DE2315402A1 - Verfahren zum automatischen zerschneiden von halbleiterplaettchen in chips und zum orientierten aufloeten von chips auf modulsubstrate - Google Patents

Verfahren zum automatischen zerschneiden von halbleiterplaettchen in chips und zum orientierten aufloeten von chips auf modulsubstrate

Info

Publication number
DE2315402A1
DE2315402A1 DE2315402A DE2315402DA DE2315402A1 DE 2315402 A1 DE2315402 A1 DE 2315402A1 DE 2315402 A DE2315402 A DE 2315402A DE 2315402D A DE2315402D A DE 2315402DA DE 2315402 A1 DE2315402 A1 DE 2315402A1
Authority
DE
Germany
Prior art keywords
chips
station
chip
module substrates
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2315402A
Other languages
German (de)
English (en)
Inventor
Sen William John Ryan
Edward Francis Schirmer
Nandor Gyorgy Thoma
James Hobert Tolley
Donald Lawrence Wilder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2315402A1 publication Critical patent/DE2315402A1/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5176—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means
    • Y10T29/5177—Plural diverse manufacturing apparatus including means for metal shaping or assembling including machining means and work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53043—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor including means to divert defective work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE2315402A 1972-03-31 1973-03-28 Verfahren zum automatischen zerschneiden von halbleiterplaettchen in chips und zum orientierten aufloeten von chips auf modulsubstrate Granted DE2315402A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00240018A US3811182A (en) 1972-03-31 1972-03-31 Object handling fixture, system, and process

Publications (1)

Publication Number Publication Date
DE2315402A1 true DE2315402A1 (de) 1973-10-04

Family

ID=22904758

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2315402A Granted DE2315402A1 (de) 1972-03-31 1973-03-28 Verfahren zum automatischen zerschneiden von halbleiterplaettchen in chips und zum orientierten aufloeten von chips auf modulsubstrate
DE2315402A Expired DE2315402C2 (enExample) 1972-03-31 1973-03-28

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE2315402A Expired DE2315402C2 (enExample) 1972-03-31 1973-03-28

Country Status (5)

