DE2748567C2 - Leistungshalbleiterbauelement - Google Patents

Leistungshalbleiterbauelement

Info

Publication number
DE2748567C2
DE2748567C2 DE2748567A DE2748567A DE2748567C2 DE 2748567 C2 DE2748567 C2 DE 2748567C2 DE 2748567 A DE2748567 A DE 2748567A DE 2748567 A DE2748567 A DE 2748567A DE 2748567 C2 DE2748567 C2 DE 2748567C2
Authority
DE
Germany
Prior art keywords
electrically insulating
ring
semiconductor component
hollow cylinder
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2748567A
Other languages
German (de)
English (en)
Other versions
DE2748567A1 (de
Inventor
Yoshiro Amagasaki Hyogo Shikano
Yoshiyuki Itami Hyogo Sugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE2748567A1 publication Critical patent/DE2748567A1/de
Application granted granted Critical
Publication of DE2748567C2 publication Critical patent/DE2748567C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
DE2748567A 1976-10-28 1977-10-28 Leistungshalbleiterbauelement Expired DE2748567C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13027176A JPS5354971A (en) 1976-10-28 1976-10-28 Semiconductor device

Publications (2)

Publication Number Publication Date
DE2748567A1 DE2748567A1 (de) 1978-05-03
DE2748567C2 true DE2748567C2 (de) 1983-01-13

Family

ID=15030296

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2748567A Expired DE2748567C2 (de) 1976-10-28 1977-10-28 Leistungshalbleiterbauelement

Country Status (3)

Country Link
US (1) US4150394A (enExample)
JP (1) JPS5354971A (enExample)
DE (1) DE2748567C2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
CH630490A5 (de) * 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
DE2915862C2 (de) * 1979-04-19 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenförmigem Gehäuse
JPS5635443A (en) * 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
DE2936780C2 (de) * 1979-09-12 1985-02-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
DE3308661A1 (de) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US4829364A (en) * 1985-11-29 1989-05-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
DE10306767A1 (de) * 2003-02-18 2004-08-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleitermodul
WO2008031372A1 (de) * 2006-09-14 2008-03-20 Siemens Aktiengesellschaft Leistungshalbleitermodul mit explosionsschutz
CN103635998B (zh) * 2011-06-21 2016-08-17 Abb技术有限公司 具有接触机构的功率半导体壳体
JP6535676B2 (ja) * 2014-01-21 2019-06-26 アーベーベー・シュヴァイツ・アクチエンゲゼルシャフト 電力半導体装置
US12002722B2 (en) * 2019-07-31 2024-06-04 Hitachi Energy Ltd Power semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
US3581160A (en) * 1968-12-23 1971-05-25 Gen Electric Semiconductor rectifier assembly having high explosion rating
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
US3975758A (en) * 1975-05-27 1976-08-17 Westinghouse Electric Corporation Gate assist turn-off, amplifying gate thyristor and a package assembly therefor
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
JPS5243246U (enExample) * 1975-09-19 1977-03-28
JPS5533650Y2 (enExample) * 1976-06-04 1980-08-09

Also Published As

Publication number Publication date
JPS5537103B2 (enExample) 1980-09-25
US4150394A (en) 1979-04-17
DE2748567A1 (de) 1978-05-03
JPS5354971A (en) 1978-05-18

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
8128 New person/name/address of the agent

Representative=s name: KERN, R., DIPL.-ING., PAT.-ANW., 8000 MUENCHEN

D2 Grant after examination
8364 No opposition during term of opposition