DE2417106A1 - Thyristorsaeule - Google Patents

Thyristorsaeule

Info

Publication number
DE2417106A1
DE2417106A1 DE2417106A DE2417106A DE2417106A1 DE 2417106 A1 DE2417106 A1 DE 2417106A1 DE 2417106 A DE2417106 A DE 2417106A DE 2417106 A DE2417106 A DE 2417106A DE 2417106 A1 DE2417106 A1 DE 2417106A1
Authority
DE
Germany
Prior art keywords
heat
gas
thyristor
cooling
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2417106A
Other languages
German (de)
English (en)
Inventor
Friedrich Ing Grad Scherbaum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE2417106A priority Critical patent/DE2417106A1/de
Priority to JP50042136A priority patent/JPS583383B2/ja
Publication of DE2417106A1 publication Critical patent/DE2417106A1/de
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/26—Safety or protection arrangements; Arrangements for preventing malfunction for allowing differential expansion between elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE2417106A 1974-04-08 1974-04-08 Thyristorsaeule Pending DE2417106A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE2417106A DE2417106A1 (de) 1974-04-08 1974-04-08 Thyristorsaeule
JP50042136A JPS583383B2 (ja) 1974-04-08 1975-04-07 サイリスタスタツク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2417106A DE2417106A1 (de) 1974-04-08 1974-04-08 Thyristorsaeule

Publications (1)

Publication Number Publication Date
DE2417106A1 true DE2417106A1 (de) 1975-10-16

Family

ID=5912495

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2417106A Pending DE2417106A1 (de) 1974-04-08 1974-04-08 Thyristorsaeule

Country Status (2)

Country Link
JP (1) JPS583383B2 (enExample)
DE (1) DE2417106A1 (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2603813A1 (de) * 1976-02-02 1977-08-04 Bbc Brown Boveri & Cie Spannvorrichtung fuer ein thermisch und elektrisch druckkontaktiertes halbleiterbauelement in scheibenzellenbauweise
DE2801660A1 (de) * 1978-01-16 1979-07-19 Kabel Metallwerke Ghh Vorrichtung zum abfuehren der verlustwaerme von elektronischen bauelementen
EP0015578A1 (de) * 1979-03-08 1980-09-17 Fuji Electric Co. Ltd. Siedegekühlte Halbleiteranordnung
FR2588072A1 (fr) * 1985-09-30 1987-04-03 Jeumont Schneider Installation de dissipation pour elements semi-conducteurs de puissance
FR2604827A1 (fr) * 1986-10-06 1988-04-08 Alsthom Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
EP0469744A1 (en) * 1990-07-30 1992-02-05 Canon Kabushiki Kaisha Wafer cooling device
EP0661741A1 (en) * 1993-12-28 1995-07-05 Hitachi, Ltd. Heat-pipe type cooling apparatus
US6081427A (en) * 1999-09-30 2000-06-27 Rockwell Technologies, Llc Retainer for press-pack semi-conductor device
FR2895589A1 (fr) * 2005-12-23 2007-06-29 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5565866U (enExample) * 1978-10-31 1980-05-07

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2603813A1 (de) * 1976-02-02 1977-08-04 Bbc Brown Boveri & Cie Spannvorrichtung fuer ein thermisch und elektrisch druckkontaktiertes halbleiterbauelement in scheibenzellenbauweise
DE2801660A1 (de) * 1978-01-16 1979-07-19 Kabel Metallwerke Ghh Vorrichtung zum abfuehren der verlustwaerme von elektronischen bauelementen
EP0015578A1 (de) * 1979-03-08 1980-09-17 Fuji Electric Co. Ltd. Siedegekühlte Halbleiteranordnung
FR2588072A1 (fr) * 1985-09-30 1987-04-03 Jeumont Schneider Installation de dissipation pour elements semi-conducteurs de puissance
EP0218526A1 (fr) * 1985-09-30 1987-04-15 JEUMONT-SCHNEIDER Société anonyme dite: Installation de dissipation pour éléments semi-conducteurs de puissance
US4733331A (en) * 1985-09-30 1988-03-22 Jeumont-Schneider Corporation Heat dissipation mechanism for power semiconductor elements
FR2604827A1 (fr) * 1986-10-06 1988-04-08 Alsthom Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance
DE3719637A1 (de) * 1987-06-12 1988-12-29 Asea Brown Boveri Siedekuehleinrichtung fuer halbleiterelemente
EP0469744A1 (en) * 1990-07-30 1992-02-05 Canon Kabushiki Kaisha Wafer cooling device
US5413167A (en) * 1990-07-30 1995-05-09 Canon Kabushiki Kaisha Wafer cooling device
EP0661741A1 (en) * 1993-12-28 1995-07-05 Hitachi, Ltd. Heat-pipe type cooling apparatus
US5651414A (en) * 1993-12-28 1997-07-29 Hitachi, Ltd. Heat-pipe type cooling apparatus
US6081427A (en) * 1999-09-30 2000-06-27 Rockwell Technologies, Llc Retainer for press-pack semi-conductor device
FR2895589A1 (fr) * 2005-12-23 2007-06-29 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.
WO2007074289A3 (fr) * 2005-12-23 2007-08-16 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures

Also Published As

Publication number Publication date
JPS583383B2 (ja) 1983-01-21
JPS514969A (enExample) 1976-01-16

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