPRIMES" AINSI QUE LA FABRICATION DE CE DISPOSITIF. LA MISE EN OEUVRE DU DISPOSITIF SUIVANT L'INVENTION EST PLUS SIMPLE, PLUS RAPIDE, DEMANDE MOINS DE MATERIEL, D'OUTILS ET D'ACCESSOIRES ET OFFRE EN OUTRE DE NOMBREUX AUTRES AVANTAGES PAR RAPPORT AUX COMPOSITES REVETUS DE CUIVRE A UTILISER COMME PANNEAUX POUR CIRCUITS IMPRIMES ACTUELLEMENT SUR LE MARCHE. LA FABRICATION DU DISPOSITIF INVENTE EST TRES SIMPLE, FACILE ET PEUT ETRE EN GRANDE PARTIE AUTOMATISEE AU MOYEN DE LA CHAINE DE FABRICATION DECRITE DANS LE PRESENT TEXTE. LE DISPOSITIF COMBINE DE FACON ORIGINALE AU MOINS LES DEUX DERNIERS DES TROIS MOYENS SUIVANTS: 1.UN SUPPORT DEVANT ETRE ISOLANT LORSQU'IL EST DESTINE A SUPPORTER LES DEUX MOYENS SUIVANTS POUR L'OBTENTION DU RESEAU DE CONDUCTEUR (A CIRCUIT IMPRIME);CE CIRCUIT ETANT ALORS TRACE, DECOUPE ET UTILISE DIRECTEMENT SUR CE SUPPORT. CETTE QUALITE D'ISOLATION N'EST PLUS NECESSAIRE LORSQUE LE SUPPORT NE JOUE CE ROLE QUE TEMPORAIREMENT. 2.UN FILM OU FEUILLE OU BANDE EN MATIERE CONDUCTRICE DE L'ELECTRICITE DONT L'UNE DES PRINCIPALES CARACTERISTIQUES EST D'ETRE, DANS LE CONTEXTE D'UTILISATION, FACILEMENT DECOUPABLE AU MOYEN D'OUTILS TRANCHANTS OU AIGUS SIMPLES TELS QUE LAME DE RASOIR, CUTER, AIGUILLE ACEREE, ETC. 3.UN PRODUIT ADHESIF OU COLLE PERMETTANT D'ASSEMBLER LE MOYEN ISOLANT ET LE MOYEN CONDUCTEUR ET DONT UNE DES CARACTERISTIQUES ESSENTIELLES EST DE NE PAS S'OPPOSER EFFICACEMENT A UN EFFORT VOLONTAIRE D'UN UTILISATEUR DESIRANT DETACHER DU SUPPORT ISOLANT UNE BANDE OU AUTRE FORME GEOMETRIQUE PREALABLEMENT DECOUPEE DANS LE MOYEN CONDUCTEUR. L'INVENTION PEUT ETRE UTILISEE POUR LA CONFECTION DE RESEAUX DE CONDUCTEURS DE L'ELECTRICITE (CIRCUITS IMPRIMES) ET NOTAMMENT LES DEUXIEME ET TROISIEME MOYENS PEUVENT ETRE ASSEMBLES EN UN SEUL SOUS FORME D'UNE FEUILLE, BANDE OU BOBINE DE BANDE METALLIQUE ADHESIVE AUTOCOLLANTE, APPLIQUEE OU NON SUR UN SUPPORT TEMPORAIRE, DESTINEE A ETRE APPLIQUEE PAR L'UTILISATEUR SUR UN SUPPORT DE SON CHOIX EN VUE DE LA CONFECTION DE CIRCUITS ELECTRIQUES OU POUR TOUTE AUTRE UTILISATION A SA CONVENANCE.
FR7911179A 1979-04-23 1979-04-23 Dispositif pour l'obtention de circuits imprimes Granted FR2455422A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR7911179A FR2455422A1 (fr) 1979-04-23 1979-04-23 Dispositif pour l'obtention de circuits imprimes
GB8012699A GB2047971A (en) 1979-04-23 1980-04-17 Printed circuit fabrication
DE19803015100 DE3015100A1 (de) 1979-04-23 1980-04-19 Anordnung und verfahren zur ausfuehrung von gedruckten schaltungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911179A FR2455422A1 (fr) 1979-04-23 1979-04-23 Dispositif pour l'obtention de circuits imprimes

Publications (2)

Publication Number Publication Date
FR2455422A1 true FR2455422A1 (fr) 1980-11-21
FR2455422B1 FR2455422B1 (fr) 1983-11-10

Family

ID=9224975

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7911179A Granted FR2455422A1 (fr) 1979-04-23 1979-04-23 Dispositif pour l'obtention de circuits imprimes

Country Status (3)

Country Link
DE (1) DE3015100A1 (fr)
FR (1) FR2455422A1 (fr)
GB (1) GB2047971A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312631A1 (fr) * 1987-10-21 1989-04-26 PRESSKONTAKT Ing. grad. Hartmuth Thaler KG Procédé pour la réalisation de connexions électriques entre des pistes électriquement conductrices plates et plaque à circuit ainsi fabriqué
DE19809193A1 (de) * 1998-03-04 1999-09-23 Hannes Riebl Verfahren zur Herstellung einer Leiterbahnstruktur sowie damit hergestellte Flachtastatur
KR102530258B1 (ko) * 2017-07-13 2023-05-08 셀링크 코포레이션 인터커넥트 회로 방법 및 장치
DE102017123291A1 (de) * 2017-10-06 2019-04-11 Eppsteinfoils Gmbh & Co.Kg Selbstklebende Folie und Verfahren zu deren Herstellung
FR3101748A1 (fr) * 2019-10-07 2021-04-09 Centiloc Procédé de fabrication d’un circuit imprimé et circuit imprimé

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1589885A1 (de) * 1967-03-01 1970-10-22 Holtz Hermann Magnetisch haftende bzw. der magnetischen Haftung dienende Folie
FR2153383A1 (fr) * 1971-09-22 1973-05-04 Dodge Ind Inc
FR2217906A1 (fr) * 1973-02-15 1974-09-06 Radiall Sa
DE2334585A1 (de) * 1973-07-07 1975-03-13 Reulein Fa Georg Schaltplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1589885A1 (de) * 1967-03-01 1970-10-22 Holtz Hermann Magnetisch haftende bzw. der magnetischen Haftung dienende Folie
FR2153383A1 (fr) * 1971-09-22 1973-05-04 Dodge Ind Inc
FR2217906A1 (fr) * 1973-02-15 1974-09-06 Radiall Sa
DE2334585A1 (de) * 1973-07-07 1975-03-13 Reulein Fa Georg Schaltplatte

Also Published As

Publication number Publication date
DE3015100A1 (de) 1980-11-13
GB2047971A (en) 1980-12-03
FR2455422B1 (fr) 1983-11-10

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Legal Events

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ST Notification of lapse