DE2624807A1 - Baugruppe fuer halbleitervorrichtungen - Google Patents

Baugruppe fuer halbleitervorrichtungen

Info

Publication number
DE2624807A1
DE2624807A1 DE19762624807 DE2624807A DE2624807A1 DE 2624807 A1 DE2624807 A1 DE 2624807A1 DE 19762624807 DE19762624807 DE 19762624807 DE 2624807 A DE2624807 A DE 2624807A DE 2624807 A1 DE2624807 A1 DE 2624807A1
Authority
DE
Germany
Prior art keywords
assembly according
ring
insulating ring
pole
flange
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762624807
Other languages
German (de)
English (en)
Inventor
Mieczylslaw W Byczkowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of DE2624807A1 publication Critical patent/DE2624807A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Thyristors (AREA)
DE19762624807 1975-06-02 1976-06-02 Baugruppe fuer halbleitervorrichtungen Withdrawn DE2624807A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/582,610 US4008486A (en) 1975-06-02 1975-06-02 Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Publications (1)

Publication Number Publication Date
DE2624807A1 true DE2624807A1 (de) 1976-12-16

Family

ID=24329807

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762624807 Withdrawn DE2624807A1 (de) 1975-06-02 1976-06-02 Baugruppe fuer halbleitervorrichtungen

Country Status (9)

Country Link
US (1) US4008486A (enExample)
CH (1) CH612540A5 (enExample)
DE (1) DE2624807A1 (enExample)
ES (1) ES448440A1 (enExample)
FR (1) FR2313774A1 (enExample)
GB (1) GB1555515A (enExample)
NL (1) NL7605903A (enExample)
SE (1) SE7606179L (enExample)
SU (1) SU845810A3 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4131905A (en) * 1977-05-26 1978-12-26 Electric Power Research Institute, Inc. Light-triggered thyristor and package therefore
DE2810416C2 (de) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement mit Kunststoffummantelung
US4257058A (en) * 1979-07-05 1981-03-17 Electric Power Research Institute, Inc. Package for radiation triggered semiconductor device and method
GB8410847D0 (en) * 1984-04-27 1984-06-06 Westinghouse Brake & Signal Semiconductor housings
EP0320618A1 (de) * 1987-12-14 1989-06-21 BBC Brown Boveri AG Gehäuse für einen abschaltbaren Leistungsthyristor (GTO)
DE4227063A1 (de) * 1992-08-15 1994-02-17 Abb Research Ltd Abschaltbares Hochleistungs-Halbleiterbauelement
EP0660402B1 (en) * 1993-12-24 1998-11-04 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Power semiconductor device
EP0660396B1 (en) * 1993-12-24 1998-11-04 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Power MOS device chip and package assembly
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
DE69418037T2 (de) * 1994-08-02 1999-08-26 Consorzio Per La Ricerca Sulla Microelettronica Ne Leistungshalbleitervorrichtung aus MOS-Technology-Chips und Gehäuseaufbau
US7132698B2 (en) * 2002-01-25 2006-11-07 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
US6781227B2 (en) * 2002-01-25 2004-08-24 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
NO20130076A1 (no) * 2012-01-16 2013-07-17 Schlumberger Technology Bv Rørinnkapslet motorledning
USD712940S1 (en) * 2012-05-17 2014-09-09 Anthony Cerniglia Locating ring
USD713432S1 (en) * 2012-05-17 2014-09-16 Anthony Cerniglia Locating ring
CN113725085B (zh) * 2021-08-31 2024-03-29 深圳技术大学 一种封装零件的装配工艺方法和封装零件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058209A (en) * 1962-10-16 Method of manufacturing a vacuum tight closure
NL101704C (enExample) * 1958-07-02
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
DE1514152A1 (de) * 1964-12-16 1969-09-11 Licentia Gmbh Halbleiter-Gleichrichterzelle
US3337678A (en) * 1965-06-30 1967-08-22 John P Stelmak Sealed microminiature electronic package
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
CH487504A (de) * 1968-03-09 1970-03-15 Mitsubishi Electric Corp Halbleitervorrichtung
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
DE2014289A1 (de) * 1970-03-25 1971-10-14 Semikron Gleichrichterbau Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
US3654529A (en) * 1971-04-05 1972-04-04 Gen Electric Loose contact press pack
US3831067A (en) * 1972-05-15 1974-08-20 Int Rectifier Corp Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
US3918147A (en) * 1974-03-25 1975-11-11 Corning Glass Works Hermetic enclosure for electronic component

Also Published As

Publication number Publication date
FR2313774A1 (fr) 1976-12-31
ES448440A1 (es) 1977-07-01
CH612540A5 (enExample) 1979-07-31
US4008486A (en) 1977-02-15
SE7606179L (sv) 1976-12-03
NL7605903A (nl) 1976-12-06
GB1555515A (en) 1979-11-14
FR2313774B1 (enExample) 1980-07-25
SU845810A3 (ru) 1981-07-07

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee