DE2546312A1 - Halbleitereinheit und verfahren zur herstellung derselben - Google Patents

Halbleitereinheit und verfahren zur herstellung derselben

Info

Publication number
DE2546312A1
DE2546312A1 DE19752546312 DE2546312A DE2546312A1 DE 2546312 A1 DE2546312 A1 DE 2546312A1 DE 19752546312 DE19752546312 DE 19752546312 DE 2546312 A DE2546312 A DE 2546312A DE 2546312 A1 DE2546312 A1 DE 2546312A1
Authority
DE
Germany
Prior art keywords
unit according
semiconductor unit
yoke
pressure body
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19752546312
Other languages
German (de)
English (en)
Inventor
Adriano Devide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri France SA filed Critical BBC Brown Boveri AG Switzerland
Publication of DE2546312A1 publication Critical patent/DE2546312A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
  • Jigs For Machine Tools (AREA)
DE19752546312 1975-09-23 1975-10-16 Halbleitereinheit und verfahren zur herstellung derselben Ceased DE2546312A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1232075A CH592961A5 (US20080242721A1-20081002-C00053.png) 1975-09-23 1975-09-23

Publications (1)

Publication Number Publication Date
DE2546312A1 true DE2546312A1 (de) 1977-03-24

Family

ID=4381916

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19752546312 Ceased DE2546312A1 (de) 1975-09-23 1975-10-16 Halbleitereinheit und verfahren zur herstellung derselben
DE19757532876U Expired DE7532876U (de) 1975-09-23 1975-10-16 Halbleitereinheit

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19757532876U Expired DE7532876U (de) 1975-09-23 1975-10-16 Halbleitereinheit

Country Status (4)

Country Link
CH (1) CH592961A5 (US20080242721A1-20081002-C00053.png)
DE (2) DE2546312A1 (US20080242721A1-20081002-C00053.png)
FR (1) FR2326040A1 (US20080242721A1-20081002-C00053.png)
NO (1) NO146220C (US20080242721A1-20081002-C00053.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
FR2629153B1 (fr) * 1988-03-22 1990-05-04 Bull Sa Dispositif de fixation a pression de deux pieces l'une a l'autre

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1204751B (de) * 1960-09-30 1965-11-11 Siemens Ag Halbleiterbauelement mit einem scheibenfoermigen Gehaeuse und Verfahren zur Herstellung eines solchen Bauelementes
CH526857A (de) * 1970-09-29 1972-08-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
CH442502A (de) * 1965-04-23 1967-08-31 Siemens Ag Gleichrichteranlage
SE316534B (US20080242721A1-20081002-C00053.png) * 1965-07-09 1969-10-27 Asea Ab

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1204751B (de) * 1960-09-30 1965-11-11 Siemens Ag Halbleiterbauelement mit einem scheibenfoermigen Gehaeuse und Verfahren zur Herstellung eines solchen Bauelementes
CH526857A (de) * 1970-09-29 1972-08-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
CH592961A5 (US20080242721A1-20081002-C00053.png) 1977-11-15
NO146220C (no) 1982-08-18
FR2326040B1 (US20080242721A1-20081002-C00053.png) 1982-07-16
NO146220B (no) 1982-05-10
NO763210L (no) 1977-03-24
FR2326040A1 (fr) 1977-04-22
DE7532876U (de) 1977-06-30

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Legal Events

Date Code Title Description
8120 Willingness to grant licences paragraph 23
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: LUECK, G., DIPL.-ING. DR.RER.NAT., PAT.-ANW., 7891

8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, BADEN, AARGAU, CH

8128 New person/name/address of the agent

Representative=s name: DERZEIT KEIN VERTRETER BESTELLT

8128 New person/name/address of the agent

Representative=s name: RUPPRECHT, K., DIPL.-ING., PAT.-ANW., 6242 KRONBER

8131 Rejection