DE2231299A1 - Loetflussmittel - Google Patents

Loetflussmittel

Info

Publication number
DE2231299A1
DE2231299A1 DE2231299A DE2231299A DE2231299A1 DE 2231299 A1 DE2231299 A1 DE 2231299A1 DE 2231299 A DE2231299 A DE 2231299A DE 2231299 A DE2231299 A DE 2231299A DE 2231299 A1 DE2231299 A1 DE 2231299A1
Authority
DE
Germany
Prior art keywords
soldering
soldering flux
resin
mixture
flux according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2231299A
Other languages
German (de)
English (en)
Inventor
Raymond William Angelo
Albert Lawrence Balan
David Joseph Huettner
Richard Martin Poliak
John Frank Shipley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2231299A1 publication Critical patent/DE2231299A1/de
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE2231299A 1971-06-30 1972-06-26 Loetflussmittel Pending DE2231299A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15858071A 1971-06-30 1971-06-30

Publications (1)

Publication Number Publication Date
DE2231299A1 true DE2231299A1 (de) 1973-01-11

Family

ID=22568791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2231299A Pending DE2231299A1 (de) 1971-06-30 1972-06-26 Loetflussmittel

Country Status (5)

Country Link
US (1) US3791027A (https=)
DE (1) DE2231299A1 (https=)
FR (1) FR2143734B1 (https=)
GB (1) GB1374008A (https=)
IT (1) IT959648B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0173167A1 (en) * 1984-08-30 1986-03-05 Texaco Development Corporation Nonfuming solder cleansing and fusing fluids
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2292375A1 (fr) * 1974-11-21 1976-06-18 Inst Nat Sante Rech Med Generateur d'impulsions de frequences audibles
US4216035A (en) * 1977-12-23 1980-08-05 International Business Machines Corporation Removable protective coating and process of using same
US4369287A (en) * 1981-03-16 1983-01-18 Motorola Inc. Permanent fluxing agent and solder-through conformal coating
US4504007A (en) * 1982-09-14 1985-03-12 International Business Machines Corporation Solder and braze fluxes and processes for using the same
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
US5145722A (en) * 1989-04-11 1992-09-08 Hughes Aircraft Company Method and composition for protecting and enhancing the solderability of metallic surfaces
JP2503099B2 (ja) * 1989-08-08 1996-06-05 日本電装株式会社 はんだ付け用フラックス
US5127968A (en) * 1989-08-16 1992-07-07 Yuho Chemicals Inc. Additive for fluxes and soldering pastes
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
WO1992005228A1 (en) * 1990-09-17 1992-04-02 Motorola, Inc. Solder pastes containing acrylic acid and derivatives thereof
JPH058085A (ja) * 1990-11-30 1993-01-19 Nippondenso Co Ltd はんだ付け用フラツクス
GB2287253B (en) * 1992-03-19 1996-04-03 Fujitsu Ltd Removal of oxide film from a metal
GB2265156B (en) * 1992-03-19 1996-04-03 Fujitsu Ltd Methods for making metal particles spherical and removing oxide film therefrom
EP0831981B1 (en) * 1995-05-24 2007-03-14 Fry's Metals Inc. Epoxy-based, voc-free soldering flux
US7041771B1 (en) * 1995-08-11 2006-05-09 Kac Holdings, Inc. Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
JP3378139B2 (ja) * 1996-03-19 2003-02-17 株式会社デンソー はんだ付け用のフラックス
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US6449834B1 (en) * 1997-05-02 2002-09-17 Scilogy Corp. Electrical conductor coils and methods of making same
US6367150B1 (en) 1997-09-05 2002-04-09 Northrop Grumman Corporation Solder flux compatible with flip-chip underfill material
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
JP3952189B2 (ja) * 2003-02-06 2007-08-01 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
WO2012164957A1 (ja) * 2011-06-02 2012-12-06 パナソニック株式会社 電子部品実装方法、電子部品搭載装置および電子部品実装システム
US20170135227A1 (en) * 2014-06-19 2017-05-11 Alpha Metals, Inc. Engineered Residue Solder Paste Technology

