DE2313327A1 - Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat - Google Patents
Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substratInfo
- Publication number
- DE2313327A1 DE2313327A1 DE19732313327 DE2313327A DE2313327A1 DE 2313327 A1 DE2313327 A1 DE 2313327A1 DE 19732313327 DE19732313327 DE 19732313327 DE 2313327 A DE2313327 A DE 2313327A DE 2313327 A1 DE2313327 A1 DE 2313327A1
- Authority
- DE
- Germany
- Prior art keywords
- conductor
- substrate
- conductor tracks
- conductors
- tin solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims description 69
- 239000000758 substrate Substances 0.000 title claims description 20
- 239000011888 foil Substances 0.000 title claims description 14
- 238000000034 method Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7204575A NL7204575A (enrdf_load_stackoverflow) | 1972-04-06 | 1972-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2313327A1 true DE2313327A1 (de) | 1973-10-18 |
Family
ID=19815787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19732313327 Pending DE2313327A1 (de) | 1972-04-06 | 1973-03-17 | Verfahren zum befestigen einer mit leiterspuren versehenen isolierenden folie an stromleitern auf einem substrat |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5113994B2 (enrdf_load_stackoverflow) |
| CA (1) | CA987788A (enrdf_load_stackoverflow) |
| CH (1) | CH554599A (enrdf_load_stackoverflow) |
| DE (1) | DE2313327A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2179104B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1423868A (enrdf_load_stackoverflow) |
| HK (1) | HK4177A (enrdf_load_stackoverflow) |
| IT (1) | IT980751B (enrdf_load_stackoverflow) |
| NL (1) | NL7204575A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019131950A1 (de) * | 2019-11-26 | 2021-05-27 | Landulf Martin Skoda | Lötpad und Verfahren zum Löten |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52156235A (en) * | 1976-06-21 | 1977-12-26 | Hitachi Ltd | Transistor ignitor |
| JPS53101268U (enrdf_load_stackoverflow) * | 1977-01-20 | 1978-08-16 | ||
| CN107623993B (zh) * | 2017-10-31 | 2020-06-23 | Oppo广东移动通信有限公司 | 一种电路板、电路板制作方法、电子设备及其装配方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3474297A (en) * | 1967-06-30 | 1969-10-21 | Texas Instruments Inc | Interconnection system for complex semiconductor arrays |
-
1972
- 1972-04-06 NL NL7204575A patent/NL7204575A/xx unknown
-
1973
- 1973-03-17 DE DE19732313327 patent/DE2313327A1/de active Pending
- 1973-04-02 CA CA167,674A patent/CA987788A/en not_active Expired
- 1973-04-03 JP JP3749173A patent/JPS5113994B2/ja not_active Expired
- 1973-04-03 CH CH475573A patent/CH554599A/xx not_active IP Right Cessation
- 1973-04-03 IT IT6795373A patent/IT980751B/it active
- 1973-04-03 GB GB1590573A patent/GB1423868A/en not_active Expired
- 1973-04-04 FR FR7312124A patent/FR2179104B1/fr not_active Expired
-
1977
- 1977-01-20 HK HK4177A patent/HK4177A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019131950A1 (de) * | 2019-11-26 | 2021-05-27 | Landulf Martin Skoda | Lötpad und Verfahren zum Löten |
Also Published As
| Publication number | Publication date |
|---|---|
| HK4177A (en) | 1977-01-28 |
| GB1423868A (en) | 1976-02-04 |
| CH554599A (de) | 1974-09-30 |
| NL7204575A (enrdf_load_stackoverflow) | 1973-10-09 |
| FR2179104B1 (enrdf_load_stackoverflow) | 1977-12-30 |
| IT980751B (it) | 1974-10-10 |
| FR2179104A1 (enrdf_load_stackoverflow) | 1973-11-16 |
| JPS4917970A (enrdf_load_stackoverflow) | 1974-02-16 |
| JPS5113994B2 (enrdf_load_stackoverflow) | 1976-05-06 |
| CA987788A (en) | 1976-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHW | Rejection |