Country Link
US (1) US3811182A (enExample)
CA (1) CA980920A (enExample)
DE (2) DE2315402A1 (enExample)
FR (1) FR2178865B1 (enExample)
GB (1) GB1420863A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879839A (en) * 1973-06-04 1975-04-29 Ibm Method of manufacturing multi-function LSI wafers
US3918146A (en) * 1974-08-30 1975-11-11 Gen Motors Corp Magnetic semiconductor device bonding apparatus with vacuum-biased probes
US3896541A (en) * 1974-09-16 1975-07-29 Western Electric Co Method and apparatus for supporting substrates during bonding
US4046985A (en) * 1974-11-25 1977-09-06 International Business Machines Corporation Semiconductor wafer alignment apparatus
US4181249A (en) * 1977-08-26 1980-01-01 Hughes Aircraft Company Eutectic die attachment method for integrated circuits
US4646009A (en) * 1982-05-18 1987-02-24 Ade Corporation Contacts for conductivity-type sensors
JPS60100450A (ja) * 1983-11-07 1985-06-04 Disco Abrasive Sys Ltd 半導体ウエーハ装着及び切断装置
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
DE3920035A1 (de) * 1988-07-04 1990-01-11 Kuttler Hans Juergen Vorrichtung zum vereinzeln und transportieren von werkstuecken
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
JPH0770824B2 (ja) * 1991-03-04 1995-07-31 松下電器産業株式会社 電子部品接続方法
US5323013A (en) * 1992-03-31 1994-06-21 The United States Of America As Represented By The Secretary Of The Navy Method of rapid sample handling for laser processing
US5445559A (en) * 1993-06-24 1995-08-29 Texas Instruments Incorporated Wafer-like processing after sawing DMDs
US5840592A (en) * 1993-12-21 1998-11-24 The United States Of America As Represented By The Secretary Of The Navy Method of improving the spectral response and dark current characteristics of an image gathering detector
US5915370A (en) * 1996-03-13 1999-06-29 Micron Technology, Inc. Saw for segmenting a semiconductor wafer
US5874319A (en) * 1996-05-21 1999-02-23 Honeywell Inc. Vacuum die bond for known good die assembly
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US5809987A (en) * 1996-11-26 1998-09-22 Micron Technology,Inc. Apparatus for reducing damage to wafer cutting blades during wafer dicing
KR100236487B1 (ko) * 1997-10-22 2000-01-15 윤종용 정전기 방전 불량을 방지하기 위한 분할형 칩 흡착수단을구비하는 칩 접착 장치
US6187654B1 (en) 1998-03-13 2001-02-13 Intercon Tools, Inc. Techniques for maintaining alignment of cut dies during substrate dicing
US6325059B1 (en) * 1998-09-18 2001-12-04 Intercon Tools, Inc. Techniques for dicing substrates during integrated circuit fabrication
JP4388640B2 (ja) * 1999-09-10 2009-12-24 株式会社ディスコ Ｃｓｐ基板保持部材及び該ｃｓｐ基板保持部材が載置されるｃｓｐ基板用テーブル
US6787382B1 (en) * 2001-08-30 2004-09-07 Micron Technology, Inc. Method and system for singulating semiconductor components
GB2399311B (en) * 2003-03-04 2005-06-15 Xsil Technology Ltd Laser machining using an active assist gas
GB2404280B (en) * 2003-07-03 2006-09-27 Xsil Technology Ltd Die bonding
US7220175B2 (en) * 2005-04-28 2007-05-22 Win Semiconductors Corp. Device for carrying thin wafers and method of carrying the thin wafers
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
JP5882364B2 (ja) * 2011-02-18 2016-03-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウエハレベルのシンギュレーションのための方法
DE102011115834A1 (de) * 2011-10-13 2013-04-18 Thyssenkrupp System Engineering Gmbh Verfahren zum Justieren einer Haltevorrichtung und System zum Bearbeiten von Werkstücken
US9842782B2 (en) * 2016-03-25 2017-12-12 Mikro Mesa Technology Co., Ltd. Intermediate structure for transfer, method for preparing micro-device for transfer, and method for processing array of semiconductor device
JP2019012773A (ja) * 2017-06-30 2019-01-24 株式会社ディスコ ウェーハの加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1237942B (de) * 1962-07-19 1967-03-30 Siemens Ag Vorrichtung zum Haltern scheibenfoermiger Werkstuecke aus Halbleitermaterial durch Ansaugen
US3503500A (en) * 1965-09-18 1970-03-31 Telefunken Patent Sorting apparatus and method
DE2028910A1 (de) * 1969-06-30 1971-01-07 International Business Machines Corp , Armonk, NY (V St A ) Einrichtung zur Prüfung und Sor tierung von elektrischen Schaltungsele menten
US3583561A (en) * 1968-12-19 1971-06-08 Transistor Automation Corp Die sorting system
DE1764336A1 (de) * 1967-05-23 1972-03-23 Ibm Monolithische integrierte Halbleiterstruktur und Verfahren zu ihrer Herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3131476A (en) * 1963-03-21 1964-05-05 Philco Corp Production of semiconductor blanks
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
US3720309A (en) * 1971-12-07 1973-03-13 Teledyne Inc Method and apparatus for sorting semiconductor dice

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1237942B (de) * 1962-07-19 1967-03-30 Siemens Ag Vorrichtung zum Haltern scheibenfoermiger Werkstuecke aus Halbleitermaterial durch Ansaugen
US3503500A (en) * 1965-09-18 1970-03-31 Telefunken Patent Sorting apparatus and method
DE1764336A1 (de) * 1967-05-23 1972-03-23 Ibm Monolithische integrierte Halbleiterstruktur und Verfahren zu ihrer Herstellung
US3583561A (en) * 1968-12-19 1971-06-08 Transistor Automation Corp Die sorting system
DE2028910A1 (de) * 1969-06-30 1971-01-07 International Business Machines Corp , Armonk, NY (V St A ) Einrichtung zur Prüfung und Sor tierung von elektrischen Schaltungsele menten
US3584741A (en) * 1969-06-30 1971-06-15 Ibm Batch sorting apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Hardway, Glenn A.: Applications of Laser System to Microelectronics and Silicon Wafer Dicing. In: Solid State Technology, Bd. 13, 1970, Nr. 4, S. 63-67 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137301A1 (de) * 1981-09-18 1983-04-14 Presco Inc., Beverly Hills, Calif. "verfahren und vorrichtung zur handhabung kleiner teile in der fertigung"

Also Published As

Publication number Publication date
FR2178865B1 (enExample) 1976-05-21
DE2315402C2 (enExample) 1989-06-08
GB1420863A (en) 1976-01-14
FR2178865A1 (enExample) 1973-11-16
CA980920A (en) 1975-12-30
US3811182A (en) 1974-05-21

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Legal Events

Date Code Title Description
OD Request for examination
8125 Change of the main classification

Ipc: H01L 21/68

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee