FR2455422A1 - Dispositif pour l'obtention de circuits imprimes - Google Patents
Dispositif pour l'obtention de circuits imprimesInfo
- Publication number
- FR2455422A1 FR2455422A1 FR7911179A FR7911179A FR2455422A1 FR 2455422 A1 FR2455422 A1 FR 2455422A1 FR 7911179 A FR7911179 A FR 7911179A FR 7911179 A FR7911179 A FR 7911179A FR 2455422 A1 FR2455422 A1 FR 2455422A1
- Authority
- FR
- France
- Prior art keywords
- support
- tape
- insulation
- sharp
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 abstract 4
- 238000009413 insulation Methods 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 235000009508 confectionery Nutrition 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000002747 voluntary effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulating Bodies (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7911179A FR2455422A1 (fr) | 1979-04-23 | 1979-04-23 | Dispositif pour l'obtention de circuits imprimes |
| GB8012699A GB2047971A (en) | 1979-04-23 | 1980-04-17 | Printed circuit fabrication |
| DE19803015100 DE3015100A1 (de) | 1979-04-23 | 1980-04-19 | Anordnung und verfahren zur ausfuehrung von gedruckten schaltungen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7911179A FR2455422A1 (fr) | 1979-04-23 | 1979-04-23 | Dispositif pour l'obtention de circuits imprimes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2455422A1 true FR2455422A1 (fr) | 1980-11-21 |
| FR2455422B1 FR2455422B1 (cg-RX-API-DMAC10.html) | 1983-11-10 |
Family
ID=9224975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7911179A Granted FR2455422A1 (fr) | 1979-04-23 | 1979-04-23 | Dispositif pour l'obtention de circuits imprimes |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE3015100A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2455422A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB2047971A (cg-RX-API-DMAC10.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0312631A1 (de) * | 1987-10-21 | 1989-04-26 | PRESSKONTAKT Ing. grad. Hartmuth Thaler KG | Verfahren zur Herstellung elektrischer Verbindungen zwischen flachen elektrischen Leiterbahnen und danach hergestellte Leiterplatten |
| DE19809193A1 (de) * | 1998-03-04 | 1999-09-23 | Hannes Riebl | Verfahren zur Herstellung einer Leiterbahnstruktur sowie damit hergestellte Flachtastatur |
| US11116070B2 (en) | 2017-07-13 | 2021-09-07 | Cellink Corporation | Interconnect circuit methods and devices |
| DE102017123291A1 (de) * | 2017-10-06 | 2019-04-11 | Eppsteinfoils Gmbh & Co.Kg | Selbstklebende Folie und Verfahren zu deren Herstellung |
| FR3101748A1 (fr) * | 2019-10-07 | 2021-04-09 | Centiloc | Procédé de fabrication d’un circuit imprimé et circuit imprimé |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1589885A1 (de) * | 1967-03-01 | 1970-10-22 | Holtz Hermann | Magnetisch haftende bzw. der magnetischen Haftung dienende Folie |
| FR2153383A1 (cg-RX-API-DMAC10.html) * | 1971-09-22 | 1973-05-04 | Dodge Ind Inc | |
| FR2217906A1 (cg-RX-API-DMAC10.html) * | 1973-02-15 | 1974-09-06 | Radiall Sa | |
| DE2334585A1 (de) * | 1973-07-07 | 1975-03-13 | Reulein Fa Georg | Schaltplatte |
-
1979
- 1979-04-23 FR FR7911179A patent/FR2455422A1/fr active Granted
-
1980
- 1980-04-17 GB GB8012699A patent/GB2047971A/en not_active Withdrawn
- 1980-04-19 DE DE19803015100 patent/DE3015100A1/de not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1589885A1 (de) * | 1967-03-01 | 1970-10-22 | Holtz Hermann | Magnetisch haftende bzw. der magnetischen Haftung dienende Folie |
| FR2153383A1 (cg-RX-API-DMAC10.html) * | 1971-09-22 | 1973-05-04 | Dodge Ind Inc | |
| FR2217906A1 (cg-RX-API-DMAC10.html) * | 1973-02-15 | 1974-09-06 | Radiall Sa | |
| DE2334585A1 (de) * | 1973-07-07 | 1975-03-13 | Reulein Fa Georg | Schaltplatte |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3015100A1 (de) | 1980-11-13 |
| GB2047971A (en) | 1980-12-03 |
| FR2455422B1 (cg-RX-API-DMAC10.html) | 1983-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |