DE2223770A1 - Packung fuer einen Mikroschaltkreis - Google Patents

Packung fuer einen Mikroschaltkreis

Info

Publication number
DE2223770A1
DE2223770A1 DE19722223770 DE2223770A DE2223770A1 DE 2223770 A1 DE2223770 A1 DE 2223770A1 DE 19722223770 DE19722223770 DE 19722223770 DE 2223770 A DE2223770 A DE 2223770A DE 2223770 A1 DE2223770 A1 DE 2223770A1
Authority
DE
Germany
Prior art keywords
base plate
microcircuit
pack according
hermetically sealed
ductile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19722223770
Other languages
German (de)
English (en)
Inventor
Drennan George A
Smith James M
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE2223770A1 publication Critical patent/DE2223770A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Packaging Frangible Articles (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
DE19722223770 1971-05-20 1972-05-16 Packung fuer einen Mikroschaltkreis Pending DE2223770A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14545771A 1971-05-20 1971-05-20

Publications (1)

Publication Number Publication Date
DE2223770A1 true DE2223770A1 (de) 1972-11-30

Family

ID=22513214

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19722223770 Pending DE2223770A1 (de) 1971-05-20 1972-05-16 Packung fuer einen Mikroschaltkreis

Country Status (5)

Country Link
US (1) US3784726A (enExample)
DE (1) DE2223770A1 (enExample)
FR (1) FR2138832B1 (enExample)
GB (2) GB1375667A (enExample)
MY (2) MY7500232A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
US3848078A (en) * 1973-09-12 1974-11-12 Collins Radio Co Hybrid electronic circuit employing meshed support
US4100589A (en) * 1975-07-17 1978-07-11 Harris Corporation Microcircuit device including hybrid circuit carrier
US4129897A (en) * 1975-11-20 1978-12-12 Tektronix, Inc. Modular mounting apparatus for substrate means bearing planar circuit means
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
US5105262A (en) * 1988-09-19 1992-04-14 Ford Motor Company Thick film circuit housing assembly design
US5019829A (en) * 1989-02-08 1991-05-28 Heckman Douglas E Plug-in package for microwave integrated circuit having cover-mounted antenna
DE4019235A1 (de) * 1990-06-15 1991-12-19 Voith Gmbh J M Stoffauflauf
US5365108A (en) * 1992-11-19 1994-11-15 Sundstrand Corporation Metal matrix composite semiconductor power switch assembly
US5738270A (en) * 1994-10-07 1998-04-14 Advanced Bionics Corporation Brazeless ceramic-to-metal bonding for use in implantable devices
US5574313A (en) * 1994-10-17 1996-11-12 Litten Systems, Inc. Hermetically sealed microwave integrated circuit package with ground plane fused to package frame
US6677669B2 (en) * 2002-01-18 2004-01-13 International Rectifier Corporation Semiconductor package including two semiconductor die disposed within a common clip
US6998944B2 (en) * 2003-11-14 2006-02-14 Itt Manufacturing Enterprises, Inc. Method and apparatus for microwave interconnection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1239346A (fr) * 1959-06-11 1960-08-26 Thomson Houston Comp Francaise Procédé de fermeture de boîtier de transistors à jonction et boîtiers réalisés suivant ce procédé
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices
US3119052A (en) * 1959-11-24 1964-01-21 Nippon Electric Co Enclosures for semi-conductor electronic elements
US3549949A (en) * 1967-04-03 1970-12-22 Texas Instruments Inc Solid-state modular microwave system
GB1207728A (en) * 1968-11-27 1970-10-07 Standard Telephones Cables Ltd Housing assembly for an electric circuit
US3519896A (en) * 1969-03-11 1970-07-07 Motorola Inc Power transistor assembly

Also Published As

Publication number Publication date
FR2138832A1 (enExample) 1973-01-05
GB1375667A (enExample) 1974-11-27
GB1375668A (enExample) 1974-11-27
DE2264613B2 (de) 1977-04-07
MY7500232A (en) 1975-12-31
FR2138832B1 (enExample) 1974-12-27
MY7500237A (en) 1975-12-31
DE2264613A1 (de) 1974-05-30
US3784726A (en) 1974-01-08

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