DE2806099A1 - Halbleiter-baugruppe - Google Patents

Halbleiter-baugruppe

Info

Publication number
DE2806099A1
DE2806099A1 DE19782806099 DE2806099A DE2806099A1 DE 2806099 A1 DE2806099 A1 DE 2806099A1 DE 19782806099 DE19782806099 DE 19782806099 DE 2806099 A DE2806099 A DE 2806099A DE 2806099 A1 DE2806099 A1 DE 2806099A1
Authority
DE
Germany
Prior art keywords
semiconductor
base
ceramic
assembly
blocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782806099
Other languages
German (de)
English (en)
Inventor
Joseph Herbert Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of DE2806099A1 publication Critical patent/DE2806099A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Wire Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
DE19782806099 1977-02-17 1978-02-14 Halbleiter-baugruppe Withdrawn DE2806099A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76963777A 1977-02-17 1977-02-17

Publications (1)

Publication Number Publication Date
DE2806099A1 true DE2806099A1 (de) 1978-08-24

Family

ID=25086071

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782806099 Withdrawn DE2806099A1 (de) 1977-02-17 1978-02-14 Halbleiter-baugruppe

Country Status (5)

Country Link
JP (1) JPS53102674A (enrdf_load_stackoverflow)
DE (1) DE2806099A1 (enrdf_load_stackoverflow)
FR (1) FR2381388A1 (enrdf_load_stackoverflow)
GB (1) GB1599852A (enrdf_load_stackoverflow)
NL (1) NL7801658A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639760A (en) * 1986-01-21 1987-01-27 Motorola, Inc. High power RF transistor assembly
DE102006011995B3 (de) * 2006-03-16 2007-11-08 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit segmentierter Grundplatte

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2511193A1 (fr) * 1981-08-07 1983-02-11 Thomson Csf Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique
JPS5899838U (ja) * 1981-12-28 1983-07-07 富士通株式会社 半導体装置
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
JPS60113931A (ja) * 1983-11-25 1985-06-20 Toshiba Corp 半導体装置
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
FR2563379A1 (fr) * 1984-04-20 1985-10-25 Artus Ensemble de dispositifs electroniques a semi-conducteurs montes sur radiateur
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
DE3837617A1 (de) * 1988-11-05 1990-05-10 Semikron Elektronik Gmbh Traegerkoerper zur elektrisch isolierten anordnung von bauteilen
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
US5317194A (en) * 1989-10-17 1994-05-31 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink
US5917236A (en) * 1995-12-08 1999-06-29 Hewlett-Packard Company Packaging system for field effects transistors
US8237260B2 (en) 2008-11-26 2012-08-07 Infineon Technologies Ag Power semiconductor module with segmented base plate
US9960127B2 (en) 2016-05-18 2018-05-01 Macom Technology Solutions Holdings, Inc. High-power amplifier package
US10134658B2 (en) 2016-08-10 2018-11-20 Macom Technology Solutions Holdings, Inc. High power transistors

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
JPS49131863U (enrdf_load_stackoverflow) * 1973-03-10 1974-11-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639760A (en) * 1986-01-21 1987-01-27 Motorola, Inc. High power RF transistor assembly
DE102006011995B3 (de) * 2006-03-16 2007-11-08 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit segmentierter Grundplatte

Also Published As

Publication number Publication date
NL7801658A (nl) 1978-08-21
JPS53102674A (en) 1978-09-07
JPS6128219B2 (enrdf_load_stackoverflow) 1986-06-28
FR2381388A1 (fr) 1978-09-15
GB1599852A (en) 1981-10-07

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee