DE2917110A1 - Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass - Google Patents
Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermassInfo
- Publication number
- DE2917110A1 DE2917110A1 DE19792917110 DE2917110A DE2917110A1 DE 2917110 A1 DE2917110 A1 DE 2917110A1 DE 19792917110 DE19792917110 DE 19792917110 DE 2917110 A DE2917110 A DE 2917110A DE 2917110 A1 DE2917110 A1 DE 2917110A1
- Authority
- DE
- Germany
- Prior art keywords
- strip
- contact
- contact lugs
- carrier plate
- spacing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792917110 DE2917110A1 (de) | 1979-04-27 | 1979-04-27 | Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792917110 DE2917110A1 (de) | 1979-04-27 | 1979-04-27 | Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2917110A1 true DE2917110A1 (de) | 1980-10-30 |
DE2917110C2 DE2917110C2 (US20030204162A1-20031030-M00001.png) | 1982-08-19 |
Family
ID=6069430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19792917110 Granted DE2917110A1 (de) | 1979-04-27 | 1979-04-27 | Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2917110A1 (US20030204162A1-20031030-M00001.png) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2506999A3 (fr) * | 1981-06-01 | 1982-12-03 | Electro Resistance | Composant electronique et son procede de fabrication |
US4521961A (en) * | 1982-04-20 | 1985-06-11 | Nixdorf Computer Ag | Method for the manufacture of a multi-polar contact strip |
US4996766A (en) * | 1988-12-21 | 1991-03-05 | Burndy Corporation | Bi-level card edge connector and method of making the same |
EP1124238A2 (de) * | 2000-02-07 | 2001-08-16 | Heraeus Electro-Nite International N.V. | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1914865B2 (de) * | 1969-03-24 | 1972-12-07 | CRL Electronic Bauelemente GmbH, 8500 Nürnberg | Verfahren zum montieren von trimmerwiderstaenden auf einer transferstrasse |
DE2337303A1 (de) * | 1972-07-26 | 1974-02-14 | Hitachi Ltd | Automatische verbindungsvorrichtung zum zusammenbau von halbleiteranordnungen |
US3932013A (en) * | 1974-04-08 | 1976-01-13 | Amp Incorporated | Shunt assembly |
-
1979
- 1979-04-27 DE DE19792917110 patent/DE2917110A1/de active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1914865B2 (de) * | 1969-03-24 | 1972-12-07 | CRL Electronic Bauelemente GmbH, 8500 Nürnberg | Verfahren zum montieren von trimmerwiderstaenden auf einer transferstrasse |
DE2337303A1 (de) * | 1972-07-26 | 1974-02-14 | Hitachi Ltd | Automatische verbindungsvorrichtung zum zusammenbau von halbleiteranordnungen |
US3932013A (en) * | 1974-04-08 | 1976-01-13 | Amp Incorporated | Shunt assembly |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2506999A3 (fr) * | 1981-06-01 | 1982-12-03 | Electro Resistance | Composant electronique et son procede de fabrication |
US4521961A (en) * | 1982-04-20 | 1985-06-11 | Nixdorf Computer Ag | Method for the manufacture of a multi-polar contact strip |
US4996766A (en) * | 1988-12-21 | 1991-03-05 | Burndy Corporation | Bi-level card edge connector and method of making the same |
EP1124238A2 (de) * | 2000-02-07 | 2001-08-16 | Heraeus Electro-Nite International N.V. | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
EP1124238A3 (de) * | 2000-02-07 | 2004-01-14 | Heraeus Electro-Nite International N.V. | Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge |
Also Published As
Publication number | Publication date |
---|---|
DE2917110C2 (US20030204162A1-20031030-M00001.png) | 1982-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OAP | Request for examination filed | ||
OD | Request for examination | ||
D2 | Grant after examination | ||
8363 | Opposition against the patent | ||
8339 | Ceased/non-payment of the annual fee |