DE2312061B2 - Transistorherstellungsverfahren und nach diesem verfahren hergestellter transistor - Google Patents

Transistorherstellungsverfahren und nach diesem verfahren hergestellter transistor

Info

Publication number
DE2312061B2
DE2312061B2 DE19732312061 DE2312061A DE2312061B2 DE 2312061 B2 DE2312061 B2 DE 2312061B2 DE 19732312061 DE19732312061 DE 19732312061 DE 2312061 A DE2312061 A DE 2312061A DE 2312061 B2 DE2312061 B2 DE 2312061B2
Authority
DE
Germany
Prior art keywords
zone
dopant
base
emitter
conductivity type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19732312061
Other languages
German (de)
English (en)
Other versions
DE2312061A1 (de
Inventor
Richard Steven Piscataway NJ.; Scavuzzo Robert John Bethlehem Pa.;(V.St.A.) Payne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE2312061A1 publication Critical patent/DE2312061A1/de
Publication of DE2312061B2 publication Critical patent/DE2312061B2/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H10P30/212—Through-implantation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/04—Dopants, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/041—Doping control in crystal growth
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/067—Graded energy gap
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/145—Shaped junctions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/151—Simultaneous diffusion

Landscapes

  • Bipolar Transistors (AREA)
DE19732312061 1972-03-13 1973-03-10 Transistorherstellungsverfahren und nach diesem verfahren hergestellter transistor Ceased DE2312061B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23402172A 1972-03-13 1972-03-13

Publications (2)

Publication Number Publication Date
DE2312061A1 DE2312061A1 (de) 1973-10-18
DE2312061B2 true DE2312061B2 (de) 1977-04-14

Family

ID=22879545

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732312061 Ceased DE2312061B2 (de) 1972-03-13 1973-03-10 Transistorherstellungsverfahren und nach diesem verfahren hergestellter transistor

Country Status (10)

Country Link
US (1) US3756861A (enExample)
JP (1) JPS493581A (enExample)
BE (1) BE796460A (enExample)
CA (1) CA963980A (enExample)
DE (1) DE2312061B2 (enExample)
FR (1) FR2175911B1 (enExample)
GB (1) GB1421222A (enExample)
IT (1) IT980547B (enExample)
NL (1) NL155983B (enExample)
SE (1) SE386309B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862930A (en) * 1972-08-22 1975-01-28 Us Navy Radiation-hardened cmos devices and circuits
FR2209217B1 (enExample) * 1972-11-10 1977-12-16 Lignes Telegraph Telephon
JPS5633864B2 (enExample) * 1972-12-06 1981-08-06
US3887994A (en) * 1973-06-29 1975-06-10 Ibm Method of manufacturing a semiconductor device
US3928081A (en) * 1973-10-26 1975-12-23 Signetics Corp Method for fabricating semiconductor devices using composite mask and ion implantation
US3880676A (en) * 1973-10-29 1975-04-29 Rca Corp Method of making a semiconductor device
US4033788A (en) * 1973-12-10 1977-07-05 Hughes Aircraft Company Ion implanted gallium arsenide semiconductor devices fabricated in semi-insulating gallium arsenide substrates
US3928082A (en) * 1973-12-28 1975-12-23 Texas Instruments Inc Self-aligned transistor process
US3902926A (en) * 1974-02-21 1975-09-02 Signetics Corp Method of making an ion implanted resistor
US3925105A (en) * 1974-07-02 1975-12-09 Texas Instruments Inc Process for fabricating integrated circuits utilizing ion implantation
US3933528A (en) * 1974-07-02 1976-01-20 Texas Instruments Incorporated Process for fabricating integrated circuits utilizing ion implantation
GB1492447A (en) * 1974-07-25 1977-11-16 Siemens Ag Semiconductor devices
JPS5431872B2 (enExample) * 1974-09-06 1979-10-09
US3920483A (en) * 1974-11-25 1975-11-18 Ibm Method of ion implantation through a photoresist mask
US3950188A (en) * 1975-05-12 1976-04-13 Trw Inc. Method of patterning polysilicon
US4045250A (en) * 1975-08-04 1977-08-30 Rca Corporation Method of making a semiconductor device
US4025364A (en) * 1975-08-11 1977-05-24 Fairchild Camera And Instrument Corporation Process for simultaneously fabricating epitaxial resistors, base resistors, and vertical transistor bases
US4033787A (en) * 1975-10-06 1977-07-05 Honeywell Inc. Fabrication of semiconductor devices utilizing ion implantation
US4030942A (en) * 1975-10-28 1977-06-21 International Business Machines Corporation Semiconductor masking for device fabrication utilizing ion implantation and other methods
US4001050A (en) * 1975-11-10 1977-01-04 Ncr Corporation Method of fabricating an isolated p-n junction
US4062699A (en) * 1976-02-20 1977-12-13 Western Digital Corporation Method for fabricating diffusion self-aligned short channel MOS device
US4052229A (en) * 1976-06-25 1977-10-04 Intel Corporation Process for preparing a substrate for mos devices of different thresholds
US4069068A (en) * 1976-07-02 1978-01-17 International Business Machines Corporation Semiconductor fabrication method for improved device yield by minimizing pipes between common conductivity type regions
US4140547A (en) * 1976-09-09 1979-02-20 Tokyo Shibaura Electric Co., Ltd. Method for manufacturing MOSFET devices by ion-implantation
DE3165937D1 (en) * 1981-04-14 1984-10-18 Itt Ind Gmbh Deutsche Method of making an integrated planar transistor
US4694566A (en) * 1982-04-12 1987-09-22 Signetics Corporation Method for manufacturing programmable read-only memory containing cells formed with opposing diodes
JPS6119520A (ja) * 1984-07-06 1986-01-28 Nippon Denso Co Ltd 搬送装置
JPH0784251B2 (ja) * 1986-01-16 1995-09-13 日本電装株式会社 整列装填装置
JPH0699038B2 (ja) * 1986-02-27 1994-12-07 日本電装株式会社 連続波状フィンの搬送装置
KR900005871B1 (ko) * 1987-09-21 1990-08-13 삼성전자 주식회사 반도체 메모리소자의 제조방법
US5244821A (en) * 1991-06-07 1993-09-14 At&T Bell Laboratories Bipolar fabrication method
ES2364870T3 (es) * 2008-12-12 2011-09-15 Abb Technology Ag Método para la fabricación de un dispositivo semiconductor de energía.

Also Published As

Publication number Publication date
SE386309B (sv) 1976-08-02
DE2312061A1 (de) 1973-10-18
BE796460A (fr) 1973-07-02
CA963980A (en) 1975-03-04
JPS493581A (enExample) 1974-01-12
NL7303358A (enExample) 1973-09-17
GB1421222A (en) 1976-01-14
FR2175911B1 (enExample) 1978-02-10
NL155983B (nl) 1978-02-15
FR2175911A1 (enExample) 1973-10-26
IT980547B (it) 1974-10-10
US3756861A (en) 1973-09-04

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Legal Events

Date Code Title Description
8235 Patent refused