DE2638474C3 - - Google Patents

Info

Publication number
DE2638474C3
DE2638474C3 DE2638474A DE2638474A DE2638474C3 DE 2638474 C3 DE2638474 C3 DE 2638474C3 DE 2638474 A DE2638474 A DE 2638474A DE 2638474 A DE2638474 A DE 2638474A DE 2638474 C3 DE2638474 C3 DE 2638474C3
Authority
DE
Germany
Prior art keywords
laser beam
thin
photomask
scanning
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2638474A
Other languages
German (de)
English (en)
Other versions
DE2638474B2 (fr
DE2638474A1 (de
Inventor
Mikio Hongo
Junichi Yokohama Nakabayashi (Japan)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2638474A1 publication Critical patent/DE2638474A1/de
Publication of DE2638474B2 publication Critical patent/DE2638474B2/de
Application granted granted Critical
Publication of DE2638474C3 publication Critical patent/DE2638474C3/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE19762638474 1975-08-27 1976-08-26 Verfahren zur herstellung einer fotomaske Granted DE2638474A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10303175A JPS5227372A (en) 1975-08-27 1975-08-27 Photo mask processing system and its device

Publications (3)

Publication Number Publication Date
DE2638474A1 DE2638474A1 (de) 1977-03-10
DE2638474B2 DE2638474B2 (fr) 1978-05-03
DE2638474C3 true DE2638474C3 (fr) 1979-01-04

Family

ID=14343273

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762638474 Granted DE2638474A1 (de) 1975-08-27 1976-08-26 Verfahren zur herstellung einer fotomaske

Country Status (4)

Country Link
JP (1) JPS5227372A (fr)
DE (1) DE2638474A1 (fr)
GB (1) GB1554296A (fr)
NL (1) NL7609502A (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53120377A (en) * 1977-03-30 1978-10-20 Nec Corp Laser machining apparatus for correction of photo masks
JPS5871617A (ja) * 1981-10-23 1983-04-28 Nec Corp レ−ザアニ−リング装置
JPS5892026U (ja) * 1981-12-16 1983-06-22 呉羽合繊株式会社 捲物用帯状体
US4548883A (en) * 1983-05-31 1985-10-22 At&T Bell Laboratories Correction of lithographic masks
JPS61168726A (ja) * 1985-01-21 1986-07-30 Norin Kogyosha:Goushi ガス遮断装置
US5338645A (en) * 1986-06-16 1994-08-16 Motorola, Inc. Three dimensional printed circuits
US6341009B1 (en) * 2000-02-24 2002-01-22 Quantronix Corporation Laser delivery system and method for photolithographic mask repair

Also Published As

Publication number Publication date
DE2638474B2 (fr) 1978-05-03
NL7609502A (nl) 1977-03-01
JPS5324787B2 (fr) 1978-07-22
GB1554296A (en) 1979-10-17
JPS5227372A (en) 1977-03-01
DE2638474A1 (de) 1977-03-10

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee