JPS51149778A - Pressure contact type semiconductor device - Google Patents

Pressure contact type semiconductor device

Info

Publication number
JPS51149778A
JPS51149778A JP7266875A JP7266875A JPS51149778A JP S51149778 A JPS51149778 A JP S51149778A JP 7266875 A JP7266875 A JP 7266875A JP 7266875 A JP7266875 A JP 7266875A JP S51149778 A JPS51149778 A JP S51149778A
Authority
JP
Japan
Prior art keywords
type semiconductor
semiconductor device
pressure contact
contact type
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7266875A
Other languages
Japanese (ja)
Other versions
JPS5739061B2 (en
Inventor
Yoichi Araki
Minami Takeuchi
Shuzo Saeki
Toshinobu Sekiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7266875A priority Critical patent/JPS51149778A/en
Publication of JPS51149778A publication Critical patent/JPS51149778A/en
Publication of JPS5739061B2 publication Critical patent/JPS5739061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain a pressure contact type semiconductor device capable of fixing the side gate type semiconductor element with pressing force.
JP7266875A 1975-06-17 1975-06-17 Pressure contact type semiconductor device Granted JPS51149778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7266875A JPS51149778A (en) 1975-06-17 1975-06-17 Pressure contact type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7266875A JPS51149778A (en) 1975-06-17 1975-06-17 Pressure contact type semiconductor device

Publications (2)

Publication Number Publication Date
JPS51149778A true JPS51149778A (en) 1976-12-22
JPS5739061B2 JPS5739061B2 (en) 1982-08-19

Family

ID=13495962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7266875A Granted JPS51149778A (en) 1975-06-17 1975-06-17 Pressure contact type semiconductor device

Country Status (1)

Country Link
JP (1) JPS51149778A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574244U (en) * 1980-06-06 1982-01-09

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014359U (en) * 1973-06-06 1975-02-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014359U (en) * 1973-06-06 1975-02-14

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574244U (en) * 1980-06-06 1982-01-09
JPS6120759Y2 (en) * 1980-06-06 1986-06-21

Also Published As

Publication number Publication date
JPS5739061B2 (en) 1982-08-19

Similar Documents

Publication Publication Date Title
SE389961B (en) WAY TO MANUFACTURE AN ELECTRICAL CONTACT DEVICE
JPS51123078A (en) Fet semiconductor element
NL7603191A (en) PRESSURE DEVICE.
NL7611421A (en) CONTACT DEVICE.
NL7504946A (en) ELECTRICAL CONTACT DEVICE.
SE398192B (en) ELECTRICAL CONTACT DEVICE JUST MADE TO PRODUCE THE SAME
CA1026014A (en) Semiconductor component with pressure contact
JPS52114273A (en) Pressure contact type semiconductor device
NL7612127A (en) PRESSURE RELEASE DEVICE.
NL7606521A (en) CARBURATOR WITH CONSTANT PRESSURE.
JPS5216147A (en) Pacage method for surface elastic wave element
NL7610996A (en) MULTI-METAL PRESSURE PLATE.
JPS51149778A (en) Pressure contact type semiconductor device
IT1060796B (en) COMMANDABLE SEMICONDUCTOR COMPONENT
SE7509982L (en) SLEEVE FOR CONTACT PRESSING
NL7701717A (en) PRESSURE DEVICE WITH ELECTRO-MECHANICALLY DRIVEN PRESSURE ELEMENTS.
IT972620B (en) SEMICONDUCTOR COMPONENT WITH PRESSURE CONTACT
JPS51134579A (en) Semiconductor device
JPS521670A (en) Ultra-high pressure device
NL7705512A (en) FLAT PRESSURE PLATE.
NL7510539A (en) SUSPENSIONAL CONTACT DEVICE.
SE387201B (en) CONTACT DEVICE
SU458960A1 (en) Contact device
JPS54150077A (en) Pressure contact type semiconductor device
CA941872A (en) Electrode contact device