DE2743241C2 - - Google Patents

Info

Publication number
DE2743241C2
DE2743241C2 DE2743241A DE2743241A DE2743241C2 DE 2743241 C2 DE2743241 C2 DE 2743241C2 DE 2743241 A DE2743241 A DE 2743241A DE 2743241 A DE2743241 A DE 2743241A DE 2743241 C2 DE2743241 C2 DE 2743241C2
Authority
DE
Germany
Prior art keywords
plug
housing
receiving part
members
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2743241A
Other languages
German (de)
English (en)
Other versions
DE2743241A1 (de
Inventor
Dimitry G. Lisbon Falls Me. Us Grabbe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of DE2743241A1 publication Critical patent/DE2743241A1/de
Application granted granted Critical
Publication of DE2743241C2 publication Critical patent/DE2743241C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H05K7/1046—J-shaped leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE19772743241 1976-09-27 1977-09-26 Zweiteiliger elektrischer verbinder zum befestigen eines elektrischen bauteils auf einem substrat Granted DE2743241A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/727,307 US4089575A (en) 1976-09-27 1976-09-27 Connector for connecting a circuit element to the surface of a substrate

Publications (2)

Publication Number Publication Date
DE2743241A1 DE2743241A1 (de) 1978-03-30
DE2743241C2 true DE2743241C2 (en, 2012) 1987-12-23

Family

ID=24922149

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772743241 Granted DE2743241A1 (de) 1976-09-27 1977-09-26 Zweiteiliger elektrischer verbinder zum befestigen eines elektrischen bauteils auf einem substrat

Country Status (8)

Country Link
US (1) US4089575A (en, 2012)
JP (1) JPS5341979A (en, 2012)
CA (1) CA1081334A (en, 2012)
DE (1) DE2743241A1 (en, 2012)
ES (1) ES462635A1 (en, 2012)
FR (1) FR2365899A1 (en, 2012)
GB (1) GB1543665A (en, 2012)
IT (1) IT1087366B (en, 2012)

