DE2234775A1 - Kuehlanordnung fuer flache scheibenzellen-halbleiterbauelemente - Google Patents

Kuehlanordnung fuer flache scheibenzellen-halbleiterbauelemente

Info

Publication number
DE2234775A1
DE2234775A1 DE19722234775 DE2234775A DE2234775A1 DE 2234775 A1 DE2234775 A1 DE 2234775A1 DE 19722234775 DE19722234775 DE 19722234775 DE 2234775 A DE2234775 A DE 2234775A DE 2234775 A1 DE2234775 A1 DE 2234775A1
Authority
DE
Germany
Prior art keywords
cooling
cooling arrangement
heat sinks
arrangement according
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722234775
Other languages
German (de)
English (en)
Inventor
Paul Dr Rer Nat Fries
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19722234775 priority Critical patent/DE2234775A1/de
Priority to JP7976073A priority patent/JPS4946682A/ja
Publication of DE2234775A1 publication Critical patent/DE2234775A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Details Of Measuring And Other Instruments (AREA)
DE19722234775 1972-07-14 1972-07-14 Kuehlanordnung fuer flache scheibenzellen-halbleiterbauelemente Pending DE2234775A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19722234775 DE2234775A1 (de) 1972-07-14 1972-07-14 Kuehlanordnung fuer flache scheibenzellen-halbleiterbauelemente
JP7976073A JPS4946682A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-07-14 1973-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722234775 DE2234775A1 (de) 1972-07-14 1972-07-14 Kuehlanordnung fuer flache scheibenzellen-halbleiterbauelemente

Publications (1)

Publication Number Publication Date
DE2234775A1 true DE2234775A1 (de) 1974-01-31

Family

ID=5850695

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722234775 Pending DE2234775A1 (de) 1972-07-14 1972-07-14 Kuehlanordnung fuer flache scheibenzellen-halbleiterbauelemente

Country Status (2)

Country Link
JP (1) JPS4946682A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2234775A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2590005A1 (fr) * 1985-11-08 1987-05-15 Alsthom Cgee Systeme de composants semi-conducteurs de puissance refroidis par circulation d'un liquide

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5099273A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-12-28 1975-08-06
JPS57122552A (en) * 1980-12-16 1982-07-30 Hitachi Ltd Cooler for semiconductor element
US5370178A (en) * 1993-08-25 1994-12-06 International Business Machines Corporation Convertible cooling module for air or water cooling of electronic circuit components
JP6982932B2 (ja) * 2018-11-28 2021-12-17 東芝三菱電機産業システム株式会社 電力変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2590005A1 (fr) * 1985-11-08 1987-05-15 Alsthom Cgee Systeme de composants semi-conducteurs de puissance refroidis par circulation d'un liquide

Also Published As

Publication number Publication date
JPS4946682A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-05-04

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