DE2917110A1 - Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass - Google Patents

Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass

Info

Publication number
DE2917110A1
DE2917110A1 DE19792917110 DE2917110A DE2917110A1 DE 2917110 A1 DE2917110 A1 DE 2917110A1 DE 19792917110 DE19792917110 DE 19792917110 DE 2917110 A DE2917110 A DE 2917110A DE 2917110 A1 DE2917110 A1 DE 2917110A1
Authority
DE
Germany
Prior art keywords
strip
contact
contact lugs
carrier plate
spacing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19792917110
Other languages
German (de)
English (en)
Other versions
DE2917110C2 (US20030204162A1-20031030-M00001.png
Inventor
Gerold Eckert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Preh GmbH
Original Assignee
Preh GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Preh GmbH filed Critical Preh GmbH
Priority to DE19792917110 priority Critical patent/DE2917110A1/de
Publication of DE2917110A1 publication Critical patent/DE2917110A1/de
Application granted granted Critical
Publication of DE2917110C2 publication Critical patent/DE2917110C2/de
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709Staggered pads, lands or terminals; Parallel conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1034Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10878Means for retention of a lead in a hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10924Leads formed from a punched metal foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DE19792917110 1979-04-27 1979-04-27 Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass Granted DE2917110A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19792917110 DE2917110A1 (de) 1979-04-27 1979-04-27 Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792917110 DE2917110A1 (de) 1979-04-27 1979-04-27 Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass

Publications (2)

Publication Number Publication Date
DE2917110A1 true DE2917110A1 (de) 1980-10-30
DE2917110C2 DE2917110C2 (US20030204162A1-20031030-M00001.png) 1982-08-19

Family

ID=6069430

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19792917110 Granted DE2917110A1 (de) 1979-04-27 1979-04-27 Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass

Country Status (1)

Country Link
DE (1) DE2917110A1 (US20030204162A1-20031030-M00001.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2506999A3 (fr) * 1981-06-01 1982-12-03 Electro Resistance Composant electronique et son procede de fabrication
US4521961A (en) * 1982-04-20 1985-06-11 Nixdorf Computer Ag Method for the manufacture of a multi-polar contact strip
US4996766A (en) * 1988-12-21 1991-03-05 Burndy Corporation Bi-level card edge connector and method of making the same
EP1124238A2 (de) * 2000-02-07 2001-08-16 Heraeus Electro-Nite International N.V. Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1914865B2 (de) * 1969-03-24 1972-12-07 CRL Electronic Bauelemente GmbH, 8500 Nürnberg Verfahren zum montieren von trimmerwiderstaenden auf einer transferstrasse
DE2337303A1 (de) * 1972-07-26 1974-02-14 Hitachi Ltd Automatische verbindungsvorrichtung zum zusammenbau von halbleiteranordnungen
US3932013A (en) * 1974-04-08 1976-01-13 Amp Incorporated Shunt assembly

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1914865B2 (de) * 1969-03-24 1972-12-07 CRL Electronic Bauelemente GmbH, 8500 Nürnberg Verfahren zum montieren von trimmerwiderstaenden auf einer transferstrasse
DE2337303A1 (de) * 1972-07-26 1974-02-14 Hitachi Ltd Automatische verbindungsvorrichtung zum zusammenbau von halbleiteranordnungen
US3932013A (en) * 1974-04-08 1976-01-13 Amp Incorporated Shunt assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2506999A3 (fr) * 1981-06-01 1982-12-03 Electro Resistance Composant electronique et son procede de fabrication
US4521961A (en) * 1982-04-20 1985-06-11 Nixdorf Computer Ag Method for the manufacture of a multi-polar contact strip
US4996766A (en) * 1988-12-21 1991-03-05 Burndy Corporation Bi-level card edge connector and method of making the same
EP1124238A2 (de) * 2000-02-07 2001-08-16 Heraeus Electro-Nite International N.V. Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge
EP1124238A3 (de) * 2000-02-07 2004-01-14 Heraeus Electro-Nite International N.V. Verfahren zum Verbinden von Kontaktflächen elektrischer Bauelemente-Rohlinge

Also Published As

Publication number Publication date
DE2917110C2 (US20030204162A1-20031030-M00001.png) 1982-08-19

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
D2 Grant after examination
8363 Opposition against the patent
8339 Ceased/non-payment of the annual fee