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US4222622A (en) * 1978-06-12 1980-09-16 Gte Products Corporation Electrical connector for circuit board
US4272140A (en) * 1979-12-19 1981-06-09 Gte Automatic Electric Laboratories Incorporated Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits
US4351580A (en) * 1980-05-15 1982-09-28 Augat Inc. Carrier socket for leadless integrated circuit devices
US4362353A (en) * 1980-05-27 1982-12-07 Amp Incorporated Contact clip for connecting a ceramic substrate to a printed circuit board
US4352535A (en) * 1980-06-27 1982-10-05 General Motors Corporation Electrical connector
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
US4406508A (en) * 1981-07-02 1983-09-27 Thomas & Betts Corporation Dual-in-line package assembly
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
US4495376A (en) * 1981-07-27 1985-01-22 Texas Instruments Incorporated Carrier for integrated circuit
DE3303165C2 (de) * 1982-02-05 1993-12-09 Hitachi Ltd Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern
US4491377A (en) * 1982-04-19 1985-01-01 Pfaff Wayne Mounting housing for leadless chip carrier
US4458968A (en) * 1982-07-06 1984-07-10 At&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
US4506938A (en) * 1982-07-06 1985-03-26 At&T Bell Laboratories Integrated circuit chip carrier mounting arrangement
DE3236325A1 (de) * 1982-09-30 1984-04-05 Siemens AG, 1000 Berlin und 8000 München Flachbaugruppe
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
SE435443B (sv) * 1983-02-18 1984-09-24 Ericsson Telefon Ab L M Kylanordning for elektroniska komponenter vilka genom hallare er anslutna till kretskort
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
DE3587933T2 (de) * 1984-02-27 1995-05-11 Whitaker Corp Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen.
US4555151A (en) * 1984-08-06 1985-11-26 Gte Communication Systems Corporation Contact terminal device for connecting hybrid circuit modules to a printed circuit board
JPS61157290U (en, 2012) * 1985-03-22 1986-09-29
US4682829A (en) * 1985-06-13 1987-07-28 Amp Incorporated Surface mount socket for dual in-line package
US4647126A (en) * 1985-06-17 1987-03-03 Sperry Corporation Compliant lead clip
US4676571A (en) * 1985-07-23 1987-06-30 Thomas & Betts Corporation Leaded chip carrier connector
JPH0325410Y2 (en, 2012) * 1985-08-10 1991-06-03
JPH0511508Y2 (en, 2012) * 1985-10-04 1993-03-22
US4799897A (en) * 1985-12-30 1989-01-24 Dai-Ichi Seiko Kabushiki Kaisha IC tester socket
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
JPH0218547Y2 (en, 2012) * 1986-05-02 1990-05-23
US4747017A (en) * 1986-05-27 1988-05-24 General Motors Corporation Surface mountable integrated circuit package equipped with sockets
US4873615A (en) * 1986-10-09 1989-10-10 Amp Incorporated Semiconductor chip carrier system
US4846702A (en) * 1988-01-07 1989-07-11 Minnesota Mining & Manufacturing Company Electrical connector for surface mount chip carrier installed in a socket
US4941832A (en) * 1989-01-30 1990-07-17 Amp Incorporated Low profile chip carrier socket
JPH02155181A (ja) * 1989-10-02 1990-06-14 Yamaichi Electric Mfg Co Ltd Ｉｃ接続器
US5088930A (en) * 1990-11-20 1992-02-18 Advanced Interconnections Corporation Integrated circuit socket with reed-shaped leads
US5157480A (en) * 1991-02-06 1992-10-20 Motorola, Inc. Semiconductor device having dual electrical contact sites
US5177326A (en) * 1991-10-21 1993-01-05 Gec-Marconi Electronic Systems Corp. Lead wire array for a leadless chip carrier
US5158467A (en) * 1991-11-01 1992-10-27 Amp Incorporated High speed bare chip test socket
US5226825A (en) * 1992-01-15 1993-07-13 The Whitaker Corporation Surface mount chip carrier socket
US5288236A (en) * 1992-04-01 1994-02-22 Sun Microsystems, Inc. Method and apparatus for replacing electronic components on a printed circuit board
EP0567255B1 (en) * 1992-04-24 1999-01-20 Altera Corporation Surface mount chip carrier
US5880403A (en) * 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5923538A (en) * 1994-10-17 1999-07-13 Lsi Logic Corporation Support member for mounting a microelectronic circuit package
US5629837A (en) * 1995-09-20 1997-05-13 Oz Technologies, Inc. Button contact for surface mounting an IC device to a circuit board
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
FR2743170B1 (fr) * 1995-12-28 1998-02-06 Framatome Connectors Int Connecteur actif pour carte a puce
US5920114A (en) 1997-09-25 1999-07-06 International Business Machines Corporation Leadframe having resilient carrier positioning means
US5910024A (en) * 1997-08-28 1999-06-08 Mcms, Inc. Carrier socket for receiving a damaged IC
US5874323A (en) * 1997-08-28 1999-02-23 Mcms, Inc. Method of providing electrical contact to component leads
US6297654B1 (en) 1999-07-14 2001-10-02 Cerprobe Corporation Test socket and method for testing an IC device in a dead bug orientation
DE19935188C2 (de) * 1999-07-27 2002-06-13 Amphenol Tuchel Elect Kontaktblock für einen Chipkartenleser
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6558169B2 (en) * 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package
US6891276B1 (en) * 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US6575766B1 (en) * 2002-02-26 2003-06-10 Intel Corporation Laminated socket contacts
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
JP2004304604A (ja) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd 小型カメラモジュールのソケットへの取付け構造
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
EP1622362A1 (en) * 2004-07-12 2006-02-01 Research In Motion Limited Structure for mounting a component to a circuit-board
US7918671B2 (en) * 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
GB2416928A (en) * 2004-08-02 2006-02-08 Itt Mfg Enterprises Inc Carrier for compression chip
US20070029649A1 (en) * 2005-08-08 2007-02-08 Honeywell International Inc. Plastic lead frame with snap-together circuitry
DE102007005630B4 (de) * 2007-02-05 2019-08-08 Infineon Technologies Ag Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls
CN201160134Y (zh) * 2007-09-22 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
EP2260299A4 (en) * 2008-03-04 2011-12-14 3M Innovative Properties Co MONITORING THE QUALITY OF BRATOEL USING A COMBINATION OF OPTICAL QUERY PROCEDURES AND DEVICES
US7581965B1 (en) 2008-05-01 2009-09-01 Commscope, Inc. Of North Carolina Bottom entry interconnection element for connecting components to a circuit board
EP2340557A1 (en) * 2008-10-27 2011-07-06 Nxp B.V. Microelectronic package assembly, method for disconnecting a microelectronic package
US10826208B1 (en) * 2017-01-30 2020-11-03 Superior Sensor Technology Sensor with integrated electrical contacts
CN111812357B (zh) * 2020-07-10 2021-05-25 浙江大学 一种用于微纳米制造的自填料三臂式热扫描探针
EP4271152A1 (de) * 2022-04-27 2023-11-01 FRONIUS INTERNATIONAL GmbH Elektronische baugruppe mit zumindest einer leiterplatte und externen elektronischen bauteilen sowie wechselrichter mit einer solchen elektronischen baugruppe

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US3311790A (en) * 1965-02-17 1967-03-28 Brown Engineering Company Inc Micromodule connector and assembly
US3337678A (en) * 1965-06-30 1967-08-22 John P Stelmak Sealed microminiature electronic package
US3643133A (en) * 1969-12-15 1972-02-15 Computer Ind Inc Wire-routing system
US3701077A (en) * 1969-12-29 1972-10-24 Tech Inc K Electronic components
US3710299A (en) * 1971-06-01 1973-01-09 Aries Electronics Low profile socket for integrated circuit pack
US3910664A (en) * 1973-01-04 1975-10-07 Amp Inc Multi-contact electrical connector for a ceramic substrate or the like
US3873173A (en) * 1973-10-05 1975-03-25 Itt Electrical connector assembly
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US3984166A (en) * 1975-05-07 1976-10-05 Burroughs Corporation Semiconductor device package having lead frame structure with integral spring contacts
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames

Also Published As

Publication number Publication date
ES462635A1 (es) 1978-07-01
IT1087366B (it) 1985-06-04
FR2365899B1 (en, 2012) 1982-11-19
JPS5341979A (en) 1978-04-15
CA1081334A (en) 1980-07-08
GB1543665A (en) 1979-04-04
FR2365899A1 (fr) 1978-04-21
JPS61711B2 (en, 2012) 1986-01-10
US4089575A (en) 1978-05-16
DE2743241A1 (de) 1978-03-30

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: KADOR, U., DIPL.-CHEM. DR.RER.NAT. KLUNKER, H., DI

8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: KLUNKER, H., DIPL.-ING. DR.RER.NAT. SCHMITT-NILSON

D2 Grant after examination
8364 No opposition during term of opposition