DE2240822A1 - Baustein fuer elektrische schaltungen - Google Patents

Baustein fuer elektrische schaltungen

Info

Publication number
DE2240822A1
DE2240822A1 DE2240822A DE2240822A DE2240822A1 DE 2240822 A1 DE2240822 A1 DE 2240822A1 DE 2240822 A DE2240822 A DE 2240822A DE 2240822 A DE2240822 A DE 2240822A DE 2240822 A1 DE2240822 A1 DE 2240822A1
Authority
DE
Germany
Prior art keywords
building block
support
contacts
disk
blocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2240822A
Other languages
German (de)
English (en)
Inventor
Lothar Lermer
Robert J Schenk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singer Co
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singer Co filed Critical Singer Co
Publication of DE2240822A1 publication Critical patent/DE2240822A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE2240822A 1971-08-20 1972-08-18 Baustein fuer elektrische schaltungen Pending DE2240822A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17336771A 1971-08-20 1971-08-20

Publications (1)

Publication Number Publication Date
DE2240822A1 true DE2240822A1 (de) 1973-03-15

Family

ID=22631689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2240822A Pending DE2240822A1 (de) 1971-08-20 1972-08-18 Baustein fuer elektrische schaltungen

Country Status (9)

Country Link
US (1) US3706010A (enExample)
JP (2) JPS4831456A (enExample)
CA (1) CA951024A (enExample)
DE (1) DE2240822A1 (enExample)
FR (1) FR2150303B1 (enExample)
GB (1) GB1366000A (enExample)
IL (1) IL39630A (enExample)
IT (1) IT963694B (enExample)
SE (1) SE384427B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
DE3818428A1 (de) * 1987-11-27 1989-12-07 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
DE4217289A1 (de) * 1992-05-25 1993-12-16 Mannesmann Ag Fluidkühlung von Halbleiterelementen
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
JPS5276946U (enExample) * 1975-12-05 1977-06-08
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4254446A (en) * 1979-08-30 1981-03-03 Peoples Ric L Modular, hybrid integrated circuit assembly
US4484215A (en) * 1981-05-18 1984-11-20 Burroughs Corporation Flexible mounting support for wafer scale integrated circuits
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS58158705U (ja) * 1983-03-12 1983-10-22 株式会社神崎高級工機製作所 農用トラクタにおける前輪位置変更装置
US4499523A (en) * 1983-03-30 1985-02-12 International Business Machines Corporation Electronic component assembly with a printed circuit board unit and cover
US4549407A (en) * 1984-04-06 1985-10-29 International Business Machines Corporation Evaporative cooling
ATE40022T1 (de) * 1984-08-08 1989-01-15 Siemens Ag Gemeinsames gehaeuse fuer zwei halbleiterkoerper.
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
US6188575B1 (en) * 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495132A (en) * 1967-08-03 1970-02-10 Itt Packaging and actuating system for printed circuit boards and electrical connector assemblies

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
DE3818428A1 (de) * 1987-11-27 1989-12-07 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleitern
DE4217289A1 (de) * 1992-05-25 1993-12-16 Mannesmann Ag Fluidkühlung von Halbleiterelementen
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul

Also Published As

Publication number Publication date
CA951024A (en) 1974-07-09
SE384427B (sv) 1976-05-03
GB1366000A (en) 1974-09-04
FR2150303B1 (enExample) 1976-08-13
IL39630A (en) 1975-08-31
JPS544361U (enExample) 1979-01-12
US3706010A (en) 1972-12-12
IT963694B (it) 1974-01-21
IL39630A0 (en) 1972-08-30
FR2150303A1 (enExample) 1973-04-06
JPS4831456A (enExample) 1973-04-25

Similar Documents

Publication Publication Date Title
DE2240822A1 (de) Baustein fuer elektrische schaltungen
DE69925626T2 (de) Zum wärmeabfuhr geeignete gestapelte leiterplattenanordnung
DE69333300T2 (de) Dreidimensionaler Mehrchipmodul
DE69204263T2 (de) Stapelbares Wärmerohr für eine dreidimensionale kompakte Anordnung von elektronischen Bauteilen.
DE1591199C2 (enExample)
AT398254B (de) Chipträger sowie anordnung von solchen chipträgern
DE2152541C3 (de) Leiterplattenstapel
DE69330450T2 (de) Dreidimensionaler Multichipmodul
DE68918442T2 (de) Flüssig gekühltes integriertes multichip-schaltungsmodul.
DE69401137T2 (de) Kühlungsanordnung für elektrische Leistungsbauteile
EP1331665B1 (de) Kühlvorrichtung
DE3781917T2 (de) Gekuehlte baugruppe.
DE3026183C2 (enExample)
EP0022176B1 (de) Modul für Schaltungschips
EP0516866A1 (en) Modular multilayer interwiring structure
DE10397020B4 (de) Werkstück-Einspannvorrichtung mit Temperatursteuereinheit mit Abstandshaltern zwischen Schichten, die einen Zwischenraum für thermoelektrische Module schaffen und Verfahren zum Halten eines Werkstücks
DE2107549A1 (de) Trager einer elektronischen Schaltung mit einem Sammelsystem mit Warmeleitungs eigenschaften fur alle Richtungen
DE4128603A1 (de) Halbleiteranordnung
DE2362939A1 (de) Raumsparende zusammenschaltungs- und zusammenbauanordnung fuer komplexe digitalsysteme und verfahren zu ihrer herstellung
DE3735455A1 (de) Elektrische bauelemente
DE3321321C2 (enExample)
DE3783266T2 (de) Loesbares montierungssystem fuer halbleiter auf einem leitenden substrat.
DE69918644T2 (de) Elektronisches Leistungselement mit Kühlvorrichtung
DE69021298T2 (de) Gerät für supraleitende Verbindungen.
EP3751602A1 (de) Isoliertes metallsubstrat für eine leistungselektronische baugruppe

Legal Events

Date Code Title Description
OGA New person/name/address of the applicant
OHN Withdrawal