DE2530415C3 - Verfahren zum Vorbereiten von Trägermaterialien für die Herstellung von Metallmustern - Google Patents
Verfahren zum Vorbereiten von Trägermaterialien für die Herstellung von MetallmusternInfo
- Publication number
- DE2530415C3 DE2530415C3 DE2530415A DE2530415A DE2530415C3 DE 2530415 C3 DE2530415 C3 DE 2530415C3 DE 2530415 A DE2530415 A DE 2530415A DE 2530415 A DE2530415 A DE 2530415A DE 2530415 C3 DE2530415 C3 DE 2530415C3
- Authority
- DE
- Germany
- Prior art keywords
- metal
- solution
- ions
- acid
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 title claims description 18
- 229910052751 metal Inorganic materials 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 title claims description 5
- 239000000243 solution Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010953 base metal Substances 0.000 claims description 9
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 150000003839 salts Chemical class 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- -1 halogen ions Chemical class 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 3
- 239000012876 carrier material Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 230000006911 nucleation Effects 0.000 claims description 2
- 238000010899 nucleation Methods 0.000 claims description 2
- 239000012266 salt solution Substances 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 2
- 206010073306 Exposure to radiation Diseases 0.000 claims 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000003638 chemical reducing agent Substances 0.000 claims 1
- 150000002505 iron Chemical class 0.000 claims 1
- 239000010970 precious metal Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 69
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 21
- 239000010410 layer Substances 0.000 description 17
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 14
- 238000002474 experimental method Methods 0.000 description 13
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 150000004820 halides Chemical class 0.000 description 7
- 239000004310 lactic acid Substances 0.000 description 7
- 235000014655 lactic acid Nutrition 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 230000001235 sensitizing effect Effects 0.000 description 4
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011775 sodium fluoride Substances 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- 101150084548 Cubn gene Proteins 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- PKOVWEHDVFYKHL-UHFFFAOYSA-L disodium;9,10-dioxoanthracene-2,6-disulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC=C2C(=O)C3=CC(S(=O)(=O)[O-])=CC=C3C(=O)C2=C1 PKOVWEHDVFYKHL-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 210000000003 hoof Anatomy 0.000 description 1
- 229960002050 hydrofluoric acid Drugs 0.000 description 1
- JGJLWPGRMCADHB-UHFFFAOYSA-N hypobromite Inorganic materials Br[O-] JGJLWPGRMCADHB-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 230000033458 reproduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000013024 sodium fluoride Nutrition 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/487,737 US3994727A (en) | 1971-07-29 | 1974-07-11 | Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2530415A1 DE2530415A1 (de) | 1976-01-29 |
| DE2530415B2 DE2530415B2 (de) | 1979-05-23 |
| DE2530415C3 true DE2530415C3 (de) | 1980-01-17 |
Family
ID=23936918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2530415A Expired DE2530415C3 (de) | 1974-07-11 | 1975-07-04 | Verfahren zum Vorbereiten von Trägermaterialien für die Herstellung von Metallmustern |
Country Status (13)
| Country | Link |
|---|---|
| JP (2) | JPS5134725A (enExample) |
| AU (1) | AU8113175A (enExample) |
| CA (1) | CA1050357A (enExample) |
| CH (1) | CH587352A5 (enExample) |
| DE (1) | DE2530415C3 (enExample) |
| DK (1) | DK312675A (enExample) |
| ES (1) | ES439321A2 (enExample) |
| FR (1) | FR2278094A2 (enExample) |
| GB (1) | GB1519332A (enExample) |
| IT (1) | IT1057900B (enExample) |
| NL (1) | NL184430C (enExample) |
| SE (1) | SE7507878L (enExample) |
| ZA (1) | ZA753537B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2813001A1 (de) * | 1978-03-21 | 1979-09-27 | Andus Electronic L Treutler & | Verfahren zur additiven herstellung gedruckter schaltungen |
| JPS59171952A (ja) * | 1983-03-18 | 1984-09-28 | Dainippon Printing Co Ltd | 経時安定性の改良された画像形成材料形成用インキ |
| US20150233011A1 (en) * | 2014-02-19 | 2015-08-20 | Macdermid Acumen, Inc. | Treatment for Electroplating Racks to Avoid Rack Metallization |
| JP6991104B2 (ja) * | 2018-06-26 | 2022-01-12 | 日華化学株式会社 | 接合材料及びそれを用いた接合方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR7205898D0 (pt) * | 1971-08-31 | 1973-07-03 | Eastman Kodak Co | Aperfeicoado suporte fotografico sensivel a luz bem como processo para preparar uma imagem fotografica e aperfeicoamento em elemento foto termografico |
-
1975
- 1975-05-14 AU AU81131/75A patent/AU8113175A/en not_active Expired
- 1975-05-26 CA CA227,745A patent/CA1050357A/en not_active Expired
- 1975-06-02 ZA ZA00753537A patent/ZA753537B/xx unknown
- 1975-07-03 CH CH869275A patent/CH587352A5/xx not_active IP Right Cessation
- 1975-07-04 DE DE2530415A patent/DE2530415C3/de not_active Expired
- 1975-07-07 GB GB28498/75A patent/GB1519332A/en not_active Expired
- 1975-07-09 SE SE7507878A patent/SE7507878L/xx unknown
- 1975-07-10 DK DK312675A patent/DK312675A/da not_active Application Discontinuation
- 1975-07-11 JP JP50085756A patent/JPS5134725A/ja active Granted
- 1975-07-11 NL NLAANVRAGE7508354,A patent/NL184430C/xx not_active IP Right Cessation
- 1975-07-11 ES ES439321A patent/ES439321A2/es not_active Expired
- 1975-07-11 IT IT50499/75A patent/IT1057900B/it active
- 1975-07-11 FR FR7521856A patent/FR2278094A2/fr active Granted
-
1978
- 1978-05-24 JP JP6317478A patent/JPS5499042A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2530415A1 (de) | 1976-01-29 |
| SE7507878L (sv) | 1976-01-12 |
| CA1050357A (en) | 1979-03-13 |
| IT1057900B (it) | 1982-03-30 |
| FR2278094A2 (fr) | 1976-02-06 |
| CH587352A5 (enExample) | 1977-04-29 |
| AU8113175A (en) | 1976-11-18 |
| NL7508354A (nl) | 1976-01-13 |
| JPS574704B2 (enExample) | 1982-01-27 |
| DE2530415B2 (de) | 1979-05-23 |
| JPS552617B2 (enExample) | 1980-01-21 |
| JPS5134725A (en) | 1976-03-24 |
| FR2278094B2 (enExample) | 1977-12-09 |
| JPS5499042A (en) | 1979-08-04 |
| NL184430B (nl) | 1989-02-16 |
| ES439321A2 (es) | 1977-03-16 |
| DK312675A (da) | 1976-01-13 |
| GB1519332A (en) | 1978-07-26 |
| ZA753537B (en) | 1976-05-26 |
| NL184430C (nl) | 1989-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OI | Miscellaneous see part 1 | ||
| C3 | Grant after two publication steps (3rd publication) | ||
| 8328 | Change in the person/name/address of the agent |
Free format text: PFENNING, J., DIPL.-ING. MEINIG, K., DIPL.-PHYS., PAT.-ANW., 1000 BERLIN |
|
| AG | Has addition no. |
Ref country code: DE Ref document number: 2530614 Format of ref document f/p: P |
|
| 8340 | Patent of addition ceased/non-payment of fee of main patent |