DE2259182A1 - Verfahren zum herstellen einer matrix zur verwendung in der galvanoformung - Google Patents
Verfahren zum herstellen einer matrix zur verwendung in der galvanoformungInfo
- Publication number
- DE2259182A1 DE2259182A1 DE2259182A DE2259182A DE2259182A1 DE 2259182 A1 DE2259182 A1 DE 2259182A1 DE 2259182 A DE2259182 A DE 2259182A DE 2259182 A DE2259182 A DE 2259182A DE 2259182 A1 DE2259182 A1 DE 2259182A1
- Authority
- DE
- Germany
- Prior art keywords
- matrix
- temperature
- photoresist
- pattern
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011159 matrix material Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005323 electroforming Methods 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 229940114081 cinnamate Drugs 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000012047 saturated solution Substances 0.000 claims description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 229920005601 base polymer Polymers 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000012286 potassium permanganate Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 229910052759 nickel Inorganic materials 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- LBSANEJBGMCTBH-UHFFFAOYSA-N manganate Chemical compound [O-][Mn]([O-])(=O)=O LBSANEJBGMCTBH-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012629 purifying agent Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22138872A | 1972-01-27 | 1972-01-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2259182A1 true DE2259182A1 (de) | 1973-08-09 |
Family
ID=22827605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2259182A Pending DE2259182A1 (de) | 1972-01-27 | 1972-12-02 | Verfahren zum herstellen einer matrix zur verwendung in der galvanoformung |
Country Status (9)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0036595A1 (de) * | 1980-03-22 | 1981-09-30 | Hoechst Aktiengesellschaft | Verfahren zur Herstellung von Siebdruckschablonen auf galvanischem Wege |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4352870A (en) * | 1979-11-27 | 1982-10-05 | Bell Telephone Laboratories, Incorporated | High resolution two-layer resists |
| GB8401824D0 (en) * | 1984-01-24 | 1984-02-29 | Autotype Int Ltd | Photosensitive stencil materials |
| US4773971A (en) * | 1986-10-30 | 1988-09-27 | Hewlett-Packard Company | Thin film mandrel |
| EP0729071A1 (de) * | 1995-02-15 | 1996-08-28 | Schablonentechnik Kufstein Aktiengesellschaft | Verfahren zur Herstellung einer Druckschablone |
| CN111254472B (zh) * | 2018-11-30 | 2022-02-18 | 南京理工大学 | 电化学制备叠氮化铜/叠氮化亚铜薄膜的方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2765230A (en) * | 1953-02-25 | 1956-10-02 | Buckbee Mears Co | Method of forming matrices for the electrodeposition of grids |
| US3368949A (en) * | 1963-06-10 | 1968-02-13 | Bendix Corp | Process for electroforming inlaid circuits |
-
0
- BE BE790596D patent/BE790596A/xx unknown
-
1972
- 1972-01-27 US US00221388A patent/US3764485A/en not_active Expired - Lifetime
- 1972-09-26 CA CA152,513A patent/CA981506A/en not_active Expired
- 1972-10-06 GB GB4617072A patent/GB1397814A/en not_active Expired
- 1972-11-10 NL NL7215264A patent/NL7215264A/xx not_active Application Discontinuation
- 1972-12-02 DE DE2259182A patent/DE2259182A1/de active Pending
- 1972-12-04 FR FR7243064A patent/FR2169033B1/fr not_active Expired
- 1972-12-18 JP JP47126297A patent/JPS4886742A/ja active Pending
- 1972-12-21 IT IT33353/72A patent/IT972718B/it active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0036595A1 (de) * | 1980-03-22 | 1981-09-30 | Hoechst Aktiengesellschaft | Verfahren zur Herstellung von Siebdruckschablonen auf galvanischem Wege |
| US4401520A (en) * | 1980-03-22 | 1983-08-30 | Hoechst Aktiengesellschaft | Process for the preparation of screen printing stencils by an electroplating method |
Also Published As
| Publication number | Publication date |
|---|---|
| US3764485A (en) | 1973-10-09 |
| IT972718B (it) | 1974-05-31 |
| GB1397814A (en) | 1975-06-18 |
| FR2169033A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-09-07 |
| NL7215264A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-07-31 |
| FR2169033B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-10-29 |
| CA981506A (en) | 1976-01-13 |
| JPS4886742A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-11-15 |
| BE790596A (fr) | 1973-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OHA | Expiration of time for request for examination |