DE2254803A1 - Elektrische leitungspfade enthaltendes keramiksubstrat - Google Patents

Elektrische leitungspfade enthaltendes keramiksubstrat

Info

Publication number
DE2254803A1
DE2254803A1 DE2254803A DE2254803A DE2254803A1 DE 2254803 A1 DE2254803 A1 DE 2254803A1 DE 2254803 A DE2254803 A DE 2254803A DE 2254803 A DE2254803 A DE 2254803A DE 2254803 A1 DE2254803 A1 DE 2254803A1
Authority
DE
Germany
Prior art keywords
ceramic substrate
ceramic
conduction path
metal
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2254803A
Other languages
German (de)
English (en)
Inventor
Dudley Augustus Chance
Stephen Anthony Milkovich
Macy Potter
Ernest Nicholas Urfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2254803A1 publication Critical patent/DE2254803A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE2254803A 1971-12-02 1972-11-09 Elektrische leitungspfade enthaltendes keramiksubstrat Pending DE2254803A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20400271A 1971-12-02 1971-12-02

Publications (1)

Publication Number Publication Date
DE2254803A1 true DE2254803A1 (de) 1973-06-07

Family

ID=22756208

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2254803A Pending DE2254803A1 (de) 1971-12-02 1972-11-09 Elektrische leitungspfade enthaltendes keramiksubstrat

Country Status (4)

Country Link
JP (1) JPS4863273A (cs)
DE (1) DE2254803A1 (cs)
FR (1) FR2161971B1 (cs)
GB (1) GB1372901A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870377A (en) * 1987-11-27 1989-09-26 General Electric Company Electronic circuit substrate construction

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2188194A (en) * 1986-03-21 1987-09-23 Plessey Co Plc Carrier for high frequency integrated circuits
US4942076A (en) * 1988-11-03 1990-07-17 Micro Substrates, Inc. Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870377A (en) * 1987-11-27 1989-09-26 General Electric Company Electronic circuit substrate construction

Also Published As

Publication number Publication date
FR2161971B1 (cs) 1974-08-19
FR2161971A1 (cs) 1973-07-13
GB1372901A (en) 1974-11-06
JPS4863273A (cs) 1973-09-03

Similar Documents

Publication Publication Date Title
EP0516579B1 (de) Durchkontaktierung eines Isolierstoffteils
EP0356644B1 (de) Verfahren zur Herstellung von Wellenleitern auf einem Glassubstrat durch Ionenaustausch
DE3752249T2 (de) Elektronen emittierende Vorrichtung
EP0016925B1 (de) Verfahren zum Aufbringen von Metall auf Metallmuster auf dielektrischen Substraten
DE1671136A1 (de) Druckdichte Metall-Keramik-Verbindung
DE2159531C3 (de) Metall-Keramik-Durchführung
DE68907084T2 (de) Keramischer Mehrschichtkondensator.
DE3913115A1 (de) Verfahren zur herstellung von elektrisch leitfaehigen mustern
DE69606256T2 (de) Verfahren und gerät zum auftragen von kathodenmaterial auf eine drahtkathode
DE2614368A1 (de) Gluehkathode
DE3722576C2 (cs)
DE2357625A1 (de) Verfahren und vorrichtung zum herstellen von keramik-metall-bauteilen
DE4326143A1 (de) Stirrer- und Plungergeräte für geschmolzenes Glas
DE1690276B1 (de) Kathodenzerstaeubungsvrfahren zur herstellung ohmscher kontakte auf einem halbleitersubstrat und vorrichtung zur durchfuehrung des verfahrens
DE2202520A1 (de) Metall-Isolieraufbau
DE68912365T2 (de) Mehrschichtkondensator.
DE2254803A1 (de) Elektrische leitungspfade enthaltendes keramiksubstrat
DE2328303B2 (de) Vorrichtung zum Herstellen von Siliciumstäben
DE3873599T2 (de) Kommutator fuer eine elektrische rotationsmaschine und herstellungsverfahren dieses kommutators.
DE69825704T2 (de) Hochdruckentladungslampe und Herstellungsverfahren derselben
DE1218072B (de) Sekundaerelektronenvervielfacher und Verfahren zur Herstellung des Vervielfachers
DE907808C (de) Stromdurchfuehrung durch Waende aus Glas oder Quarz
DE1254727B (de) Verfahren zum Herstellen gedruckter Leitungen
DE2531199A1 (de) Leitende metallische stoffzusammensetzung zum ueberziehen von keramischen substraten und verfahren zur herstellung derseelben
DE3519251C2 (cs)

Legal Events

Date Code Title Description
OHJ Non-payment of the annual fee