DE2453429A1 - Aetzloesungen fuer kupfer und kupferlegierungen - Google Patents

Aetzloesungen fuer kupfer und kupferlegierungen

Info

Publication number
DE2453429A1
DE2453429A1 DE19742453429 DE2453429A DE2453429A1 DE 2453429 A1 DE2453429 A1 DE 2453429A1 DE 19742453429 DE19742453429 DE 19742453429 DE 2453429 A DE2453429 A DE 2453429A DE 2453429 A1 DE2453429 A1 DE 2453429A1
Authority
DE
Germany
Prior art keywords
copper
concentration
acid
etching
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19742453429
Other languages
German (de)
English (en)
Inventor
Katsutoshi Itani
Akira Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Tokai Denka Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokai Denka Industrial Co Ltd filed Critical Tokai Denka Industrial Co Ltd
Publication of DE2453429A1 publication Critical patent/DE2453429A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Catalysts (AREA)
DE19742453429 1973-11-19 1974-11-11 Aetzloesungen fuer kupfer und kupferlegierungen Pending DE2453429A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48129156A JPS5224508B2 (enExample) 1973-11-19 1973-11-19

Publications (1)

Publication Number Publication Date
DE2453429A1 true DE2453429A1 (de) 1975-05-22

Family

ID=15002514

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19742453429 Pending DE2453429A1 (de) 1973-11-19 1974-11-11 Aetzloesungen fuer kupfer und kupferlegierungen

Country Status (7)

Country Link
US (1) US3936332A (enExample)
JP (1) JPS5224508B2 (enExample)
CA (1) CA1039631A (enExample)
DE (1) DE2453429A1 (enExample)
FR (1) FR2251631B1 (enExample)
GB (1) GB1464041A (enExample)
IT (1) IT1022770B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1078629C (zh) * 1994-08-12 2002-01-30 美克株式会社 铜及铜合金的浸蚀液

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110237A (en) * 1973-11-19 1978-08-29 Tokai Denka Kabushiki Kaisha Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions
US4155866A (en) * 1978-04-24 1979-05-22 International Business Machines Corporation Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant
US4362595A (en) * 1980-05-19 1982-12-07 The Boeing Company Screen fabrication by hand chemical blanking
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
US4725374A (en) * 1983-10-06 1988-02-16 Olin Corporation Process and apparatus for etching copper base materials
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
US5607619A (en) * 1988-03-07 1997-03-04 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US5620585A (en) * 1988-03-07 1997-04-15 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US5248386A (en) * 1991-02-08 1993-09-28 Aluminum Company Of America Milling solution and method
EP0580780A1 (en) * 1991-04-12 1994-02-02 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US20040035717A1 (en) * 2002-08-21 2004-02-26 Casio Micronics Co. , Ltd. Chemical treatment method and chemical treatment apparatus
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
JP6164614B2 (ja) * 2013-12-06 2017-07-19 メック株式会社 エッチング液、補給液及び銅配線の形成方法
JP6000420B1 (ja) * 2015-08-31 2016-09-28 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410802A (en) * 1966-02-21 1968-11-12 Fmc Corp Process and composition for etching of copper metal
JPS5221460B1 (enExample) * 1971-04-26 1977-06-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1078629C (zh) * 1994-08-12 2002-01-30 美克株式会社 铜及铜合金的浸蚀液

Also Published As

Publication number Publication date
CA1039631A (en) 1978-10-03
US3936332A (en) 1976-02-03
FR2251631B1 (enExample) 1978-06-16
JPS5079448A (enExample) 1975-06-27
JPS5224508B2 (enExample) 1977-07-01
GB1464041A (en) 1977-02-09
IT1022770B (it) 1978-04-20
FR2251631A1 (enExample) 1975-06-13

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Legal Events

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