DE2336152C3 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE2336152C3
DE2336152C3 DE2336152A DE2336152A DE2336152C3 DE 2336152 C3 DE2336152 C3 DE 2336152C3 DE 2336152 A DE2336152 A DE 2336152A DE 2336152 A DE2336152 A DE 2336152A DE 2336152 C3 DE2336152 C3 DE 2336152C3
Authority
DE
Germany
Prior art keywords
aluminum
silver
electrode
semiconductor
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2336152A
Other languages
German (de)
English (en)
Other versions
DE2336152A1 (de
DE2336152B2 (de
Inventor
Karl Dipl.-Phys. Dr.Rer.Nat. Platzoeder
Alfred Porst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2336152A priority Critical patent/DE2336152C3/de
Priority to BE146063A priority patent/BE817065A/xx
Priority to GB2922074A priority patent/GB1474575A/en
Priority to IT25031/74A priority patent/IT1017057B/it
Priority to JP7972474A priority patent/JPS5510134B2/ja
Priority to CA204,752A priority patent/CA1015070A/en
Priority to FR7424542A priority patent/FR2238248B1/fr
Priority to SE7409300A priority patent/SE395201B/xx
Publication of DE2336152A1 publication Critical patent/DE2336152A1/de
Publication of DE2336152B2 publication Critical patent/DE2336152B2/de
Application granted granted Critical
Publication of DE2336152C3 publication Critical patent/DE2336152C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/275—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/27505—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
DE2336152A 1973-07-16 1973-07-16 Halbleiterbauelement Expired DE2336152C3 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE2336152A DE2336152C3 (de) 1973-07-16 1973-07-16 Halbleiterbauelement
BE146063A BE817065A (fr) 1973-07-16 1974-06-28 Composant semi-conducteur
GB2922074A GB1474575A (en) 1973-07-16 1974-07-02 Semiconductor components
JP7972474A JPS5510134B2 (cg-RX-API-DMAC7.html) 1973-07-16 1974-07-11
IT25031/74A IT1017057B (it) 1973-07-16 1974-07-11 Componente a semiconduttori
CA204,752A CA1015070A (en) 1973-07-16 1974-07-15 Semiconductor components
FR7424542A FR2238248B1 (cg-RX-API-DMAC7.html) 1973-07-16 1974-07-15
SE7409300A SE395201B (sv) 1973-07-16 1974-07-16 Halvledarkomponent innefattande bl a en aluminiumelektrod forsedd med ett silverskikt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2336152A DE2336152C3 (de) 1973-07-16 1973-07-16 Halbleiterbauelement

Publications (3)

Publication Number Publication Date
DE2336152A1 DE2336152A1 (de) 1975-01-30
DE2336152B2 DE2336152B2 (de) 1978-07-20
DE2336152C3 true DE2336152C3 (de) 1979-03-22

Family

ID=5887096

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2336152A Expired DE2336152C3 (de) 1973-07-16 1973-07-16 Halbleiterbauelement

Country Status (8)

Country Link
JP (1) JPS5510134B2 (cg-RX-API-DMAC7.html)
BE (1) BE817065A (cg-RX-API-DMAC7.html)
CA (1) CA1015070A (cg-RX-API-DMAC7.html)
DE (1) DE2336152C3 (cg-RX-API-DMAC7.html)
FR (1) FR2238248B1 (cg-RX-API-DMAC7.html)
GB (1) GB1474575A (cg-RX-API-DMAC7.html)
IT (1) IT1017057B (cg-RX-API-DMAC7.html)
SE (1) SE395201B (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584058Y2 (ja) * 1976-08-10 1983-01-24 株式会社ターダ ガス器具
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
JPS5490732U (cg-RX-API-DMAC7.html) * 1977-12-12 1979-06-27
JPS6123050U (ja) * 1985-06-17 1986-02-10 株式会社 同和 バ−ナにおける始動消火連動装置

Also Published As

Publication number Publication date
JPS5510134B2 (cg-RX-API-DMAC7.html) 1980-03-14
FR2238248A1 (cg-RX-API-DMAC7.html) 1975-02-14
GB1474575A (en) 1977-05-25
DE2336152A1 (de) 1975-01-30
SE395201B (sv) 1977-08-01
SE7409300L (cg-RX-API-DMAC7.html) 1975-02-21
JPS5040075A (cg-RX-API-DMAC7.html) 1975-04-12
CA1015070A (en) 1977-08-02
BE817065A (fr) 1974-10-16
FR2238248B1 (cg-RX-API-DMAC7.html) 1978-03-24
IT1017057B (it) 1977-07-20
DE2336152B2 (de) 1978-07-20

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee