SE384427B - Forpackningsuppbyggnad avsedd att uppbera ett flertal elektriska kretsmoduler - Google Patents

Forpackningsuppbyggnad avsedd att uppbera ett flertal elektriska kretsmoduler

Info

Publication number
SE384427B
SE384427B SE7210851A SE1085172A SE384427B SE 384427 B SE384427 B SE 384427B SE 7210851 A SE7210851 A SE 7210851A SE 1085172 A SE1085172 A SE 1085172A SE 384427 B SE384427 B SE 384427B
Authority
SE
Sweden
Prior art keywords
store
electrical circuit
packaging structure
circuit modules
several electrical
Prior art date
Application number
SE7210851A
Other languages
English (en)
Swedish (sv)
Inventor
L Laermer
R J Schenk
Original Assignee
Singer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singer Co filed Critical Singer Co
Publication of SE384427B publication Critical patent/SE384427B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE7210851A 1971-08-20 1972-08-21 Forpackningsuppbyggnad avsedd att uppbera ett flertal elektriska kretsmoduler SE384427B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17336771A 1971-08-20 1971-08-20

Publications (1)

Publication Number Publication Date
SE384427B true SE384427B (sv) 1976-05-03

Family

ID=22631689

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7210851A SE384427B (sv) 1971-08-20 1972-08-21 Forpackningsuppbyggnad avsedd att uppbera ett flertal elektriska kretsmoduler

Country Status (9)

Country Link
US (1) US3706010A (enExample)
JP (2) JPS4831456A (enExample)
CA (1) CA951024A (enExample)
DE (1) DE2240822A1 (enExample)
FR (1) FR2150303B1 (enExample)
GB (1) GB1366000A (enExample)
IL (1) IL39630A (enExample)
IT (1) IT963694B (enExample)
SE (1) SE384427B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US3999105A (en) * 1974-04-19 1976-12-21 International Business Machines Corporation Liquid encapsulated integrated circuit package
US4006388A (en) * 1975-03-03 1977-02-01 Hughes Aircraft Company Thermally controlled electronic system package
JPS5276946U (enExample) * 1975-12-05 1977-06-08
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4326214A (en) * 1976-11-01 1982-04-20 National Semiconductor Corporation Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip
JPS5591145A (en) * 1978-12-28 1980-07-10 Narumi China Corp Production of ceramic package
US4254446A (en) * 1979-08-30 1981-03-03 Peoples Ric L Modular, hybrid integrated circuit assembly
US4484215A (en) * 1981-05-18 1984-11-20 Burroughs Corporation Flexible mounting support for wafer scale integrated circuits
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPS58158705U (ja) * 1983-03-12 1983-10-22 株式会社神崎高級工機製作所 農用トラクタにおける前輪位置変更装置
US4499523A (en) * 1983-03-30 1985-02-12 International Business Machines Corporation Electronic component assembly with a printed circuit board unit and cover
US4549407A (en) * 1984-04-06 1985-10-29 International Business Machines Corporation Evaporative cooling
EP0172485B1 (de) * 1984-08-08 1989-01-11 Siemens Aktiengesellschaft Gemeinsames Gehäuse für zwei Halbleiterkörper
US4682268A (en) * 1985-02-07 1987-07-21 Nec Corporation Mounting structure for electronic circuit modules
FR2579060B1 (fr) * 1985-03-18 1987-04-17 Socapex Carte de circuit imprime a echangeur thermique et procede de fabrication d'une telle carte
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
DE3536963A1 (de) * 1985-10-17 1987-04-23 Diehl Gmbh & Co Baugruppenanordnung
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
DE3818428C2 (de) * 1987-11-27 1993-11-04 Asea Brown Boveri Kuehldose zum abfuehren der verlustwaerme von halbleiterelementen
US5099254A (en) * 1990-03-22 1992-03-24 Raytheon Company Modular transmitter and antenna array system
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
DE4217289C2 (de) * 1992-05-25 1996-08-29 Mannesmann Ag Fluidgekühlte Leistungstransistoranordnung
DE4327895A1 (de) * 1993-08-19 1995-02-23 Abb Management Ag Stromrichtermodul
US6188575B1 (en) * 1998-06-30 2001-02-13 Intersil Corporation Heat exchanging chassis and method
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495132A (en) * 1967-08-03 1970-02-10 Itt Packaging and actuating system for printed circuit boards and electrical connector assemblies

Also Published As

Publication number Publication date
JPS544361U (enExample) 1979-01-12
DE2240822A1 (de) 1973-03-15
JPS4831456A (enExample) 1973-04-25
CA951024A (en) 1974-07-09
IL39630A (en) 1975-08-31
FR2150303B1 (enExample) 1976-08-13
IL39630A0 (en) 1972-08-30
IT963694B (it) 1974-01-21
US3706010A (en) 1972-12-12
GB1366000A (en) 1974-09-04
FR2150303A1 (enExample) 1973-04-06

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