DE2644332A1 - Pressure contact for thyristor chips gate electrode - has cup spring pressing contact pad down onto gate and inside ceramic cylinder - Google Patents

Pressure contact for thyristor chips gate electrode - has cup spring pressing contact pad down onto gate and inside ceramic cylinder

Info

Publication number
DE2644332A1
DE2644332A1 DE19762644332 DE2644332A DE2644332A1 DE 2644332 A1 DE2644332 A1 DE 2644332A1 DE 19762644332 DE19762644332 DE 19762644332 DE 2644332 A DE2644332 A DE 2644332A DE 2644332 A1 DE2644332 A1 DE 2644332A1
Authority
DE
Germany
Prior art keywords
gate
gate electrode
ceramic cylinder
contact
down onto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19762644332
Other languages
German (de)
Other versions
DE2644332C2 (en
Inventor
Heinrich Gerstenkoeper
Hubert Reinold
Heinz Ing Grad Juchmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUPEC GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE2644332A priority Critical patent/DE2644332C2/en
Publication of DE2644332A1 publication Critical patent/DE2644332A1/en
Application granted granted Critical
Publication of DE2644332C2 publication Critical patent/DE2644332C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)

Abstract

The pressure contact, for a thyristor chip's gate electrode, consists of a main contact (3) on the surface of the chip and a second contact (45) pressed onto the gate electrode (13). The second contact is located in a hole in the main contact and is pressed down by a cup-spring (42) acting between it and the underside of a ceramic cylinder (41) that slides into the hole in the main contact. The conductor (41) leading to the gate contact passes through a vertical slit in the side of the ceramic cylinder.
DE2644332A 1976-10-01 1976-10-01 Arrangement for pressure contacting the control electrode of a thyristor semiconductor disk Expired DE2644332C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2644332A DE2644332C2 (en) 1976-10-01 1976-10-01 Arrangement for pressure contacting the control electrode of a thyristor semiconductor disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2644332A DE2644332C2 (en) 1976-10-01 1976-10-01 Arrangement for pressure contacting the control electrode of a thyristor semiconductor disk

Publications (2)

Publication Number Publication Date
DE2644332A1 true DE2644332A1 (en) 1978-04-06
DE2644332C2 DE2644332C2 (en) 1983-05-19

Family

ID=5989418

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2644332A Expired DE2644332C2 (en) 1976-10-01 1976-10-01 Arrangement for pressure contacting the control electrode of a thyristor semiconductor disk

Country Status (1)

Country Link
DE (1) DE2644332C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0158749A1 (en) * 1984-01-17 1985-10-23 Mitsubishi Denki Kabushiki Kaisha Semiconducteur device having pressure loaded members

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1913298B2 (en) * 1969-03-15 1972-03-02 Licenüa Patent Verwaltungs GmbH, 6000 Frankfurt THYRISTOR WITH PRESSURE CONTACT

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1913298B2 (en) * 1969-03-15 1972-03-02 Licenüa Patent Verwaltungs GmbH, 6000 Frankfurt THYRISTOR WITH PRESSURE CONTACT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0158749A1 (en) * 1984-01-17 1985-10-23 Mitsubishi Denki Kabushiki Kaisha Semiconducteur device having pressure loaded members

Also Published As

Publication number Publication date
DE2644332C2 (en) 1983-05-19

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Legal Events

Date Code Title Description
OAP Request for examination filed
OD Request for examination
8126 Change of the secondary classification

Ipc: H01L 29/74

D2 Grant after examination
8320 Willingness to grant licenses declared (paragraph 23)
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALB

8339 Ceased/non-payment of the annual fee