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2833030A (en) * 1952-09-19 1958-05-06 Wall Colmonoy Corp Method of joining metal parts with flexible composite joining material
US2816357A (en) * 1953-08-27 1957-12-17 Bjorksten Res Lab Inc Method of soldering with a polyester flux
US3035339A (en) * 1957-08-12 1962-05-22 Gen Motors Corp Method of soldering and flux therefor
US3119179A (en) * 1958-03-10 1964-01-28 Mccord Corp Soldering flux and method
US3040781A (en) * 1958-04-15 1962-06-26 Martin Marietta Corp Solderable coating
US3376150A (en) * 1964-09-11 1968-04-02 Du Pont Imide and polyimide solutions
US3264146A (en) * 1965-09-10 1966-08-02 Continental Can Co Organic flux compositions and method of using same
US3507828A (en) * 1966-03-09 1970-04-21 Mobil Chem Co Thermosetting resin made by reaction of epoxy copolymer with polyfunctional amine and then with aldehyde
US3436278A (en) * 1966-08-08 1969-04-01 Ibm Glycol soldering fluxes
US3513125A (en) * 1967-02-24 1970-05-19 Grace W R & Co Carbazate crosslinking agent and thermosetting resin compositions and process of making same
US3488831A (en) * 1967-04-14 1970-01-13 Continental Can Co Fluxing materials for soldering metal surfaces
US3655461A (en) * 1970-09-02 1972-04-11 Sanyo Electric Works Flux for aluminum soldering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0173167A1 (en) * 1984-08-30 1986-03-05 Texaco Development Corporation Nonfuming solder cleansing and fusing fluids
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
US7926700B2 (en) 2005-11-08 2011-04-19 W.C. Heraeus Gmbh Solder pastes comprising nonresinous fluxes

Also Published As

Publication number Publication date
GB1374008A (en) 1974-11-13
FR2143734A1 (https=) 1973-02-09
IT959648B (it) 1973-11-10
US3791027A (en) 1974-02-12
FR2143734B1 (https=) 1974-07-26

Similar Documents

Publication Publication Date Title
DE2231299A1 (de) Loetflussmittel
DE69636971T2 (de) Weichlotflussmittel auf epoxybasis ohne flüchtige organische verbindungen
DE1520287C3 (de) Verfahren zur Herstellung von Epoxid polyaddukten
US5989362A (en) Polymerizable flux composition for encapsulating the solder in situ
DE2455443C3 (https=)
EP0029008B1 (de) Flüssiger oder pastöser, vorgelierbarer und wärmehärtbarer Klebstoff auf Epoxidharzbasis und seine Verwendung
EP1123348B1 (de) Schlagfeste epoxidharz-zusammensetzungen
DE69233595T2 (de) Elektrisch leitfähige zusammensetzungen und verfahren zur herstellung derselben und anwendungen
DE69030917T2 (de) Flussmittel beim loeten
DE19711350B4 (de) Lötflussmittel
DE2746494A1 (de) Verfahren zur herstellung von epoxyklebstoffverbindungen zwischen einer vielzahl von substraten
DE69634538T2 (de) Einkapselungsmasse mit fliessmitteleigenschaften und verwendungsverfahren
DE69925107T2 (de) Bleifreies lötpulver und herstellungsverfahren dafür
DE3937732A1 (de) Epoxyharzmasse
DE3006018A1 (de) Verfahren zum fertigstellen der gehaerteten verklebungsnaht eines klebstoffes und nach diesem verfahren hergestelltes produkt
DE2513123A1 (de) Verfahren zur herstellung flexibler epoxyharze
DE1064178B (de) Klebstoff in Form eines festen, biegsamen selbsttragenden Stabes oder Stranges
DE1124688B (de) Verfahren zum Haerten von Epoxyharzen
DE10017783A1 (de) Schlagfeste Epoxidharz-Zusammensetzungen
DE19511553A1 (de) System und Verfahren zur Erzeugung elektrisch leitfähiger Verbindungsstrukturen sowie Verfahren zur Herstellung von Schaltungen und von bestückten Schaltungen
EP0518067B1 (de) Reaktiver Warmschmelzklebstoff
DE2936126A1 (de) Bei umgebungsdruck und umgebungstemperatur stabiler ein-massen-kleber
DE2429992C3 (de) Verfahren zum Herstellen von Vergießungen und Abdichtungen
DE1919129A1 (de) Organisches Lot bzw. Ausfuellmasse
DE2637728A1 (de) Verfahren zur beschichtung von oberflaechen

Legal Events

Date Code Title Description
OHJ Non-payment of the annual fee