JPS5537103B2 - - Google Patents
Info
- Publication number
- JPS5537103B2 JPS5537103B2 JP13027176A JP13027176A JPS5537103B2 JP S5537103 B2 JPS5537103 B2 JP S5537103B2 JP 13027176 A JP13027176 A JP 13027176A JP 13027176 A JP13027176 A JP 13027176A JP S5537103 B2 JPS5537103 B2 JP S5537103B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
Landscapes
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13027176A JPS5354971A (en) | 1976-10-28 | 1976-10-28 | Semiconductor device |
| US05/844,069 US4150394A (en) | 1976-10-28 | 1977-10-20 | Flat package semiconductor device having high explosion preventing capacity |
| DE2748567A DE2748567C2 (de) | 1976-10-28 | 1977-10-28 | Leistungshalbleiterbauelement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13027176A JPS5354971A (en) | 1976-10-28 | 1976-10-28 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5354971A JPS5354971A (en) | 1978-05-18 |
| JPS5537103B2 true JPS5537103B2 (enExample) | 1980-09-25 |
Family
ID=15030296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13027176A Granted JPS5354971A (en) | 1976-10-28 | 1976-10-28 | Semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4150394A (enExample) |
| JP (1) | JPS5354971A (enExample) |
| DE (1) | DE2748567C2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4274106A (en) * | 1977-11-07 | 1981-06-16 | Mitsubishi Denki Kabushiki Kaisha | Explosion proof vibration resistant flat package semiconductor device |
| CH630490A5 (de) * | 1978-06-30 | 1982-06-15 | Bbc Brown Boveri & Cie | Gehaeuse fuer ein halbleiter-hochleistungsbauelement. |
| DE2915862C2 (de) * | 1979-04-19 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement mit scheibenförmigem Gehäuse |
| JPS5635443A (en) * | 1979-08-31 | 1981-04-08 | Toshiba Corp | Semiconductor device |
| DE2936780C2 (de) * | 1979-09-12 | 1985-02-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiterbauelement |
| US4646131A (en) * | 1983-01-28 | 1987-02-24 | Mitsubishi Denki Kabushiki Kaisha | Rectifier device |
| DE3308661A1 (de) * | 1983-03-11 | 1984-09-20 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiterelement |
| USRE34696E (en) * | 1985-11-29 | 1994-08-16 | Mitsubishi Denki Kabushiki | Semiconductor device housing with electrodes in press contact with the opposite sides of chip |
| US4829364A (en) * | 1985-11-29 | 1989-05-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US4987476A (en) * | 1988-02-01 | 1991-01-22 | General Instrument Corporation | Brazed glass pre-passivated chip rectifier |
| DE10306767A1 (de) * | 2003-02-18 | 2004-08-26 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Halbleitermodul |
| WO2008031372A1 (de) * | 2006-09-14 | 2008-03-20 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit explosionsschutz |
| CN103635998B (zh) * | 2011-06-21 | 2016-08-17 | Abb技术有限公司 | 具有接触机构的功率半导体壳体 |
| JP6535676B2 (ja) * | 2014-01-21 | 2019-06-26 | アーベーベー・シュヴァイツ・アクチエンゲゼルシャフト | 電力半導体装置 |
| US12002722B2 (en) * | 2019-07-31 | 2024-06-04 | Hitachi Energy Ltd | Power semiconductor device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566958A (en) * | 1968-12-18 | 1971-03-02 | Gen Systems Inc | Heat sink for electrical devices |
| US3581160A (en) * | 1968-12-23 | 1971-05-25 | Gen Electric | Semiconductor rectifier assembly having high explosion rating |
| US3599057A (en) * | 1969-02-03 | 1971-08-10 | Gen Electric | Semiconductor device with a resilient lead construction |
| US3651383A (en) * | 1970-02-05 | 1972-03-21 | Gen Electric | Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink |
| DE2014289A1 (de) * | 1970-03-25 | 1971-10-14 | Semikron Gleichrichterbau | Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung |
| US3992717A (en) * | 1974-06-21 | 1976-11-16 | Westinghouse Electric Corporation | Housing for a compression bonded encapsulation of a semiconductor device |
| US3975758A (en) * | 1975-05-27 | 1976-08-17 | Westinghouse Electric Corporation | Gate assist turn-off, amplifying gate thyristor and a package assembly therefor |
| US4008486A (en) * | 1975-06-02 | 1977-02-15 | International Rectifier Corporation | Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring |
| JPS5243246U (enExample) * | 1975-09-19 | 1977-03-28 | ||
| JPS5533650Y2 (enExample) * | 1976-06-04 | 1980-08-09 |
-
1976
- 1976-10-28 JP JP13027176A patent/JPS5354971A/ja active Granted
-
1977
- 1977-10-20 US US05/844,069 patent/US4150394A/en not_active Expired - Lifetime
- 1977-10-28 DE DE2748567A patent/DE2748567C2/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4150394A (en) | 1979-04-17 |
| DE2748567A1 (de) | 1978-05-03 |
| DE2748567C2 (de) | 1983-01-13 |
| JPS5354971A (en) | 1978-05-18 |